NL7106298A - - Google Patents

Info

Publication number
NL7106298A
NL7106298A NL7106298A NL7106298A NL7106298A NL 7106298 A NL7106298 A NL 7106298A NL 7106298 A NL7106298 A NL 7106298A NL 7106298 A NL7106298 A NL 7106298A NL 7106298 A NL7106298 A NL 7106298A
Authority
NL
Netherlands
Application number
NL7106298A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7106298A publication Critical patent/NL7106298A/xx

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
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    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
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    • H01L2224/732—Location after the connecting process
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
NL7106298A 1970-05-09 1971-05-07 NL7106298A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702022717 DE2022717A1 (de) 1970-05-09 1970-05-09 Halbleiterbauelement

Publications (1)

Publication Number Publication Date
NL7106298A true NL7106298A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1971-11-11

Family

ID=5770671

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7106298A NL7106298A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1970-05-09 1971-05-07

Country Status (7)

Country Link
US (1) US3720999A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS4914786B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2022717A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2088459B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1348521A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT982341B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL (1) NL7106298A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5245176Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-09-19 1977-10-14
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
DE3513530A1 (de) * 1984-06-01 1985-12-05 Bbc Brown Boveri & Cie Verfahren zur herstellung von leistungshalbleitermodulen mit isoliertem aufbau
US4674166A (en) * 1984-12-18 1987-06-23 At&T Technologies, Inc. Spring clip transfer apparatus
US4689866A (en) * 1984-12-18 1987-09-01 American Telephone And Telegraph Company, At&T Technologies, Inc. Methods for transferring spring clips
US4582245A (en) * 1984-12-18 1986-04-15 At&T Technologies, Inc. Method and apparatus for automated spring clip insertion and removal
US4948375A (en) * 1987-08-25 1990-08-14 Howard Lawrence Adaptor assembly for circuit boards
US20210398936A1 (en) * 2020-06-23 2021-12-23 Amkor Technology Singapore Holding Pte. Ltd. Laser bonded devices, laser bonding tools, and related methods

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2371754A (en) * 1942-04-22 1945-03-20 North American Aviation Inc Stiffened material
US2666874A (en) * 1950-08-25 1954-01-19 Rca Corp Construction of semiconductor devices
GB818464A (en) * 1956-03-12 1959-08-19 Gen Electric Co Ltd Improvements in or relating to semiconductor devices
US3065525A (en) * 1957-09-13 1962-11-27 Sylvania Electric Prod Method and device for making connections in transistors
US3005257A (en) * 1958-08-28 1961-10-24 Bell Telephone Labor Inc Fabrication of semiconductor devices
US3161811A (en) * 1960-02-15 1964-12-15 Clevite Corp Semiconductor device mount
US3209450A (en) * 1962-07-03 1965-10-05 Bell Telephone Labor Inc Method of fabricating semiconductor contacts
US3267409A (en) * 1963-12-30 1966-08-16 Gen Instrument Corp Terminal for electronic component
US3390450A (en) * 1966-06-09 1968-07-02 Rca Corp Method of fabricating semiconductor devices

Also Published As

Publication number Publication date
IT982341B (it) 1974-10-21
US3720999A (en) 1973-03-20
GB1348521A (en) 1974-03-20
DE2022717A1 (de) 1971-12-02
JPS4914786B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-04-10
FR2088459B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-03-08
FR2088459A2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-01-07

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