NL2021459B1 - Heat pump system using thermo-electric element - Google Patents

Heat pump system using thermo-electric element Download PDF

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Publication number
NL2021459B1
NL2021459B1 NL2021459A NL2021459A NL2021459B1 NL 2021459 B1 NL2021459 B1 NL 2021459B1 NL 2021459 A NL2021459 A NL 2021459A NL 2021459 A NL2021459 A NL 2021459A NL 2021459 B1 NL2021459 B1 NL 2021459B1
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Netherlands
Prior art keywords
pump system
heat
heat pump
channels
array
Prior art date
Application number
NL2021459A
Other languages
Dutch (nl)
Inventor
Joseph Louppen Gerard
Johannes Adrianus Maat Jan
Original Assignee
Ecodynamisch Man B V
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Publication date
Application filed by Ecodynamisch Man B V filed Critical Ecodynamisch Man B V
Priority to NL2021459A priority Critical patent/NL2021459B1/en
Priority to PCT/NL2019/050528 priority patent/WO2020036487A1/en
Priority to EP19756027.9A priority patent/EP3837477A1/en
Application granted granted Critical
Publication of NL2021459B1 publication Critical patent/NL2021459B1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H4/00—Fluid heaters characterised by the use of heat pumps
    • F24H4/02—Water heaters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H2250/00—Electrical heat generating means
    • F24H2250/06—Peltier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/12—Hot water central heating systems using heat pumps

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)

Abstract

A heat pump system (1) with a primary fluid part (2) having a (low temperature) fluid input connector (3) and a (high temperature) fluid output connector (4), and an array of channels (5) connecting the fluid input connector (3) and the fluid output connector (4). A convertor (6) is present in heat energy transfer connection with the array of channels (5), as well as a heat sink (7) in heat energy transfer connection with the convertor (6). A thermo-electric heat transfer element (8) is positioned between the heat sink (7) and the convertor (6). The heat pump system (1) can be utilized in a central heating system and/or for hot tap water supply.

Description

Field of the invention
The present invention relates to a heat pump system, more specifically a heat pump system useable in a central heating system and/or a hot tap water supply system.
Background art
US patent publication US2018/0080689 disclosed thermo-electric heat pump systems, especially suited for use in a container for storing or transporting temperature sensitive goods. A stack of Peltier elements is in thermal connection with a capacitance spacer block (used as heat sink) and controls temperature of a storage area.
Summary of the invention
The present invention seeks to provide a heat pump system with a high efficiency, especially when used to heat up water in a fluid circuit of a central heating system or a hot tap water supply system.
According to the present invention, a heat pump system is provided comprising a primary fluid part having a fluid input connector and a fluid output connector, and an array of channels connecting the fluid input connector and the fluid output connector, a convertor in heat energy transfer connection with the array of channels, a heat sink in heat energy transfer connection with the convertor, further comprising a thermo-electric heat transfer element positioned between the heat sink and the convertor. This provides a very efficient heat transfer mechanism during operation to a fluid flowing in the primary fluid part.
Short description of drawings
The present invention will be discussed in more detail below, with reference to the attached drawings, in which
Fig. 1 shows a perspective view of an exemplary embodiment of the heat pump system according to the present invention embodiment;
Fig. 2 shows a cross sectional view of the heat pump system embodiment shown in Fig. 1 along the lines ll-ll;
Fig. 3 shows a cross sectional view of an alternative embodiment of the heat pump system shown in Fig. 2; and
Fig. 4 shows a block diagram of an exemplary embodiment of a control unit operatively powering components of the heat pump system.
Description of embodiments
The present invention embodiments provide for an efficient system for providing a heated medium which can e.g. be used for a central heating system or a hot water supply. The present invention embodiments use a combination of components which obviate any moving parts or other components which are susceptible to wear or degradation over time. This allows to provide a heating/cooling system for a house, optionally also providing (hot) tap water, which is environmentally friendly, energy efficient, silent during operation, and easy to maintain.
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An exemplary embodiment of the present invention heat pump system 1 is shown in the perspective view of Fig. 1, and Fig. 2 shows a cross sectional view of the heat pump system 1 embodiment shown in Fig. 1 along the lines ll-ll.
The heat pump system 1 as shown in Fig. 1 and 2 comprises a primary fluid part 2 having a (e.g. low temperature) fluid input connector 3 and a (e.g. high temperature) fluid output connector 4, and an array of channels 5 connecting the fluid input connector 3 and the fluid output connector
4. A convertor 6 is present in heat energy transfer connection with the array of channels 5, as well as a heat sink 7 in heat energy transfer connection with the convertor 6. Furthermore, the heat pump system 1 comprises a thermo-electric heat transfer element 8 positioned between the heat sink 7 and the convertor 6. When a fluid source is connected to the fluid input connector 3, the heat pump system 1 can be operated to either cool or heat the fluid in the primary fluid part 2, e.g. for heating a house as part of a central heating system.
The thermo-electric heat transfer element 8 uses the physical effect of thermo-electric cooling (TEC) to displace thermal energy form one of its sides to the other side. Thermo-electric cooling is e.g. implemented as a solid-state method of heat transfer through dissimilar semiconductor materials. Like conventional refrigeration counterparts, thermo-electric cooling systems obey the basic laws of thermodynamics. However, the actual physical phenomenon responsible for cooling is different, i.e. the three main working parts in a thermo-electric refrigeration system are a cold junction, a heat sink, and a DC power source. Two dissimilar semiconductors replace the refrigerant in both liquid and vapour form of a conventional refrigeration system. A cold sink (equivalent to the evaporator surface) becomes cold through absorption of energy by the electrons as they pass from one semiconductor to the other, instead of energy absorption by the refrigerant as it changes from liquid to vapour. A DC power source pumps the electrons from one semiconductor to the other, and the heat sink (equivalent to the condenser surface) discharges the accumulated heat energy from the system. Therefore, the thermo-electric cooling system refrigerates without refrigerant and without the use of mechanical devices. It is noted that the transport of thermal energy can also be used in the Opposite’ direction, i.e. for heating purposes.
The person skilled in the art will be familiar with the specific types of semiconductor materials and structures to be used for implementation of the thermo-electric heat transfer elements 8 in the embodiments of the present invention heat pump system. One of possible implementations, is wherein the thermo-electric heat transfer element (8) comprises one or more Peltier elements. In an exemplary implementation of a Peltier element, two (ceramic) isolation plates are present with bars of semiconducting material in between and a specific electrical connection scheme between the bars, i.e. oppositely doped and series connected. When a current source is connected, a current will flow, wherein electrons can only pass through the semiconducting material in one direction. As a result energy is transported in one direction as well, wherein the side of the Peltier element where the electrons originate will become colder, and the side to which the electrons move, will become warmer, or in other words, heat energy is pumped or transferred from one side of the Peltier element to the other.
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In the exemplary embodiment shown in Fig. 1 and 2, the heat pump system 1 further comprises a secondary fluid part 20 having a secondary fluid input connector 23 and a secondary fluid output connector 24, and a secondary array of channels 25 connecting the secondary fluid input connector 23 and the secondary fluid output connector 24. The convertor 6 is in heat energy transfer connection with the secondary array of channels 25. As an exemplary operational use, the secondary fluid input connector 23 of the secondary fluid part 20 is connected to a tap water source, in order to provide hot tap water from the secondary fluid output connector 24.
The primary and secondary fluid part 2, 20 may be alternatively present, or in combination in embodiments of the heat pump system 1, depending on the specific required use of the heat pump system 1. E.g. in a further aspect of the present invention, a central heating system is provided which comprises a heat pump system 1 according to any one of the embodiments described herein, wherein the primary fluid part 2 is connected to a heating fluid circuit, e.g. radiators of a central heating system, or a floor (and/or wall) central heating system). The present invention heat pump system 1 is thus only used for room heating in this embodiment.
The embodiments wherein the secondary fluid part 20 is provided in addition to the primary fluid part 2 can be advantageously applied in a further aspect of the present invention, i.e. a central heating system comprising a heat pump system 1 according to any one of the present invention embodiments, wherein the primary fluid part 2 is connected to a heating fluid circuit, and wherein the secondary fluid part 20 is connected to a hot water supply circuit. In this exemplary embodiment, the heat pump system 1 is used for both room heating and for providing hot tap water.
In an even further aspect of the present invention, a hot water supply system comprising a heat pump system 1 according to any one of the present invention embodiments having a primary fluid part 2 only, wherein the primary fluid part 2 is connected to a hot water supply circuit. In this exemplary embodiment, the heat pump system having a single (primary) fluid part 2 can be used for providing hot tap water.
In the embodiments shown in Fig. 1 and 2, the heat pump system 1 further comprises a second heat sink 7’ in heat energy transfer connection with the convertor 6, and a second thermoelectric heat transfer element 8’ positioned between the second heat sink 7’ and the convertor 6. This mirrored arrangement allows to use a single convertor 6 with the array of channels, and a dual provision of the heat sink 7, 7’ and thermo-electric heat transfer element 8, 8’, resulting in an even further improved efficiency.
The arrangement shown in Fig. 1 and 2 comprises a top cover plate 15, bottom cover plate 16 and two side plates 17,18, allowing to provide a compact and easy to handle heat pump system
I with input and output connections to the primary and secondary fluid parts 2, 20 conveniently located at the front side of the heat pump system 1.
Also shown in the perspective view of Fig. 1 is that the primary fluid part 2 comprises the primary fluid input connection 3 and primary output fluid connection 4, as well as an input manifold
II connecting the primary fluid input connection 3 to the array of channels 5, and an output manifold 12 connecting the array of channels 5 to the primary fluid output connection 4. Similarly, the secondary fluid part 20 comprises the secondary fluid input connection 23 and secondary output
P6076400NL fluid connection 24, as well as an input manifold 21 connecting the secondary fluid input connection 23 to the secondary array of channels 25, and a secondary output manifold 22 connecting the secondary array of channels 25 to the secondary fluid output connection 24.
Furthermore, in the embodiment shown in Fig. 1 and 2 a tensioning assembly 14 is present for providing tension between the heat sink 7; 7’ and the convertor 6. The tensioning assembly 14 in this embodiment comprises two plates 14, 14’ in contact with the respective heat sinks 7, 7’, and with the respective heat transfer elements 8, 8’, in combination with tensioning attachments 14a and tensioning springs 14b. This allows to effectively compress each stack of heat thermo-electric heat transfer elements 8, 8’ and convertor 6 for good physical contact and thermal energy conduction from the heat sinks 7, 7’ to the array of channels 5 in convertor 6.
The present invention embodiments of the heat pump system 1 have the advantages that no moving parts are present, which enables for a very low noise operation, and also allows for a long life time as almost no wear and tear will arise during operation. The heat pump system 1 is also scalable. As shown in the exemplary embodiment of Fig. 1 and 2, the system has six convertors 6, with associated dual heat transfer elements 8, 8’ on side surfaces thereof, but it will be apparent that fewer or more convertors 6 may be implemented. Similarly, the number of channels in the array of channels 5 (and in the secondary array of channels 25) can vary depending on capacity desired from the exemplary embodiment shown (thirteen channels in the array of channels 5, and six channels in the secondary array of channels 25). Also, the capacity and characteristics of the thermo-electric heat transfer elements 8, 8’, 28 can be selected depending on the actual intended use.
As shown in the embodiment of Fig. 1 and 2, the array of channels 5 comprises a plurality of pipes, e.g. made of copper to obtain a good thermal energy transfer from the convertor 6 to the fluid flowing in the pipes. Other materials with a high thermal energy conductivity may also be used. Alternatively, the array of channels 5 comprises a plurality of elongated bores in the convertor 6. When selecting proper material of the convertor 6, and in combination with proper sealing in the primary fluid part 2, this can provide a very efficient thermal energy transfer. It is noted that the cross section of the array of channels 5 is shown as being circular, but alternative cross sectional shapes may also be provided, including but not limited to ellipse, square, rectangular, triangular, hexagonal. It is noted that similar alternative embodiments may be provided in the secondary fluid part 20 in an analogue manner.
As shown in Fig. 1 and 2, this embodiment of the heat pump system 1 further comprises a secondary convertor part 26 in heat energy transfer connection with the convertor 6. The secondary convertor part 26 including bores for accommodating the secondary array of channels 25, and is e.g. implemented as a combination of two halve parts 26a, 26b for easy installing. A bottom part 26a can be first attached to the top surface of convertor 6, then the secondary array of channels 25 can be provided (e.g. in the form of pipes between secondary input manifold 21 and secondary output manifold 22, positioned in semicircle grooves of the bottom part 26a, and then a top part 26b can be attached to the bottom part 26a.
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With respect to material used for the various components of the heat pump system 1, various selections can be made in view of trade off of efficiency and costs. E.g. the material of the convertor 6 (and if present secondary convertor part 26) may be copper, but any high thermal conducting material will also be possible, such as silver, gold or aluminium. As mentioned above, the thermal heat transfer elements 8, 8’ can be Peltier elements, of which the major surface area can be matched with the side surfaces of the convertor 6.
In embodiments where both a primary and secondary fluid part 2, 20 are present, the characteristics of both can be adapted depending on the actual use of the heat pump assembly 1. E.g. if the secondary fluid part 20 is applied to provide hot tap water, and the primary fluid part 2 for central heating, in a further embodiment, an inner diameter of channels of the secondary array of channels 25 is smaller than an inner diameter of channels of the array of channels 5. This will increase flow of fluid within the secondary system, allowing a lower flow speed and thus a higher thermal energy transfer. As an example, the inner diameter of the secondary array of channels 25 is 6 mm (plus 0.5mm wall thickness), and the inner diameter of the (primary) array of channels 5 is 10 mm.
In the cross sectional view of Fig. 3, an alternative embodiment is shown of the heat pump system 1 of Fig. 1 and 2, wherein the secondary fluid part 20 is provided with a separate (secondary) thermo-electric heat transfer element 28. The secondary thermo-electric heat transfer element 28 is provided in heat transfer connection between the convertor 6 and the second array of channels
25. Similar to the embodiment above, the secondary thermo-electric heat transfer element 28 may be implemented as a Peltier element, with appropriate dimensions and characteristics specific for the use to heat up water in the secondary array of channels 25 to high temperatures. E.g. in a further embodiment, a power capacity of the secondary thermo-electric heat transfer element 28 is higher than a power capacity of the thermo-electric heat transfer element 8.
The heat pump system 1 may have additional features further enhancing efficiency of the heat pump system, which may be applied in addition to, or as alternative for, some of the features described above with reference to the embodiments shown in Fig. 1-3.
In a further embodiment, the heat pump system 1 further comprises reflection material surrounding the thermo-electric heat transfer element 8 and the convertor 6. This reflection material may be implemented as a reflecting layer on the inside of the heat pump system 1, and has the effect that also heat energy generated by the heat transfer element 8 is reflected, and received by the convertor 6 and transferred to the array of channels 5. By separating cold and warm areas in the heat pump system using this reflection material, it is possible to retain energy inside and guide it effectively to the array of channels 5.
The reflection material in a further embodiment comprises one or more layers of polyethylene material with a metal layer (e.g. aluminium) deposited on each of the one or more layers of polyethylene material. The combination of reflection material and isolating layers in between provide for a very efficient separation of cold and warm areas in the heating pump system
1.
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To further enhance the efficiency of the heat pump system 1, heat energy retention material is positioned around channels 5 of the array of channels 5 in a further embodiment. The heat energy retention material is e.g. a moulding material (which can be easily applied in the spaces between the channels 5), or additionally or alternatively, is a stone like material having a high heat retention capacity.
In an even further embodiment, the heat sink 7 comprises a predetermined volume of a heat sink material. This allows to provide a large heating capacity for the heat pump system 1. The heat sink material may comprises one or more of a solid (e.g. rock, concrete block, dirt, magnesium carbonate, etc.), a liquid (e.g. water), or a gas (e.g. air). A solid material has the benefit of being a high density material with the ability to accumulate heat energy and (delayed) provision of heat energy in a very efficient manner.
The heat pump system 1 has been tested and applied in a combined central heating system and hot tap water supply system, and it was found that it can operate at a very high efficiency, which expressed in the Coefficient of Performance (COP, i.e. ratio of delivered energy and used energy input) has been shown to be between 4 and 9.
Fig. 4 shows a block diagram of an exemplary embodiment of a control unit 30 operatively powering components of the heat pump system 1 when used in a central heating system embodiment or hot water supply system embodiment as described above.
The control unit 30 has two control sub-units 31, 32, of which the power control unit 31 is connected to the thermo-electric heat transfer elements 8, 8’and 28 (if present) of one of the heat pump system 1 embodiments described above. In one embodiment, the control unit 30 comprises a current controlled power supply 31 connected to the thermo-electric heat transfer element 8, 8’,
28. Current control has the benefit of allowing a precise control of energy input to the thermo-electric heat transfer elements 8, 8’, 28, depending on actual heating demand.
Furthermore, the control unit 30 in the exemplary embodiment shown, may be used in conjunction with the external system wherein the present invention heat pump system 1 is applied, such as a central heating system or a hot water supply system. To that end, as shown in the embodiment of Fig.4, the control unit 30 comprises a pump control unit 32 connected to a central heating pump 33 and/or a tap water supply pump 34. In addition, or alternatively, the pump control unit 32 may be connected to one or more valve units for controlling flow in the primary fluid part 2 and secondary fluid part 20. The control unit 30 may be further arranged to apply a suitable control algorithm for the associated function, e.g. a clock thermostat function of a central heating system, wherein the heat pump system 1 components and additional components are actively controlled.
In the above description, the invention has been discusses with reference to a number of exemplary embodiments. The invention is also summarized in the following interdependent embodiment clauses:
Embodiment 1. A heat pump system (1) comprising a primary fluid part (2) having a fluid input connector (3) and a fluid output connector (4), and an array of channels (5) connecting the fluid input connector (3) and the fluid output connector (4), a convertor (6) in heat energy transfer connection with the array of channels (5),
P6076400NL a heat sink (7) in heat energy transfer connection with the convertor (6), further comprising a thermo-electric heat transfer element (8) positioned between the heat sink (7) and the convertor (6).
Embodiment 2. The heat pump system (1) according to embodiment 1, wherein the heat pump system (1) further comprises a second heat sink (7’) in heat energy transfer connection with the convertor (6), and a second thermo-electric heat transfer element (8’) positioned between the second heat sink (7’) and the convertor (6).
Embodiment 3. The heat pump system (1) according to embodiment 1 or 2, wherein the thermoelectric heat transfer element (8) comprises one or more Peltier elements.
Embodiment 4. The heat pump system (1) according to embodiment 1, 2 or 3, further comprising reflection material surrounding the thermo-electric heat transfer element (8) and the convertor (6). Embodiments. The heat pump system (1) according to embodiment 4, wherein the reflection material comprises one or more layers of polyethylene material with a metal layer deposited on each of the one or more layers of polyethylene material.
Embodiment 6. The heat pump system (1) according to any one of embodiments 1-5, further comprising heat energy retention material positioned around channels (5) of the array of channels (5).
Embodiment 7. The heat pump system (1) according to any one of embodiments 1-6, wherein the heat sink (7) comprises a predetermined volume of a heat sink material.
Embodiment 8. The heat pump system (1) according to embodiment 7, wherein the heat sink material comprises one or more of a solid, a liquid, or a gas.
Embodiment 9. The heat pump system (1) according to any one of embodiments 1-8, wherein the array of channels (5) comprises a plurality of pipes.
Embodiment 10. The heat pump system (1) according to any one of embodiments 1-8, wherein the array of channels (5) comprises a plurality of elongated bores in the convertor (6).
Embodiment 11. The heat pump system (1) according to any one of embodiments 1-10, further comprising a current controlled power supply (31) connected to the thermo-electric heat transfer element (8).
Embodiment 12. The heat pump system (1) according to any one of embodiments 1-11, further comprising a tensioning assembly (14) for providing tension between the heat sink (7) and the convertor (6).
Embodiment 13. The heat pump system (1) according to any one of embodiments 1-12, wherein the heat pump system (1) further comprises a secondary fluid part (20) having a secondary fluid input connector (23) and a secondary fluid output connector (24), and a secondary array of channels (25) connecting the secondary fluid input connector (23) and the secondary fluid output connector (24), wherein the convertor (6) is in heat energy transfer connection with the secondary array of channels (25).
Embodiment 14. The heat pump system (1) according to embodiment 13, further comprising a secondary convertor part (26) in heat energy transfer connection with the convertor (6).
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Embodiment 15. The heat pump system (1) according to embodiment 13 or 14, wherein an inner diameter of channels of the secondary array of channels (25) is smaller than an inner diameter of channels of the array of channels (5).
Embodiment 16. The heat pump system (1) according to embodiment 13,14, or 15, wherein a secondary thermo-electric heat transfer element (28) is provided in heat energy transfer connection between the convertor (6) and the second array of channels (25).
Embodiment 17. The heat pump system (1) according to embodiment 16, wherein a power capacity of the secondary thermo-electric heat transfer element (28) is higher than a power capacity of the thermo-electric heat transfer element (8).
Embodiment 18. Central heating system comprising a heat pump system (1) according to any one of embodiments 1-12, wherein the primary fluid part (2) is connected to a heating fluid circuit.
Embodiment 19Central heating system comprising a heat pump system (1) according to any one of embodiments 13-17, wherein the primary fluid part (2) is connected to a heating fluid circuit, and wherein the secondary fluid part (20) is connected to a hot water supply circuit.
Embodiment 20. Hot water supply system comprising a heat pump system (1) according to any one of embodiments 1-12, wherein the primary fluid part (2) is connected to a hot water supply circuit.
The present invention has been described above with reference to a number of exemplary embodiments as shown in the drawings. Modifications and alternative implementations of some parts or elements are possible, and are included in the scope of protection as defined in the appended claims.

Claims (20)

ConclusiesConclusions 1. Warmtepompsysteem (1) omvattend een primair fluïdumdeel (2) met een fluïdumtoevoerconnector (3) en een fluïdumafvoerconnector (4), en een array kanalen (5) die de fluïdumtoevoerconnector (3) en de fluïdumafvoerconnector (4) met elkaar verbindt, een convertor (6) in warmteenergieoverdrachtverbinding met het array kanalen (5), een warmteput (7) in warmteenergieoverdrachtverbinding met de convertor (6), verder omvattend een thermo-elektrisch warmteoverdrachtelement (8) die gepositioneerd is tussen de warmteput (7) en de convertor (6).A heat pump system (1) comprising a primary fluid section (2) with a fluid supply connector (3) and a fluid discharge connector (4), and an array of channels (5) connecting the fluid supply connector (3) and the fluid discharge connector (4), a converter (6) in heat energy transfer connection to the array of channels (5), a heat sink (7) in heat energy transfer connection to the converter (6), further comprising a thermoelectric heat transfer element (8) positioned between the heat sink (7) and the converter (6). 2. Warmtepompsysteem (1) volgens conclusie 1, waarbij het warmtepompsysteem (1) verder een tweede warmteput (7’) omvat in warmteenergieoverdrachtverbinding met de convertor (6), en een tweede thermo-elektrisch warmteoverdrachtelement (8’) dat gepositioneerd is tussen de tweede warmteput (7’) en de convertor (6).The heat pump system (1) according to claim 1, wherein the heat pump system (1) further comprises a second heat sink (7 ') in heat energy transfer connection with the converter (6), and a second thermoelectric heat transfer element (8') positioned between the second heat sink (7 ') and the converter (6). 3. Warmtepompsysteem (1) volgens conclusie 1 of 2, waarbij het thermo-elektrisch warmteoverdrachtelement (8) één of meer Peltier elementen omvat.A heat pump system (1) according to claim 1 or 2, wherein the thermoelectric heat transfer element (8) comprises one or more Peltier elements. 4. Warmtepompsysteem (1) volgens conclusie 1,2 of 3, verder omvattend reflectiemateriaal dat het thermo-elektrisch warmteoverdrachtelement (8) en de convertor (6) omgeeft.The heat pump system (1) according to claim 1,2 or 3, further comprising reflective material surrounding the thermoelectric heat transfer element (8) and the converter (6). 5. Warmtepompsysteem (1) volgens conclusie 4, waarbij het reflectiemateriaal één of meer lagen polyethyleen materiaal omvat met een metaallaag die neergeslagen is op elk van de één of meer lagen polyethyleen materiaal.The heat pump system (1) according to claim 4, wherein the reflective material comprises one or more layers of polyethylene material with a metal layer deposited on each of the one or more layers of polyethylene material. 6. Warmtepompsysteem (1) volgens één van de conclusies 1-5, verder omvattend warmteenergievasthoudmateriaal gepositioneerd rond kanalen van het array kanalen (5).The heat pump system (1) according to any one of claims 1 to 5, further comprising heat energy retention material positioned around channels of the array of channels (5). 7. Warmtepompsysteem (1) volgens één van de conclusies 1-6, waarbij de warmteput (7) een vooraf bepaald volume warmteputmateriaal omvat.Heat pump system (1) according to any one of claims 1-6, wherein the heat sink (7) comprises a predetermined volume of heat sink material. 8. Warmtepompsysteem (1) volgens conclusie 7, waarbij het warmteputmateriaal één of meer omvat van een vaste stof, een vloeistof, of een gas.The heat pump system (1) according to claim 7, wherein the heat sink material comprises one or more of a solid, a liquid, or a gas. 9. Warmtepompsysteem (1) volgens één van de conclusies 1-8, waarbij het array kanalen (5) een veelvoud pijpen omvat.Heat pump system (1) according to any one of claims 1-8, wherein the array of channels (5) comprises a plurality of pipes. 10. Warmtepompsysteem (1) volgens één van de conclusies 1-8, waarbij het array kanalen (5) een veelvoud langgerekte boringen in de convertor (6) omvat.Heat pump system (1) according to any one of claims 1-8, wherein the array of channels (5) comprises a plurality of elongated bores in the converter (6). P6076400NLP6076400NL 11. Warmtepompsysteem (1) volgens één van de conclusies 1-10, verder omvattend een stroombestuurde vermogensvoeding (31) die verbonden is met het thermo-elektrisch warmteoverdrachtelement (8).The heat pump system (1) according to any one of claims 1 to 10, further comprising a current controlled power supply (31) connected to the thermoelectric heat transfer element (8). 12. Warmtepompsysteem (1) volgens één van de conclusies 1-11, verder omvattend een spansamenstel (14) voor het verschaffen van spanning tussen de warmteput (7) en de convertor (6).The heat pump system (1) according to any one of claims 1-11, further comprising a clamping assembly (14) for providing voltage between the heat sink (7) and the converter (6). 13. Warmtepompsysteem (1) volgens één van de conclusies 1-12, waarbij het warmtepompsysteem (1) verder omvat een secundair fluïdumdeel (20) met een secundaire fluïdumtoevoerconnector (23) en een secundaire fluïdumafvoerconnector (24), en een secundair array kanalen (25) die de secundaire fluïdumtoevoerconnector (23) en de secundaire fluïdumafvoerconnector (24) met elkaar verbindt, waarbij de convertor (6) in warmteenergieoverdrachtverbinding is met het secundaire array kanalen (25).The heat pump system (1) according to any of claims 1-12, wherein the heat pump system (1) further comprises a secondary fluid section (20) with a secondary fluid supply connector (23) and a secondary fluid discharge connector (24), and a secondary array channels ( 25) connecting the secondary fluid supply connector (23) and the secondary fluid discharge connector (24), the converter (6) being in heat energy transfer connection to the secondary array channels (25). 14. Warmtepompsysteem (1) volgens conclusie 13, verder omvattend een secundair convertordeel (26) in warmteenergieoverdrachtverbinding met de convertor (6).The heat pump system (1) of claim 13, further comprising a secondary converter section (26) in heat energy transfer connection to the converter (6). 15. Warmtepompsysteem (1) volgens conclusie 13 of 14, waarbij de binnendoorsnede van kanalen van het secundaire array kanalen (25) kleiner is dan de binnendoorsnede van kanalen van het array kanalen (5).A heat pump system (1) according to claim 13 or 14, wherein the inner diameter of channels of the secondary array channels (25) is smaller than the inner diameter of channels of the array of channels (5). 16. Warmtepompsysteem (1) volgens conclusie 13, 14, of 15, waarbij een secundair thermoelektrisch warmteoverdrachtelement (28) voorzien is in warmteenergieoverdrachtverbinding tussen de convertor (6) en het secundaire array kanalen (25).A heat pump system (1) according to claim 13, 14, or 15, wherein a secondary thermoelectric heat transfer element (28) is provided in a heat energy transfer connection between the converter (6) and the secondary array channels (25). 17. Warmtepompsysteem (1) volgens conclusie 16, waarbij een vermogenscapaciteit van het secundaire thermo-elektrisch warmteoverdrachtelement (28) hoger is dan een vermogenscapaciteit van het thermo-elektrisch warmteoverdrachtelement (8).The heat pump system (1) of claim 16, wherein a power capacity of the secondary thermoelectric heat transfer element (28) is higher than a power capacity of the thermoelectric heat transfer element (8). 18. Centrale-verwarmingssysteem omvattend een warmtepompsysteem (1) volgens één van de conclusies 1-12, waarbij het primaire fluïdumdeel (2) verbonden is met een verwarmingsfluidumcircuit.Central heating system comprising a heat pump system (1) according to any one of claims 1-12, wherein the primary fluid section (2) is connected to a heating fluid circuit. 19 Centrale-verwarmingssysteem omvattend een warmtepompsysteem (1) volgens één van de conclusies 13-17, waarbij het primaire fluïdumdeel (2) verbonden is met een verwarmingsfluidumcircuit, en waarbij het secundaire fluïdumdeel (20) verbonden is met een heetwaterafgiftecircuit.Central heating system comprising a heat pump system (1) according to any one of claims 13-17, wherein the primary fluid section (2) is connected to a heating fluid circuit, and the secondary fluid section (20) is connected to a hot water dispensing circuit. P6076400NLP6076400NL 20. Heetwaterafgiftesysteem omvattend een warmtepompsysteem (1) volgens één van de conclusies 1-12, waarbij het primaire fluïdumdeel (2) verbonden is met een heetwaterafgiftecircuit.Hot water delivery system comprising a heat pump system (1) according to any one of claims 1-12, wherein the primary fluid section (2) is connected to a hot water delivery circuit.
NL2021459A 2018-08-13 2018-08-13 Heat pump system using thermo-electric element NL2021459B1 (en)

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PCT/NL2019/050528 WO2020036487A1 (en) 2018-08-13 2019-08-13 Heat pump system using thermo-electric element
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