NL301740A - - Google Patents
Info
- Publication number
- NL301740A NL301740A NL301740DA NL301740A NL 301740 A NL301740 A NL 301740A NL 301740D A NL301740D A NL 301740DA NL 301740 A NL301740 A NL 301740A
- Authority
- NL
- Netherlands
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J7/00—Micromanipulators
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
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- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85203—Thermocompression bonding
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/01005—Boron [B]
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- H01L2924/01039—Yttrium [Y]
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- H01L2924/01079—Gold [Au]
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- H01L2924/01082—Lead [Pb]
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- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Support Of The Bearing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES83130A DE1225770B (de) | 1963-01-02 | 1963-01-02 | Vorrichtung zum Kontaktieren einer Halbleiteranordnung mittels Thermokompression |
Publications (1)
Publication Number | Publication Date |
---|---|
NL301740A true NL301740A (xx) | 1900-01-01 |
Family
ID=7510805
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL301740D NL301740A (xx) | 1963-01-02 | ||
NL301740A NL142527B (nl) | 1963-01-02 | 1963-12-12 | Inrichting voor het door middel van thermocompressie aanbrengen van een dunne contactdraad op een elektrode van een halfgeleiderinrichting. |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL301740A NL142527B (nl) | 1963-01-02 | 1963-12-12 | Inrichting voor het door middel van thermocompressie aanbrengen van een dunne contactdraad op een elektrode van een halfgeleiderinrichting. |
Country Status (6)
Country | Link |
---|---|
US (1) | US3310216A (xx) |
CH (1) | CH427040A (xx) |
DE (1) | DE1225770B (xx) |
FR (1) | FR1378508A (xx) |
GB (1) | GB995988A (xx) |
NL (2) | NL142527B (xx) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3531852A (en) * | 1968-01-15 | 1970-10-06 | North American Rockwell | Method of forming face-bonding projections |
US3477630A (en) * | 1968-04-26 | 1969-11-11 | Western Electric Co | Apparatus for assembling articles |
US3601890A (en) * | 1969-11-04 | 1971-08-31 | Federal Tool Eng Co | Method of and apparatus for fabricating contacts and assembling them in groups with connector blocks |
US3840978A (en) * | 1969-11-12 | 1974-10-15 | Ibm | Method for positioning and bonding |
US3628717A (en) * | 1969-11-12 | 1971-12-21 | Ibm | Apparatus for positioning and bonding |
DE2114496C3 (de) * | 1971-03-25 | 1981-05-07 | Texas Instruments Deutschland Gmbh, 8050 Freising | Maschine zum Befestigen von Verbindungsdrähten an mehreren Anschlußstellen eines Halbleiterbauelements und an den zugehörigen Anschlußstellen eines das Halbleiterbauelement aufnehmenden Gehäuses |
JPH0340439A (ja) * | 1989-07-07 | 1991-02-21 | Mitsubishi Electric Corp | 半導体装置の組立装置 |
DE3602596A1 (de) * | 1986-01-29 | 1987-07-30 | Telefunken Electronic Gmbh | Zentriervorrichtung zur automatischen bearbeitung von komponenten elektronischer bauelemente |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1165755B (de) * | 1957-09-26 | 1964-03-19 | Philco Corp Eine Ges Nach Den | Verfahren zur Befestigung von Zuleitungen an den Kontaktelektroden von Halbleiterkoerpern und Vorrichtung zur Durchfuehrung des Verfahrens |
US3149510A (en) * | 1960-07-05 | 1964-09-22 | Kulicke & Soffa Mfg Co | Fine wire manipulator and bonding instrument for transistors |
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0
- NL NL301740D patent/NL301740A/xx unknown
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1963
- 1963-01-02 DE DES83130A patent/DE1225770B/de active Pending
- 1963-12-12 NL NL301740A patent/NL142527B/xx unknown
- 1963-12-20 FR FR957950A patent/FR1378508A/fr not_active Expired
- 1963-12-20 GB GB5031963A patent/GB995988A/en not_active Expired
- 1963-12-24 CH CH1590663A patent/CH427040A/de unknown
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1964
- 1964-01-02 US US33532364 patent/US3310216A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US3310216A (en) | 1967-03-21 |
CH427040A (de) | 1966-12-31 |
DE1225770B (de) | 1966-09-29 |
GB995988A (en) | 1965-06-23 |
FR1378508A (fr) | 1964-11-13 |
NL142527B (nl) | 1974-06-17 |