NL7310947A - - Google Patents

Info

Publication number
NL7310947A
NL7310947A NL7310947A NL7310947A NL7310947A NL 7310947 A NL7310947 A NL 7310947A NL 7310947 A NL7310947 A NL 7310947A NL 7310947 A NL7310947 A NL 7310947A NL 7310947 A NL7310947 A NL 7310947A
Authority
NL
Netherlands
Application number
NL7310947A
Other versions
NL161619C (nl
NL161619B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7310947A publication Critical patent/NL7310947A/xx
Publication of NL161619B publication Critical patent/NL161619B/xx
Application granted granted Critical
Publication of NL161619C publication Critical patent/NL161619C/xx

Links

Classifications

    • H10P72/74—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H10P72/7402—
    • H10P95/00—
    • H10W74/131—
    • H10P72/7412—
    • H10P72/7416—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
NL7310947.A 1972-08-09 1973-08-08 Werkwijze voor het vervaardigen van een half- geleiderinrichting. NL161619C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7911772A JPS5218069B2 (cg-RX-API-DMAC10.html) 1972-08-09 1972-08-09

Publications (3)

Publication Number Publication Date
NL7310947A true NL7310947A (cg-RX-API-DMAC10.html) 1974-02-12
NL161619B NL161619B (nl) 1979-09-17
NL161619C NL161619C (nl) 1980-02-15

Family

ID=13680958

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7310947.A NL161619C (nl) 1972-08-09 1973-08-08 Werkwijze voor het vervaardigen van een half- geleiderinrichting.

Country Status (5)

Country Link
US (1) US3913217A (cg-RX-API-DMAC10.html)
JP (1) JPS5218069B2 (cg-RX-API-DMAC10.html)
DE (1) DE2340142C3 (cg-RX-API-DMAC10.html)
GB (1) GB1400313A (cg-RX-API-DMAC10.html)
NL (1) NL161619C (cg-RX-API-DMAC10.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969813A (en) * 1975-08-15 1976-07-20 Bell Telephone Laboratories, Incorporated Method and apparatus for removal of semiconductor chips from hybrid circuits
FR2469000A1 (fr) * 1979-10-30 1981-05-08 Silicium Semiconducteur Ssc Structure de thyristor tres haute tension glassive et son procede de fabrication
US4571093A (en) * 1983-11-04 1986-02-18 Burroughs Corporation Method of testing plastic-packaged semiconductor devices
GB2174539B (en) * 1985-04-30 1988-12-29 Marconi Electronic Devices Semiconductor devices
DE3524301A1 (de) * 1985-07-06 1987-01-15 Semikron Gleichrichterbau Verfahren zum herstellen von halbleiterelementen
US4904610A (en) * 1988-01-27 1990-02-27 General Instrument Corporation Wafer level process for fabricating passivated semiconductor devices
US5000811A (en) * 1989-11-22 1991-03-19 Xerox Corporation Precision buttable subunits via dicing
US5213590A (en) * 1989-12-20 1993-05-25 Neff Charles E Article and a method for producing an article having a high friction surface
US5236871A (en) * 1992-04-29 1993-08-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing a hybridization of detector array and integrated circuit for readout
US6465743B1 (en) * 1994-12-05 2002-10-15 Motorola, Inc. Multi-strand substrate for ball-grid array assemblies and method
US5776798A (en) * 1996-09-04 1998-07-07 Motorola, Inc. Semiconductor package and method thereof
JP2005517753A (ja) * 2002-02-13 2005-06-16 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ ポリマー箔の製造方法
US8092734B2 (en) * 2004-05-13 2012-01-10 Aptina Imaging Corporation Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
US7968379B2 (en) * 2006-03-09 2011-06-28 SemiLEDs Optoelectronics Co., Ltd. Method of separating semiconductor dies
US7452739B2 (en) * 2006-03-09 2008-11-18 Semi-Photonics Co., Ltd. Method of separating semiconductor dies
CN111999632B (zh) * 2019-05-27 2023-02-03 合肥晶合集成电路股份有限公司 Pn结样品的获取方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3416224A (en) * 1966-03-08 1968-12-17 Ibm Integrated semiconductor devices and fabrication methods therefor
US3432919A (en) * 1966-10-31 1969-03-18 Raytheon Co Method of making semiconductor diodes
US3508980A (en) * 1967-07-26 1970-04-28 Motorola Inc Method of fabricating an integrated circuit structure with dielectric isolation
US3681139A (en) * 1969-10-16 1972-08-01 Western Electric Co Method for handling and maintaining the orientation of a matrix of miniature electrical devices
US3608186A (en) * 1969-10-30 1971-09-28 Jearld L Hutson Semiconductor device manufacture with junction passivation
US3771219A (en) * 1970-02-05 1973-11-13 Sharp Kk Method for manufacturing semiconductor device
US3768150A (en) * 1970-02-13 1973-10-30 B Sloan Integrated circuit process utilizing orientation dependent silicon etch
US3720997A (en) * 1971-01-11 1973-03-20 Motorola Inc Eutectic plating and breaking silicon wafers

Also Published As

Publication number Publication date
GB1400313A (en) 1975-07-16
US3913217A (en) 1975-10-21
JPS4937577A (cg-RX-API-DMAC10.html) 1974-04-08
DE2340142B2 (de) 1977-07-28
JPS5218069B2 (cg-RX-API-DMAC10.html) 1977-05-19
DE2340142A1 (de) 1974-03-07
NL161619C (nl) 1980-02-15
DE2340142C3 (de) 1978-03-16
NL161619B (nl) 1979-09-17

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Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee
NL80 Information provided on patent owner name for an already discontinued patent

Owner name: HITACHI