NL7304070A - - Google Patents
Info
- Publication number
- NL7304070A NL7304070A NL7304070A NL7304070A NL7304070A NL 7304070 A NL7304070 A NL 7304070A NL 7304070 A NL7304070 A NL 7304070A NL 7304070 A NL7304070 A NL 7304070A NL 7304070 A NL7304070 A NL 7304070A
- Authority
- NL
- Netherlands
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7304070A NL7304070A (ja) | 1973-03-23 | 1973-03-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7304070A NL7304070A (ja) | 1973-03-23 | 1973-03-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7304070A true NL7304070A (ja) | 1974-09-25 |
Family
ID=19818489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7304070A NL7304070A (ja) | 1973-03-23 | 1973-03-23 |
Country Status (1)
Country | Link |
---|---|
NL (1) | NL7304070A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0417644A2 (en) * | 1989-09-07 | 1991-03-20 | Tokyo Seimitsu Co.,Ltd. | Method of slicing cylindrical material into wafers |
-
1973
- 1973-03-23 NL NL7304070A patent/NL7304070A/xx unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0417644A2 (en) * | 1989-09-07 | 1991-03-20 | Tokyo Seimitsu Co.,Ltd. | Method of slicing cylindrical material into wafers |
EP0417644A3 (en) * | 1989-09-07 | 1992-05-27 | Tokyo Seimitsu Co.,Ltd. | Method of slicing cylindrical material into wafers |