NL6905500A - - Google Patents
Info
- Publication number
- NL6905500A NL6905500A NL6905500A NL6905500A NL6905500A NL 6905500 A NL6905500 A NL 6905500A NL 6905500 A NL6905500 A NL 6905500A NL 6905500 A NL6905500 A NL 6905500A NL 6905500 A NL6905500 A NL 6905500A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/06—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using single-aperture storage elements, e.g. ring core; using multi-aperture plates in which each individual aperture forms a storage element
- G11C11/06085—Multi-aperture structures or multi-magnetic closed circuits, each aperture storing a "bit", realised by rods, plates, grids, waffle-irons,(i.e. grooved plates) or similar devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1366—Spraying coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacture Of Switches (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6905500A NL6905500A (xx) | 1969-04-10 | 1969-04-10 | |
US25369A US3634168A (en) | 1969-04-10 | 1970-04-03 | Method of providing a printed circuit on a coherent memory plate having store and switching elements |
DE19702016064 DE2016064A1 (de) | 1969-04-10 | 1970-04-03 | Verfahren zum Anbringen einer gedruckten Verdrahtung auf einer zusammenhängenden Speicherplatte mit Speicher- und Schaltelementen |
GB16341/70A GB1260267A (en) | 1969-04-10 | 1970-04-07 | Method of providing a printed circuit on a coherent memory plate having store and switching elements |
JP45029701A JPS50418B1 (xx) | 1969-04-10 | 1970-04-08 | |
FR7012980A FR2043166A5 (xx) | 1969-04-10 | 1970-04-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6905500A NL6905500A (xx) | 1969-04-10 | 1969-04-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL6905500A true NL6905500A (xx) | 1970-10-13 |
Family
ID=19806650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL6905500A NL6905500A (xx) | 1969-04-10 | 1969-04-10 |
Country Status (6)
Country | Link |
---|---|
US (1) | US3634168A (xx) |
JP (1) | JPS50418B1 (xx) |
DE (1) | DE2016064A1 (xx) |
FR (1) | FR2043166A5 (xx) |
GB (1) | GB1260267A (xx) |
NL (1) | NL6905500A (xx) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE29820E (en) * | 1971-08-30 | 1978-10-31 | Perstorp, Ab | Method for the production of material for printed circuits |
BE788117A (fr) * | 1971-08-30 | 1973-02-28 | Perstorp Ab | Procede de production d'elements pour circuits imprimes |
JP3682366B2 (ja) | 1997-12-26 | 2005-08-10 | 古河電気工業株式会社 | ワイヤハーネス及びその製造方法 |
TW569424B (en) * | 2000-03-17 | 2004-01-01 | Matsushita Electric Ind Co Ltd | Module with embedded electric elements and the manufacturing method thereof |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL282685A (xx) * | 1961-08-31 | |||
NL6610902A (xx) * | 1966-08-03 | 1968-02-05 |
-
1969
- 1969-04-10 NL NL6905500A patent/NL6905500A/xx unknown
-
1970
- 1970-04-03 DE DE19702016064 patent/DE2016064A1/de active Pending
- 1970-04-03 US US25369A patent/US3634168A/en not_active Expired - Lifetime
- 1970-04-07 GB GB16341/70A patent/GB1260267A/en not_active Expired
- 1970-04-08 JP JP45029701A patent/JPS50418B1/ja active Pending
- 1970-04-10 FR FR7012980A patent/FR2043166A5/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS50418B1 (xx) | 1975-01-09 |
GB1260267A (en) | 1972-01-12 |
FR2043166A5 (xx) | 1971-02-12 |
US3634168A (en) | 1972-01-11 |
DE2016064A1 (de) | 1970-10-22 |