NL6605983A - - Google Patents

Info

Publication number
NL6605983A
NL6605983A NL6605983A NL6605983A NL6605983A NL 6605983 A NL6605983 A NL 6605983A NL 6605983 A NL6605983 A NL 6605983A NL 6605983 A NL6605983 A NL 6605983A NL 6605983 A NL6605983 A NL 6605983A
Authority
NL
Netherlands
Application number
NL6605983A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6605983A publication Critical patent/NL6605983A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/06—Feeding of the material to be moulded, e.g. into a mould cavity in measured doses, e.g. by weighting
    • B29C31/065—Feeding of the material to be moulded, e.g. into a mould cavity in measured doses, e.g. by weighting using volumetric measuring chambers moving between a charging station and a discharge station
    • B29C31/066—Feeding of the material to be moulded, e.g. into a mould cavity in measured doses, e.g. by weighting using volumetric measuring chambers moving between a charging station and a discharge station using feed frames, e.g. for dry material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
    • B29C53/16—Straightening or flattening
    • B29C53/18—Straightening or flattening of plates or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0037—Other properties
    • B29K2995/0049—Heat shrinkable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0125—Shrinkable, e.g. heat-shrinkable polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Robotics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
NL6605983A 1965-05-11 1966-05-03 NL6605983A (US08063081-20111122-C00044.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US45489665 US3396894A (en) 1965-05-11 1965-05-11 Solder device

Publications (1)

Publication Number Publication Date
NL6605983A true NL6605983A (US08063081-20111122-C00044.png) 1966-11-14

Family

ID=23806509

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6605983A NL6605983A (US08063081-20111122-C00044.png) 1965-05-11 1966-05-03

Country Status (7)

Country Link
US (1) US3396894A (US08063081-20111122-C00044.png)
BE (1) BE680884A (US08063081-20111122-C00044.png)
CH (1) CH466005A (US08063081-20111122-C00044.png)
DE (1) DE1552962B2 (US08063081-20111122-C00044.png)
GB (1) GB1099650A (US08063081-20111122-C00044.png)
NL (1) NL6605983A (US08063081-20111122-C00044.png)
SE (1) SE323996B (US08063081-20111122-C00044.png)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3451609A (en) * 1967-08-24 1969-06-24 Us Air Force Heat shrinkable plastic soldering sleeve
US3710196A (en) * 1970-04-27 1973-01-09 T Fifield Circuit board and method of making circuit connections
JPS4947875A (US08063081-20111122-C00044.png) * 1972-07-16 1974-05-09
US3932934A (en) * 1974-09-16 1976-01-20 Amp Incorporated Method of connecting terminal posts of a connector to a circuit board
US3912153A (en) * 1974-11-18 1975-10-14 Gen Motors Corp Method and apparatus for bonding semiconductor pill-type components to a circuit board
US4209893A (en) * 1978-10-24 1980-07-01 The Bendix Corporation Solder pack and method of manufacture thereof
US4216350A (en) * 1978-11-01 1980-08-05 Burroughs Corporation Multiple solder pre-form with non-fusible web
US4354629A (en) * 1980-06-09 1982-10-19 Raychem Corporation Solder delivery system
US4349404A (en) * 1980-07-28 1982-09-14 Raychem Corporation Polymeric articles
US4345957A (en) * 1980-07-28 1982-08-24 Raychem Corporation Polymeric articles
US4376798A (en) * 1980-07-28 1983-03-15 Raychem Corporation Mass connector device
US4342800A (en) * 1980-07-28 1982-08-03 Raychem Corporation Polymeric articles
US4413028A (en) * 1980-07-28 1983-11-01 Raychem Corporation Mass connector device
US4366201A (en) * 1980-07-28 1982-12-28 Raychem Corporation Heat shrinkable wraparound closures
US4688713A (en) * 1981-10-05 1987-08-25 Raychem Corporation Soldering methods and devices
US4667869A (en) * 1981-10-05 1987-05-26 Raychem Corporation Soldering methods and devices
US4505421A (en) * 1981-10-05 1985-03-19 Raychem Corporation Soldering methods and devices
US4809901A (en) * 1981-10-05 1989-03-07 Raychem Corporation Soldering methods and devices
US4496094A (en) * 1981-12-08 1985-01-29 Raychem Corporation Paddlecard terminator
EP0081389B1 (en) * 1981-12-08 1986-09-03 RAYCHEM CORPORATION (a California corporation) Device for connecting electrical conductors
US4634213A (en) * 1983-04-11 1987-01-06 Raychem Corporation Connectors for power distribution cables
US4704305A (en) * 1984-03-06 1987-11-03 Northern Telecom Limited Automatic solder paste application to circuit boards
US4796560A (en) * 1984-03-06 1989-01-10 Northern Telecom Limited Automatic solder paste application to circuit boards
CA1217254A (en) * 1984-04-27 1987-01-27 Raychem Corporation Heat activatable sealing piston
US4884335A (en) * 1985-06-21 1989-12-05 Minnesota Mining And Manufacturing Company Surface mount compatible connector system with solder strip and mounting connector to PCB
US4663815A (en) * 1985-06-21 1987-05-12 Associated Enterprises, Inc. A method and apparatus for surface mount compatible connector system with mechanical integrity
US4712721A (en) * 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
US4774760A (en) * 1986-05-05 1988-10-04 International Business Machines Corporation Method of making a multipad solder preform
US4842184A (en) * 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US5059756A (en) * 1988-11-29 1991-10-22 Amp Incorporated Self regulating temperature heater with thermally conductive extensions
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
US5040717A (en) * 1990-03-27 1991-08-20 Metcal, Inc. Solder delivery system
US5203075A (en) * 1991-08-12 1993-04-20 Inernational Business Machines Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
US5133495A (en) * 1991-08-12 1992-07-28 International Business Machines Corporation Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween
US5184767A (en) * 1991-12-31 1993-02-09 Compaq Computer Corporation Non-wicking solder preform
US5303824A (en) * 1992-12-04 1994-04-19 International Business Machines Corporations Solder preform carrier and use
US5323947A (en) * 1993-05-03 1994-06-28 Motorola, Inc. Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement
US6000603A (en) * 1997-05-23 1999-12-14 3M Innovative Properties Company Patterned array of metal balls and methods of making
US5968633A (en) * 1997-06-06 1999-10-19 The Procter & Gamble Company Selectively-activatible sheet material for dispensing and dispersing a substance onto a target surface
US6099940A (en) * 1997-07-16 2000-08-08 The Procter & Gamble Company Selectively-activatible three-dimensional sheet material having multi-stage progressive activation to deliver a substance to a target surface
US6426564B1 (en) * 1999-02-24 2002-07-30 Micron Technology, Inc. Recessed tape and method for forming a BGA assembly
US6710454B1 (en) * 2000-02-16 2004-03-23 Micron Technology, Inc. Adhesive layer for an electronic apparatus having multiple semiconductor devices
BE1015401A3 (nl) * 2003-03-05 2005-03-01 Daglau N V Inrichting voor het aanbrengen van fixatiemiddel voor het creeren van een vloer-, wand-of plafondbekleding.
IL172146A0 (en) * 2005-11-23 2006-04-10 Cellergy Ltd Thermal barrier for surface mounting
FR2917478B1 (fr) 2007-06-18 2009-11-20 Bodet Aero Reducteur de precision comportant un moyen de rattrapage de jeu
CN105856544A (zh) * 2016-05-27 2016-08-17 广东思沃精密机械有限公司 整平方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL295669A (US08063081-20111122-C00044.png) * 1962-07-23
US3239125A (en) * 1963-12-20 1966-03-08 Raychem Corp Solder ring
US3297819A (en) * 1964-08-10 1967-01-10 Raychem Corp Heat unstable covering
US3301439A (en) * 1965-03-05 1967-01-31 Keuffel & Esser Co Radiation disintegrating capsule

Also Published As

Publication number Publication date
US3396894A (en) 1968-08-13
BE680884A (US08063081-20111122-C00044.png) 1966-11-14
GB1099650A (en) 1968-01-17
DE1552962B2 (de) 1972-01-27
CH466005A (de) 1968-11-30
SE323996B (US08063081-20111122-C00044.png) 1970-05-19
DE1552962A1 (de) 1970-04-16

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