NL248907A - - Google Patents

Info

Publication number
NL248907A
NL248907A NL248907DA NL248907A NL 248907 A NL248907 A NL 248907A NL 248907D A NL248907D A NL 248907DA NL 248907 A NL248907 A NL 248907A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL248907A publication Critical patent/NL248907A/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D235/00Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings
    • C07D235/02Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings condensed with carbocyclic rings or ring systems
    • C07D235/04Benzimidazoles; Hydrogenated benzimidazoles
    • C07D235/06Benzimidazoles; Hydrogenated benzimidazoles with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached in position 2
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D213/00Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members
    • C07D213/02Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members
    • C07D213/04Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen or carbon atoms directly attached to the ring nitrogen atom
    • C07D213/24Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen or carbon atoms directly attached to the ring nitrogen atom with substituted hydrocarbon radicals attached to ring carbon atoms
    • C07D213/28Radicals substituted by singly-bound oxygen or sulphur atoms
    • C07D213/32Sulfur atoms
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D215/00Heterocyclic compounds containing quinoline or hydrogenated quinoline ring systems
    • C07D215/02Heterocyclic compounds containing quinoline or hydrogenated quinoline ring systems having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen atoms or carbon atoms directly attached to the ring nitrogen atom
    • C07D215/12Heterocyclic compounds containing quinoline or hydrogenated quinoline ring systems having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen atoms or carbon atoms directly attached to the ring nitrogen atom with substituted hydrocarbon radicals attached to ring carbon atoms
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
NL248907D 1959-03-02 NL248907A (xx)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US79621159A 1959-03-02 1959-03-02
US83339859A 1959-08-13 1959-08-13

Publications (1)

Publication Number Publication Date
NL248907A true NL248907A (xx)

Family

ID=31950307

Family Applications (1)

Application Number Title Priority Date Filing Date
NL248907D NL248907A (xx) 1959-03-02

Country Status (4)

Country Link
DE (1) DE1150855B (xx)
FR (1) FR1272510A (xx)
GB (1) GB942802A (xx)
NL (1) NL248907A (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6204566B1 (en) 1992-11-11 2001-03-20 Mitsubishi Denki Kabushiki Kaisha Resin encapsulated electrode structure of a semiconductor device, mounted semiconductor devices, and semiconductor wafer including multiple electrode structures

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2171114A (en) * 1985-02-06 1986-08-20 Canning W Materials Ltd Trivalent chromium electroplating baths and rejuvenation thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6204566B1 (en) 1992-11-11 2001-03-20 Mitsubishi Denki Kabushiki Kaisha Resin encapsulated electrode structure of a semiconductor device, mounted semiconductor devices, and semiconductor wafer including multiple electrode structures
US6284554B1 (en) 1992-11-11 2001-09-04 Mitsubishi Denki Kabushiki Kaisha Process for manufacturing a flip-chip integrated circuit
US6469397B2 (en) 1992-11-11 2002-10-22 Mitsubishi Denki Kabushiki Kaisha Resin encapsulated electrode structure of a semiconductor device, mounted semiconductor devices, and semiconductor wafer including multiple electrode structures

Also Published As

Publication number Publication date
DE1150855B (de) 1963-06-27
GB942802A (en) 1963-11-27
FR1272510A (fr) 1961-09-29

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