Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W40/00—Arrangements for thermal protection or thermal control
  • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
  • C03C27/04—Joining glass to metal by means of an interlayer
  • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
  • H10W76/10—Containers or parts thereof
  • H10W76/12—Containers or parts thereof characterised by their shape
  • H10W76/13—Containers comprising a conductive base serving as an interconnection
  • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
  • H10W76/10—Containers or parts thereof
  • H10W76/12—Containers or parts thereof characterised by their shape
  • H10W76/161—Containers comprising no base

Landscapes

• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Ceramic Engineering (AREA)
• Life Sciences & Earth Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• General Chemical & Material Sciences (AREA)
• Geochemistry & Mineralogy (AREA)
• Materials Engineering (AREA)
• Organic Chemistry (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
• Die Bonding (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=25303047

Family Applications (1)

Country Status (6)

Families Citing this family (13)

Family Cites Families (2)

• 0
  • FR FR1317902D patent/FR1317902A/fr not_active Expired
  • NL NL257131D patent/NL257131A/xx unknown
• 1959
  • 1959-10-23 US US848356A patent/US3136932A/en not_active Expired - Lifetime
• 1960
  • 1960-10-14 GB GB35296/60A patent/GB925861A/en not_active Expired
  • 1960-10-21 BE BE596290A patent/BE596290A/fr unknown
  • 1960-10-22 DE DET19172A patent/DE1184870B/de active Pending

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