NL6508824A - - Google Patents

Info

Publication number
NL6508824A
NL6508824A NL6508824A NL6508824A NL6508824A NL 6508824 A NL6508824 A NL 6508824A NL 6508824 A NL6508824 A NL 6508824A NL 6508824 A NL6508824 A NL 6508824A NL 6508824 A NL6508824 A NL 6508824A
Authority
NL
Netherlands
Application number
NL6508824A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US381100A external-priority patent/US3334684A/en
Application filed filed Critical
Publication of NL6508824A publication Critical patent/NL6508824A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B5/00—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity
    • F25B5/02—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity arranged in parallel
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D15/00—Devices not covered by group F25D11/00 or F25D13/00, e.g. non-self-contained movable devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
NL6508824A 1964-07-08 1965-07-08 NL6508824A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US381100A US3334684A (en) 1964-07-08 1964-07-08 Cooling system for data processing equipment
US05/701,017 US4120021A (en) 1964-07-08 1976-06-30 Cooling system for electronic assembly

Publications (1)

Publication Number Publication Date
NL6508824A true NL6508824A (pt) 1966-01-10

Family

ID=27624956

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6508824A NL6508824A (pt) 1964-07-08 1965-07-08

Country Status (2)

Country Link
US (1) US4120021A (pt)
NL (1) NL6508824A (pt)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2903685A1 (de) * 1979-01-31 1980-08-14 Siemens Ag Kuehlvorrichtung zur kuehlung von elektrischen bauelementen, insbesondere von integrierten bausteinen
US4298904A (en) * 1979-12-17 1981-11-03 The Boeing Company Electronic conduction cooling clamp
DE3010363C2 (de) * 1980-03-14 1987-02-12 Siemens AG, 1000 Berlin und 8000 München Gerätekombination für den Bergbau mit Bauelementen der Leistungselektronik
US4318157A (en) * 1980-06-06 1982-03-02 Control Data Corporation Apparatus for mounting circuit cards
US4414605A (en) * 1981-06-29 1983-11-08 The United States Of America As Represented By The Secretary Of The Navy Positive locking mechanism
US4466255A (en) * 1982-09-02 1984-08-21 Cray Research, Inc. Cooling system for electronic assembly
US4590538A (en) * 1982-11-18 1986-05-20 Cray Research, Inc. Immersion cooled high density electronic assembly
US4628407A (en) * 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
US4525770A (en) * 1984-04-02 1985-06-25 United Technologies Corporation Clamping circuit board guides
AT384343B (de) * 1985-04-16 1987-10-27 Siemens Ag Oesterreich Gehaeuseanordnung fuer belueftete geraete, vorzugsweise der leistungselektronik
US4777615A (en) * 1986-02-28 1988-10-11 Scientific Computer Systems Corporation Backplane structure for a computer superpositioning scalar and vector operations
US4771366A (en) * 1987-07-06 1988-09-13 International Business Machines Corporation Ceramic card assembly having enhanced power distribution and cooling
JPH0682941B2 (ja) * 1987-10-22 1994-10-19 富士通株式会社 冷却液供給装置
US4884168A (en) * 1988-12-14 1989-11-28 Cray Research, Inc. Cooling plate with interboard connector apertures for circuit board assemblies
US4926287A (en) * 1989-03-23 1990-05-15 The United States Of America As Represented By The Secretary Of The Air Force Spring loaded hand operated extraction/insertion line replaceable module (LRM) lever
AU642940B2 (en) * 1989-12-28 1993-11-04 Alcatel N.V. A cooling system for circuit boards
WO1991010346A1 (en) * 1989-12-28 1991-07-11 Alcatel N.V. Cooling system
US5014904A (en) * 1990-01-16 1991-05-14 Cray Research, Inc. Board-mounted thermal path connector and cold plate
EP0501044B1 (en) * 1991-02-25 1994-10-12 BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap Cooling system
US5159529A (en) * 1991-05-15 1992-10-27 International Business Machines Corporation Composite liquid cooled plate for electronic equipment
US5343359A (en) * 1992-11-19 1994-08-30 Cray Research, Inc. Apparatus for cooling daughter boards
US5471850A (en) * 1993-07-09 1995-12-05 Acurex Corporation Refrigeration system and method for very large scale integrated circuits
US5471367A (en) * 1994-03-15 1995-11-28 Composite Optics, Inc. Composite structure for heat transfer and radiation
US5523640A (en) * 1994-04-22 1996-06-04 Cincinnati Milacron Inc. Liquid cooling for electrical components of a plastics processing machine
US6167947B1 (en) 1998-12-18 2001-01-02 Silicon Graphics, Inc. High performance gas cooling system and method
US6675875B1 (en) 1999-08-06 2004-01-13 The Ohio State University Multi-layered micro-channel heat sink, devices and systems incorporating same
US6457515B1 (en) * 1999-08-06 2002-10-01 The Ohio State University Two-layered micro channel heat sink, devices and systems incorporating same
US6371157B1 (en) * 2000-09-29 2002-04-16 Thales Broadcast & Multimedia, Inc. Method, system and computer program product for self-draining plumbing for liquid-cooled devices
US6611071B2 (en) 2001-08-17 2003-08-26 Siemens Automotive Inc. Embedded electronics for high convection cooling in an engine cooling motor application
US6625023B1 (en) 2002-04-11 2003-09-23 General Dynamics Land Systems, Inc. Modular spray cooling system for electronic components
US6604571B1 (en) 2002-04-11 2003-08-12 General Dynamics Land Systems, Inc. Evaporative cooling of electrical components
US20060144619A1 (en) * 2005-01-06 2006-07-06 Halliburton Energy Services, Inc. Thermal management apparatus, systems, and methods
WO2006110435A2 (en) * 2005-04-07 2006-10-19 Mechanology, Inc. Air mover for improved cooling of electronics
US7295440B2 (en) * 2006-03-07 2007-11-13 Honeywell International, Inc. Integral cold plate/chasses housing applicable to force-cooled power electronics
US7450384B2 (en) * 2006-07-06 2008-11-11 Hybricon Corporation Card cage with parallel flow paths having substantially similar lengths
US7819667B2 (en) * 2007-08-28 2010-10-26 General Dynamics Advanced Information Systems, Inc. System and method for interconnecting circuit boards
US7965002B2 (en) * 2008-10-07 2011-06-21 Caterpillar Inc. Helical conduit enabled for casting inside a housing
TW201334665A (zh) * 2011-11-11 2013-08-16 Vale Sa 掃描器保護機殼及讀取具有由該機殼所保護之掃描器之網柵爐內網柵車之顆粒床高度的系統
US8967903B1 (en) 2012-06-20 2015-03-03 General Micro Systems, Inc. Locking displaceable frame
WO2015102546A1 (en) * 2013-12-31 2015-07-09 Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi A liquid cooled device enclosure
US11632873B1 (en) * 2021-10-11 2023-04-18 Dell Products L.P. Multipurpose chassis front trim piece
US11895805B2 (en) 2022-02-14 2024-02-06 Eagle Technology, Llc Systems and methods for electronics cooling

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334684A (en) * 1964-07-08 1967-08-08 Control Data Corp Cooling system for data processing equipment
US3631325A (en) * 1970-06-15 1971-12-28 Sperry Rand Corp Card module and end wall treatment facilitating heat transfer and sliding
US3648113A (en) * 1970-10-22 1972-03-07 Singer Co Electronic assembly having cooling means for stacked modules
US3865183A (en) * 1973-10-23 1975-02-11 Control Data Corp Cooling systems for electronic modules

Also Published As

Publication number Publication date
US4120021A (en) 1978-10-10

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