NL7007510A - - Google Patents

Info

Publication number
NL7007510A
NL7007510A NL7007510A NL7007510A NL7007510A NL 7007510 A NL7007510 A NL 7007510A NL 7007510 A NL7007510 A NL 7007510A NL 7007510 A NL7007510 A NL 7007510A NL 7007510 A NL7007510 A NL 7007510A
Authority
NL
Netherlands
Application number
NL7007510A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US39503A priority Critical patent/US3649308A/en
Priority claimed from NL7007511A external-priority patent/NL7007511A/xx
Priority to NL7007510A priority patent/NL7007510A/xx
Application filed filed Critical
Priority to FR7019372A priority patent/FR2088202B1/fr
Priority to NL717105020A priority patent/NL144667B/en
Priority to FR7117546A priority patent/FR2091636A5/fr
Priority to DE19712124330 priority patent/DE2124330B2/en
Priority to DE2124331A priority patent/DE2124331C3/en
Priority to SE06452/71A priority patent/SE366069B/xx
Priority to GB1643771A priority patent/GB1324895A/en
Priority to GB1643571A priority patent/GB1324827A/en
Publication of NL7007510A publication Critical patent/NL7007510A/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48Coating with alloys
    • C23C18/50Coating with alloys with alloys based on iron, cobalt or nickel
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
NL7007510A 1970-05-21 1970-05-25 NL7007510A (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
US39503A US3649308A (en) 1970-05-21 1970-05-21 Stabilized electroless plating solutions
NL7007510A NL7007510A (en) 1970-05-21 1970-05-25
FR7019372A FR2088202B1 (en) 1970-05-21 1970-05-27
NL717105020A NL144667B (en) 1970-05-21 1971-04-15 PROCESS FOR THE PREPARATION OF Aqueous SOLUTIONS FOR CURRENTLESS COVERING WITH METAL.
FR7117546A FR2091636A5 (en) 1970-05-21 1971-05-14
DE19712124330 DE2124330B2 (en) 1970-05-21 1971-05-17 Aqueous solution for electroless separation of metals
DE2124331A DE2124331C3 (en) 1970-05-21 1971-05-17 Aqueous solution for the electroless deposition of copper
SE06452/71A SE366069B (en) 1970-05-21 1971-05-18
GB1643771A GB1324895A (en) 1970-05-21 1971-05-21 Stabilized electroless copper plating solutions
GB1643571A GB1324827A (en) 1970-05-21 1971-05-21 Stabilized electroless nickel and or cobalt plating solutions

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US3950370A 1970-05-21 1970-05-21
NL7007510A NL7007510A (en) 1970-05-21 1970-05-25
NL7007511A NL7007511A (en) 1970-05-25 1970-05-25
FR7019372A FR2088202B1 (en) 1970-05-21 1970-05-27

Publications (1)

Publication Number Publication Date
NL7007510A true NL7007510A (en) 1971-11-29

Family

ID=27446064

Family Applications (2)

Application Number Title Priority Date Filing Date
NL7007510A NL7007510A (en) 1970-05-21 1970-05-25
NL717105020A NL144667B (en) 1970-05-21 1971-04-15 PROCESS FOR THE PREPARATION OF Aqueous SOLUTIONS FOR CURRENTLESS COVERING WITH METAL.

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL717105020A NL144667B (en) 1970-05-21 1971-04-15 PROCESS FOR THE PREPARATION OF Aqueous SOLUTIONS FOR CURRENTLESS COVERING WITH METAL.

Country Status (6)

Country Link
US (1) US3649308A (en)
DE (2) DE2124331C3 (en)
FR (2) FR2088202B1 (en)
GB (2) GB1324895A (en)
NL (2) NL7007510A (en)
SE (1) SE366069B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4005229A (en) * 1975-06-23 1977-01-25 Ppg Industries, Inc. Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures
US4167601A (en) * 1976-11-15 1979-09-11 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4228213A (en) * 1979-08-13 1980-10-14 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
DE3622090C1 (en) * 1986-07-02 1990-02-15 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
EP2639335B1 (en) * 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkaline plating bath for electroless deposition of cobalt alloys
EP2671969A1 (en) * 2012-06-04 2013-12-11 ATOTECH Deutschland GmbH Plating bath for electroless deposition of nickel layers
CN103820773A (en) * 2014-03-11 2014-05-28 上海贺鸿电子有限公司 Solution used for laser antenna LDS plated copper and use method of solution
TWI707061B (en) * 2015-11-27 2020-10-11 德商德國艾托特克公司 Plating bath composition and method for electroless plating of palladium
US10060034B2 (en) 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
RU2671988C1 (en) * 2017-10-02 2018-11-08 Акционерное общество "Научно-исследовательский институт Приборостроения имени В.В. Тихомирова" Application process of drawing copper coating on polyetheretherketone

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1254935B (en) * 1960-12-31 1967-11-23 Bayer Ag Aqueous bath for chemical deposition of boron-containing metal coatings
DE1621352C3 (en) * 1967-02-03 1975-05-28 Schering Ag, 1000 Berlin Und 4619 Bergkamen Stabilized alkaline copper bath for the electroless deposition of copper

Also Published As

Publication number Publication date
FR2088202B1 (en) 1975-01-10
FR2091636A5 (en) 1972-01-14
NL144667B (en) 1975-01-15
DE2124331A1 (en) 1971-12-02
NL7105020A (en) 1971-11-23
US3649308A (en) 1972-03-14
DE2124330A1 (en) 1971-12-02
GB1324827A (en) 1973-07-25
DE2124331B2 (en) 1976-05-20
DE2124331C3 (en) 1982-11-11
SE366069B (en) 1974-04-08
FR2088202A1 (en) 1972-01-07
GB1324895A (en) 1973-07-25
DE2124330B2 (en) 1976-05-20

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