NL217849A - - Google Patents

Info

Publication number
NL217849A
NL217849A NL217849DA NL217849A NL 217849 A NL217849 A NL 217849A NL 217849D A NL217849D A NL 217849DA NL 217849 A NL217849 A NL 217849A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL217849A publication Critical patent/NL217849A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
NL217849D 1956-06-12 NL217849A (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US590901A US2887628A (en) 1956-06-12 1956-06-12 Semiconductor device construction

Publications (1)

Publication Number Publication Date
NL217849A true NL217849A (it)

Family

ID=24364199

Family Applications (2)

Application Number Title Priority Date Filing Date
NL217849D NL217849A (it) 1956-06-12
NL101297D NL101297C (it) 1956-06-12

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL101297D NL101297C (it) 1956-06-12

Country Status (5)

Country Link
US (1) US2887628A (it)
DE (1) DE1085261B (it)
FR (1) FR1175953A (it)
GB (1) GB822770A (it)
NL (2) NL101297C (it)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3142791A (en) * 1955-12-07 1964-07-28 Motorola Inc Transistor and housing assembly
GB827117A (en) * 1958-01-03 1960-02-03 Standard Telephones Cables Ltd Improvements in or relating to semi-conductor devices
GB818464A (en) * 1956-03-12 1959-08-19 Gen Electric Co Ltd Improvements in or relating to semiconductor devices
US2984774A (en) * 1956-10-01 1961-05-16 Motorola Inc Transistor heat sink assembly
US3089067A (en) * 1957-09-30 1963-05-07 Gen Motors Corp Semiconductor device
US3113252A (en) * 1958-02-28 1963-12-03 Gen Motors Corp Means for encapsulating transistors
US3150298A (en) * 1958-04-16 1964-09-22 Motorola Inc Stud-mounted rectifier
US3058041A (en) * 1958-09-12 1962-10-09 Raytheon Co Electrical cooling devices
BE584431A (it) * 1959-02-09
NL266908A (it) * 1959-05-15
US3005867A (en) * 1959-10-30 1961-10-24 Westinghouse Electric Corp Hermetically sealed semiconductor devices
US3025437A (en) * 1960-02-05 1962-03-13 Lear Inc Semiconductor heat sink and electrical insulator
NL268169A (it) * 1960-09-20
US3250963A (en) * 1961-03-16 1966-05-10 Texas Instruments Inc Sensor device and method of mounting
DE1251871B (it) * 1962-02-06 1900-01-01
BE634737A (it) * 1962-07-27 1900-01-01
US3209065A (en) * 1962-08-02 1965-09-28 Westinghouse Electric Corp Hermetically enclosed electronic device
US3265802A (en) * 1963-11-18 1966-08-09 Mitronics Inc Cap for hermetically sealed semiconductor
US3271722A (en) * 1963-12-03 1966-09-06 Globe Union Inc Electrical component and thermally improved electrical insulating medium therefor
USB411062I5 (it) * 1964-11-13
US3457476A (en) * 1965-02-12 1969-07-22 Hughes Aircraft Co Gate cooling structure for field effect transistors
US3515952A (en) * 1965-02-17 1970-06-02 Motorola Inc Mounting structure for high power transistors
US3506886A (en) * 1965-03-08 1970-04-14 Itt High power transistor assembly
GB1147645A (en) * 1965-07-01 1969-04-02 English Electric Co Ltd Housings for semi-conductor devices
US3377525A (en) * 1965-12-03 1968-04-09 Gen Electric Electrically insulated mounting bracket for encased semicon-ductor device
US3462654A (en) * 1966-10-05 1969-08-19 Int Rectifier Corp Electrically insulating-heat conductive mass for semiconductor wafers
US3419763A (en) * 1966-10-31 1968-12-31 Itt High power transistor structure
US3522491A (en) * 1967-05-31 1970-08-04 Wakefield Eng Inc Heat transfer apparatus for cooling semiconductor components
US3716759A (en) * 1970-10-12 1973-02-13 Gen Electric Electronic device with thermally conductive dielectric barrier
IE36727B1 (en) * 1971-10-01 1977-02-02 Gen Electric Metal oxide varistor
US4222373A (en) * 1977-07-26 1980-09-16 Davis Michael A Ceramic solar collector
DE2755404A1 (de) * 1977-12-13 1979-06-21 Bosch Gmbh Robert Halbleiteranordnung
US4303935A (en) * 1977-12-13 1981-12-01 Robert Bosch Gmbh Semiconductor apparatus with electrically insulated heat sink
US4299715A (en) * 1978-04-14 1981-11-10 Whitfield Fred J Methods and materials for conducting heat from electronic components and the like
JPS5550646A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Integrated circuit device
US4301357A (en) * 1979-08-23 1981-11-17 Kv33 Corporation Electrically heated wax spatula using a diode as the heating element
US4602678A (en) * 1983-09-02 1986-07-29 The Bergquist Company Interfacing of heat sinks with electrical devices, and the like
JPS6066843A (ja) * 1983-09-22 1985-04-17 Hitachi Ltd 集積回路パツケ−ジ
US6616999B1 (en) * 2000-05-17 2003-09-09 Raymond G. Freuler Preapplicable phase change thermal interface pad
US6652705B1 (en) 2000-05-18 2003-11-25 Power Devices, Inc. Graphitic allotrope interface composition and method of fabricating the same
US6672378B2 (en) 2001-06-07 2004-01-06 Loctite Corporation Thermal interface wafer and method of making and using the same
US6483707B1 (en) 2001-06-07 2002-11-19 Loctite Corporation Heat sink and thermal interface having shielding to attenuate electromagnetic interference

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2740075A (en) * 1956-03-27 Metal rectifier assemblies
US2820929A (en) * 1958-01-21 Transistor holders
US2738452A (en) * 1950-06-30 1956-03-13 Siemens Ag Dry multi-pellet rectifiers
US2825014A (en) * 1953-11-30 1958-02-25 Philips Corp Semi-conductor device
US2725505A (en) * 1953-11-30 1955-11-29 Rca Corp Semiconductor power devices
CH328594A (fr) * 1954-07-03 1958-03-15 Csf Dispositif électronique comportant un élément semi-conducteur
NL202863A (it) * 1954-12-16 1900-01-01

Also Published As

Publication number Publication date
GB822770A (en) 1959-10-28
US2887628A (en) 1959-05-19
FR1175953A (fr) 1959-04-03
DE1085261B (de) 1960-07-14
NL101297C (it)

Similar Documents

Publication Publication Date Title
AT202855B (it)
AT216255B (it)
AT199361B (it)
AT202354B (it)
AT198114B (it)
AT197702B (it)
AT213780B (it)
AT194202B (it)
AT201309B (it)
AT202279B (it)
AT198966B (it)
AT199904B (it)
AT198891B (it)
AT194662B (it)
AT194974B (it)
AT194993B (it)
AT198677B (it)
AT198814B (it)
AT198988B (it)
AT199054B (it)
AT198347B (it)
AT198843B (it)
AT201021B (it)
AT198051B (it)
AT201431B (it)