NL7400462A - - Google Patents

Info

Publication number
NL7400462A
NL7400462A NL7400462A NL7400462A NL7400462A NL 7400462 A NL7400462 A NL 7400462A NL 7400462 A NL7400462 A NL 7400462A NL 7400462 A NL7400462 A NL 7400462A NL 7400462 A NL7400462 A NL 7400462A
Authority
NL
Netherlands
Application number
NL7400462A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7400462A publication Critical patent/NL7400462A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Weting (AREA)
NL7400462A 1973-01-12 1974-01-14 NL7400462A (cs)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48005979A JPS4995592A (cs) 1973-01-12 1973-01-12

Publications (1)

Publication Number Publication Date
NL7400462A true NL7400462A (cs) 1974-07-16

Family

ID=11625937

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7400462A NL7400462A (cs) 1973-01-12 1974-01-14

Country Status (4)

Country Link
US (1) US3855112A (cs)
JP (1) JPS4995592A (cs)
DE (1) DE2358495A1 (cs)
NL (1) NL7400462A (cs)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5722885B2 (cs) * 1974-02-18 1982-05-15
US3941630A (en) * 1974-04-29 1976-03-02 Rca Corporation Method of fabricating a charged couple radiation sensing device
US3971710A (en) * 1974-11-29 1976-07-27 Ibm Anodized articles and process of preparing same
US4022930A (en) * 1975-05-30 1977-05-10 Bell Telephone Laboratories, Incorporated Multilevel metallization for integrated circuits
US4008111A (en) * 1975-12-31 1977-02-15 International Business Machines Corporation AlN masking for selective etching of sapphire
US4433004A (en) * 1979-07-11 1984-02-21 Tokyo Shibaura Denki Kabushiki Kaisha Semiconductor device and a method for manufacturing the same
JPS59178681A (ja) * 1983-03-30 1984-10-09 Fujitsu Ltd パタ−ン形成方法
US5116674A (en) * 1989-01-27 1992-05-26 Ciba-Geigy Corporation Composite structure
US5084131A (en) * 1990-01-11 1992-01-28 Matsushita Electric Industrial Co., Ltd. Fabrication method for thin film electroluminescent panels
US5485019A (en) 1992-02-05 1996-01-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for forming the same
US6624477B1 (en) 1992-10-09 2003-09-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
TW232751B (en) * 1992-10-09 1994-10-21 Semiconductor Energy Res Co Ltd Semiconductor device and method for forming the same
JPH0730125A (ja) 1993-07-07 1995-01-31 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP2817590B2 (ja) * 1993-09-24 1998-10-30 信越半導体株式会社 発光素子の製造方法
US20150140340A1 (en) * 2013-11-21 2015-05-21 Nano And Advanced Materials Institute Limited Thermal resistant mirror-like coating

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3304595A (en) * 1962-11-26 1967-02-21 Nippon Electric Co Method of making a conductive connection to a semiconductor device electrode
US3566457A (en) * 1968-05-01 1971-03-02 Gen Electric Buried metallic film devices and method of making the same
US3634203A (en) * 1969-07-22 1972-01-11 Texas Instruments Inc Thin film metallization processes for microcircuits
US3579815A (en) * 1969-08-20 1971-05-25 Gen Electric Process for wafer fabrication of high blocking voltage silicon elements
US3741880A (en) * 1969-10-25 1973-06-26 Nippon Electric Co Method of forming electrical connections in a semiconductor integrated circuit

Also Published As

Publication number Publication date
US3855112A (en) 1974-12-17
JPS4995592A (cs) 1974-09-10
DE2358495A1 (de) 1974-07-18

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