Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
  • H01L21/4814—Conductive parts
  • H01L21/4885—Wire-like parts or pins
  • H01L21/4896—Mechanical treatment, e.g. cutting, bending
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
  • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
  • B23Q2703/00—Work clamping

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Manufacturing Of Electrical Connectors (AREA)
• Supports For Pipes And Cables (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=19751874

Family Applications (2)

Family Applications After (1)

Country Status (6)

Families Citing this family (2)

Family Cites Families (4)

• 0
  • BE BE594056D patent/BE594056A/xx unknown
  • NL NL242346D patent/NL242346A/xx unknown
  • NL NL104642D patent/NL104642C/xx active
• 1960
  • 1960-07-18 US US43604A patent/US3121563A/en not_active Expired - Lifetime
  • 1960-08-10 DE DEN18753A patent/DE1199886B/de active Pending
  • 1960-08-11 CH CH911360A patent/CH391105A/de unknown
  • 1960-08-11 GB GB27839/60A patent/GB950613A/en not_active Expired

Also Published As

Similar Documents