NL6905500A - - Google Patents

Info

Publication number
NL6905500A
NL6905500A NL6905500A NL6905500A NL6905500A NL 6905500 A NL6905500 A NL 6905500A NL 6905500 A NL6905500 A NL 6905500A NL 6905500 A NL6905500 A NL 6905500A NL 6905500 A NL6905500 A NL 6905500A
Authority
NL
Netherlands
Application number
NL6905500A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6905500A priority Critical patent/NL6905500A/xx
Priority to US25369A priority patent/US3634168A/en
Priority to DE19702016064 priority patent/DE2016064A1/de
Priority to GB16341/70A priority patent/GB1260267A/en
Priority to JP45029701A priority patent/JPS50418B1/ja
Priority to FR7012980A priority patent/FR2043166A5/fr
Publication of NL6905500A publication Critical patent/NL6905500A/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/44Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/06Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using single-aperture storage elements, e.g. ring core; using multi-aperture plates in which each individual aperture forms a storage element
    • G11C11/06085Multi-aperture structures or multi-magnetic closed circuits, each aperture storing a "bit", realised by rods, plates, grids, waffle-irons,(i.e. grooved plates) or similar devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0195Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333Deposition techniques, e.g. coating
    • H05K2203/1366Spraying coating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0023Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/425Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacture Of Switches (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
NL6905500A 1969-04-10 1969-04-10 NL6905500A (xx)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL6905500A NL6905500A (xx) 1969-04-10 1969-04-10
US25369A US3634168A (en) 1969-04-10 1970-04-03 Method of providing a printed circuit on a coherent memory plate having store and switching elements
DE19702016064 DE2016064A1 (de) 1969-04-10 1970-04-03 Verfahren zum Anbringen einer gedruckten Verdrahtung auf einer zusammenhängenden Speicherplatte mit Speicher- und Schaltelementen
GB16341/70A GB1260267A (en) 1969-04-10 1970-04-07 Method of providing a printed circuit on a coherent memory plate having store and switching elements
JP45029701A JPS50418B1 (xx) 1969-04-10 1970-04-08
FR7012980A FR2043166A5 (xx) 1969-04-10 1970-04-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6905500A NL6905500A (xx) 1969-04-10 1969-04-10

Publications (1)

Publication Number Publication Date
NL6905500A true NL6905500A (xx) 1970-10-13

Family

ID=19806650

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6905500A NL6905500A (xx) 1969-04-10 1969-04-10

Country Status (6)

Country Link
US (1) US3634168A (xx)
JP (1) JPS50418B1 (xx)
DE (1) DE2016064A1 (xx)
FR (1) FR2043166A5 (xx)
GB (1) GB1260267A (xx)
NL (1) NL6905500A (xx)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE29820E (en) * 1971-08-30 1978-10-31 Perstorp, Ab Method for the production of material for printed circuits
BE788117A (fr) * 1971-08-30 1973-02-28 Perstorp Ab Procede de production d'elements pour circuits imprimes
JP3682366B2 (ja) 1997-12-26 2005-08-10 古河電気工業株式会社 ワイヤハーネス及びその製造方法
TW569424B (en) * 2000-03-17 2004-01-01 Matsushita Electric Ind Co Ltd Module with embedded electric elements and the manufacturing method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL282685A (xx) * 1961-08-31
NL6610902A (xx) * 1966-08-03 1968-02-05

Also Published As

Publication number Publication date
JPS50418B1 (xx) 1975-01-09
GB1260267A (en) 1972-01-12
FR2043166A5 (xx) 1971-02-12
US3634168A (en) 1972-01-11
DE2016064A1 (de) 1970-10-22

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