NL6817108A - - Google Patents

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Publication number
NL6817108A
NL6817108A NL6817108A NL6817108A NL6817108A NL 6817108 A NL6817108 A NL 6817108A NL 6817108 A NL6817108 A NL 6817108A NL 6817108 A NL6817108 A NL 6817108A NL 6817108 A NL6817108 A NL 6817108A
Authority
NL
Netherlands
Application number
NL6817108A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6817108A publication Critical patent/NL6817108A/xx

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    • H—ELECTRICITY
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    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
NL6817108A 1967-12-01 1968-11-29 NL6817108A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68727867A 1967-12-01 1967-12-01

Publications (1)

Publication Number Publication Date
NL6817108A true NL6817108A (enrdf_load_stackoverflow) 1969-06-03

Family

ID=24759796

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6817108A NL6817108A (enrdf_load_stackoverflow) 1967-12-01 1968-11-29

Country Status (4)

Country Link
DE (1) DE1812157A1 (enrdf_load_stackoverflow)
FR (1) FR1593872A (enrdf_load_stackoverflow)
GB (1) GB1255334A (enrdf_load_stackoverflow)
NL (1) NL6817108A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3919602A (en) * 1972-03-23 1975-11-11 Bosch Gmbh Robert Electric circuit arrangement and method of making the same

Also Published As

Publication number Publication date
DE1812157A1 (de) 1969-07-17
GB1255334A (en) 1971-12-01
FR1593872A (enrdf_load_stackoverflow) 1970-06-01

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