NL294675A - - Google Patents

Info

Publication number
NL294675A
NL294675A NL294675DA NL294675A NL 294675 A NL294675 A NL 294675A NL 294675D A NL294675D A NL 294675DA NL 294675 A NL294675 A NL 294675A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL294675A publication Critical patent/NL294675A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • Y10T29/49224Contact or terminal manufacturing with coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
NL294675D 1962-06-29 NL294675A (US06262066-20010717-C00560.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US206242A US3231421A (en) 1962-06-29 1962-06-29 Semiconductor contact

Publications (1)

Publication Number Publication Date
NL294675A true NL294675A (US06262066-20010717-C00560.png)

Family

ID=22765544

Family Applications (1)

Application Number Title Priority Date Filing Date
NL294675D NL294675A (US06262066-20010717-C00560.png) 1962-06-29

Country Status (5)

Country Link
US (1) US3231421A (US06262066-20010717-C00560.png)
BE (1) BE634311A (US06262066-20010717-C00560.png)
DE (1) DE1236083B (US06262066-20010717-C00560.png)
GB (1) GB1030927A (US06262066-20010717-C00560.png)
NL (1) NL294675A (US06262066-20010717-C00560.png)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1065192A (en) * 1963-09-03 1967-04-12 Rosemount Eng Co Ltd Pressure gauge
US3290127A (en) * 1964-03-30 1966-12-06 Bell Telephone Labor Inc Barrier diode with metal contact and method of making
US3325702A (en) * 1964-04-21 1967-06-13 Texas Instruments Inc High temperature electrical contacts for silicon devices
US3408237A (en) * 1964-06-30 1968-10-29 Ibm Ductile case-hardened steels
US3297921A (en) * 1965-04-15 1967-01-10 Int Rectifier Corp Controlled rectifier having shunted emitter formed by a nickel layer underneath an aluminum layer
US3442701A (en) * 1965-05-19 1969-05-06 Bell Telephone Labor Inc Method of fabricating semiconductor contacts
US3400308A (en) * 1965-06-22 1968-09-03 Rca Corp Metallic contacts for semiconductor devices
US3368124A (en) * 1965-12-09 1968-02-06 Rca Corp Semiconductor devices
US3492174A (en) * 1966-03-19 1970-01-27 Sony Corp Method of making a semiconductor device
US3445727A (en) * 1967-05-15 1969-05-20 Raytheon Co Semiconductor contact and interconnection structure
US3495324A (en) * 1967-11-13 1970-02-17 Sperry Rand Corp Ohmic contact for planar devices
US3629022A (en) * 1968-03-20 1971-12-21 Motorola Inc Use of platinum thin films as mask in semiconductor processing
US3642528A (en) * 1968-06-05 1972-02-15 Matsushita Electronics Corp Semiconductor device and method of making same
US3769688A (en) * 1972-04-21 1973-11-06 Rca Corp Method of making an electrically-insulating seal between a metal body and a semiconductor device
US3983284A (en) * 1972-06-02 1976-09-28 Thomson-Csf Flat connection for a semiconductor multilayer structure
US3894872A (en) * 1974-07-17 1975-07-15 Rca Corp Technique for fabricating high Q MIM capacitors
US3965279A (en) * 1974-09-03 1976-06-22 Bell Telephone Laboratories, Incorporated Ohmic contacts for group III-V n-type semiconductors
US4286277A (en) * 1977-11-22 1981-08-25 The United States Of America As Represented By The Secretary Of The Army Planar indium antimonide diode array and method of manufacture
JP2631369B2 (ja) * 1987-01-19 1997-07-16 三菱電機株式会社 半導体装置
US5563449A (en) * 1995-01-19 1996-10-08 Cornell Research Foundation, Inc. Interconnect structures using group VIII metals
DE19828846C2 (de) 1998-06-27 2001-01-18 Micronas Gmbh Verfahren zum Beschichten eines Substrats

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2829422A (en) * 1952-05-21 1958-04-08 Bell Telephone Labor Inc Methods of fabricating semiconductor signal translating devices
NL92060C (US06262066-20010717-C00560.png) * 1953-10-26
US2861230A (en) * 1953-11-24 1958-11-18 Gen Electric Calorized point contact electrode for semiconductor devices
FR1254861A (fr) * 1955-11-04 1961-02-24 Fairchild Semiconductor Transistor et son procédé de fabrication
NL251064A (US06262066-20010717-C00560.png) * 1955-11-04
NL210216A (US06262066-20010717-C00560.png) * 1955-12-02
US2981877A (en) * 1959-07-30 1961-04-25 Fairchild Semiconductor Semiconductor device-and-lead structure

Also Published As

Publication number Publication date
GB1030927A (en) 1966-05-25
BE634311A (US06262066-20010717-C00560.png)
US3231421A (en) 1966-01-25
DE1236083B (de) 1967-03-09

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