Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D99/00—Subject matter not provided for in other groups of this subclass
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P10/00—Bonding of wafers, substrates or parts of devices
  • H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates

Applications Claiming Priority (4)

Publications (1)

Family

ID=27461315

Family Applications (1)

Country Status (6)

• 1972
  • 1972-06-06 NL NL7207671A patent/NL7207671A/xx unknown
  • 1972-06-09 CA CA144,299A patent/CA968886A/en not_active Expired
  • 1972-06-13 IT IT50850/72A patent/IT958342B/it active
  • 1972-06-14 FR FR7221408A patent/FR2141917B1/fr not_active Expired
  • 1972-06-14 DE DE2229450A patent/DE2229450C3/de not_active Expired
  • 1972-06-15 GB GB2800572A patent/GB1395871A/en not_active Expired

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