NL6900088A - - Google Patents

Info

Publication number
NL6900088A
NL6900088A NL6900088A NL6900088A NL6900088A NL 6900088 A NL6900088 A NL 6900088A NL 6900088 A NL6900088 A NL 6900088A NL 6900088 A NL6900088 A NL 6900088A NL 6900088 A NL6900088 A NL 6900088A
Authority
NL
Netherlands
Application number
NL6900088A
Other versions
NL139095B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6900088A publication Critical patent/NL6900088A/xx
Publication of NL139095B publication Critical patent/NL139095B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
NL696900088A 1968-01-05 1969-01-03 Werkwijze voor het verkoperen zonder stroomtoevoer. NL139095B (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69586068A 1968-01-05 1968-01-05

Publications (2)

Publication Number Publication Date
NL6900088A true NL6900088A (enrdf_load_html_response) 1969-07-08
NL139095B NL139095B (nl) 1973-06-15

Family

ID=24794740

Family Applications (1)

Application Number Title Priority Date Filing Date
NL696900088A NL139095B (nl) 1968-01-05 1969-01-03 Werkwijze voor het verkoperen zonder stroomtoevoer.

Country Status (7)

Country Link
US (1) US3475186A (enrdf_load_html_response)
BE (1) BE726182A (enrdf_load_html_response)
DE (1) DE1900442B2 (enrdf_load_html_response)
FR (1) FR1599501A (enrdf_load_html_response)
GB (1) GB1195330A (enrdf_load_html_response)
NL (1) NL139095B (enrdf_load_html_response)
SE (1) SE345144B (enrdf_load_html_response)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615735A (en) * 1968-08-13 1971-10-26 Shipley Co Electroless copper plating
US3765936A (en) * 1968-08-13 1973-10-16 Shipley Co Electroless copper plate
US3615733A (en) * 1968-08-13 1971-10-26 Shipley Co Electroless copper plating
US3978252A (en) * 1973-03-23 1976-08-31 Macdermid Incorporated Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon
US4167601A (en) * 1976-11-15 1979-09-11 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4228213A (en) * 1979-08-13 1980-10-14 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
DE3473890D1 (en) * 1983-07-25 1988-10-13 Hitachi Ltd Electroless copper plating solution
US4969842A (en) * 1989-11-30 1990-11-13 Amp Incorporated Molded electrical connector having integral spring contact beams
US20090206526A1 (en) 2008-02-18 2009-08-20 Huntsman Petrochemical Corporation Sintering aids

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
GB1089317A (en) * 1965-06-19 1967-11-01 Asahi Dow Ltd An electroless copper plating bath

Also Published As

Publication number Publication date
GB1195330A (en) 1970-06-17
DE1900442A1 (de) 1969-11-20
BE726182A (enrdf_load_html_response) 1969-06-27
DE1900442B2 (de) 1971-09-09
NL139095B (nl) 1973-06-15
US3475186A (en) 1969-10-28
SE345144B (enrdf_load_html_response) 1972-05-15
FR1599501A (enrdf_load_html_response) 1970-07-15

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