NL2020017B1 - EBG structure, EBG component, and antenna device - Google Patents

EBG structure, EBG component, and antenna device Download PDF

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Publication number
NL2020017B1
NL2020017B1 NL2020017A NL2020017A NL2020017B1 NL 2020017 B1 NL2020017 B1 NL 2020017B1 NL 2020017 A NL2020017 A NL 2020017A NL 2020017 A NL2020017 A NL 2020017A NL 2020017 B1 NL2020017 B1 NL 2020017B1
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NL
Netherlands
Prior art keywords
ebg
dielectric layer
ebg structure
tiles
structure according
Prior art date
Application number
NL2020017A
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Dutch (nl)
Inventor
Keyrouz Shady
Caratelli Diego
Leo Alfons Gielis Johan
De Jong Van Coevorden Carlos
Pirneskoski Jarmos
Original Assignee
The Antenna Company International N V
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Publication date
Application filed by The Antenna Company International N V filed Critical The Antenna Company International N V
Priority to PCT/NL2018/050268 priority Critical patent/WO2018199753A1/en
Priority to EP18722248.4A priority patent/EP3616255B8/en
Priority to US16/608,076 priority patent/US10985455B2/en
Application granted granted Critical
Publication of NL2020017B1 publication Critical patent/NL2020017B1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/2005Electromagnetic photonic bandgaps [EPB], or photonic bandgaps [PBG]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/006Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
    • H01Q15/008Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces said selective devices having Sievenpipers' mushroom elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0236Electromagnetic band-gap structures

Abstract

The invention relates to an improved electromagnetic band gap (EBG) structure. The invention also relates to an electromagnetic band gap (EBG) component for use in an EBG structure according to the invention. The invention further relates to an antenna device comprising at least one EBG structure according to the invention.

Description

Octrooicentrum
Θ 2020017
(21) Aanvraagnummer: 2020017 © Aanvraag ingediend: 5 december 2017 @ Int. Cl.:
H01P 1/20 (2018.01) H01Q 1/52 (2018.01) H01Q
15/00 (2018.01) H05K 1/02 (2018.01)
@ Voorrang: (73) Octrooihouder(s):
25 april 2017 NL 2018779 THE ANTENNA COMPANY INTERNATIONAL
25 oktober 2017 NL 2019798 N.V. te Curasao, Nederlandse Antillen, AN.
@ Aanvraag ingeschreven: (72) Uitvinder(s):
5 november 2018 Shady Keyrouz te Eindhoven.
Diego Caratelli te Duizel.
(43) Aanvraag gepubliceerd: Carlos de Jong van Coevorden te Eindhoven.
- Jarmos Pirneskoski te Eindhoven.
Johan Leo Alfons Gielis te Antwerpen (BE).
(47) Octrooi verleend:
5 november 2018
θ Gemachtigde:
(45) Octrooischrift uitgegeven: ir. H.Th. van den Heuvel c.s.
1 februari 2019 te 's-Hertogenbosch.
© EBG structure, EBG component, and antenna device © The invention relates to an improved electromagnetic band gap (EBG) structure. The invention also relates to an electromagnetic band gap (EBG) component for use in an EBG structure according to the invention. The invention further relates to an antenna device comprising at least one EBG structure according to the invention.
NL Bl 2020017
Dit octrooi is verleend ongeacht het bijgevoegde resultaat van het onderzoek naar de stand van de techniek en schriftelijke opinie. Het octrooischrift komt overeen met de oorspronkelijk ingediende stukken.
EBG structure, EBG component, and antenna device
The invention relates to an Electromagnetic Band Gap (EBG) structure. The invention also relates to an Electromagnetic Band Gap (EBG) component for use in an EBG structure according to the invention. The invention further relates to an antenna device comprising at least one EBG structure according to the invention.
Modem communication wireless devices rely on ΜΙΜΟ (Multiple Input Multiple Output) antenna systems in order to increase the data rate and maximize coverage range. Preserving high isolation between antenna elements is a key requirement to achieve said goals. The trend in product design is to make wireless communication systems as compact as possible. This inherently results in a reduced space and reduced separation between different antennas and, because of that, antenna isolation deteriorates. Polarization and spatial diversity are mainly used for achieving large isolation between antennas. However, these two design techniques have limitations in case of high density and a large number of antennas integrated in a given system.
For preserving high antenna isolation (>30 dB), EBG structures can be placed between the radiating elements. An EBG structure is composed by an ideally infinite periodic assembly of unit cells with certain spectral characteristics optimized in such a way as to prevent the propagation of electromagnetic waves in a specified band of frequency for al I incident angles and all polarization states. In real life, EBG structures are truncated. In a planar topology, they may be regarded as high impedance surfaces (HIS) which are capable of suppressing or attenuating surface waves propagating between antennas sharing the same platform or circuit board, this leading to high isolation. Furthermore, EBG structures can enhance the radiation characteristics of antennas, if the relevant design is optimized in a way that the reflected wave contributions interfere constructively with the waves radiated from the individual antenna.
EGB structures are designed for operation in a specific frequency band. The operating band gap depends on the size and geometry of the EBG unit cell. Conventional EBG structures with canonical unit cells (having square, triangular, hexagonal and circular shape) have been used for isolation enhancement between antenna elements in ΜΙΜΟ systems. However, there is a continuous need to further improve the performance of EBG structures.
It is a first object of the invention to provide an improved EBG structure.
It Is a second object of the invention to detail a new class of Improved EBG structures.
It is a third object of the invention to provide an improved EBG structure, by means of which isolation between antennas can be increased, In particular without compromising the size, the efficiency, the gain, and/or jeopardizing the radiation pattern characteristics of the antennas.
In order to achieve at least one of the aforementioned objects, the invention provides an EBG structure according to claim 1. The mathematical formula cited in claim 1 is also referred to as Gielis' formula. Shapes generated with this formula are generally known as super-shapes. Preferred embodiments of the EBG structure, also referred to as an EBG decoupling structure, are described in the dependent claims. The tiles are also referred to as patches.
To increase isolation between antennas while preserving the size of the end product where said antennas are to be integrated, without compromising efficiency, gain and radiation pattern characteristics of the antennas, a novel EBG structure has been developed and is proposed here. Such EBG structure can enhance antenna isolation by 5 to 10 dB as compared to conventional EBG solutions, while providing an additional isolation improvement of 10 to 20 dB with respect to the same system configuration without EBG de-couplers (Figurelb). This is achieved by tiling, at least partially, different super-shaped electrically conductive tiles (Figure 2a-2c) printed on a multi-layered dielectric substrate. The unit cells are typically placed on the same plane along two coordinate directions (XY) at a suitable (electrically small) distance from each other. The size of the unit cells and the separation between adjacent cells controls the operational frequency band of the EBG structure. For an EBG structure operating in the frequency range between 5.15 GHz and 5.875 GHz, the distance between adjacent cells typically varies from 0.1 to 0.4 millimetre. At least a number of unit cells, and possibly all cells, may have the same shape (design) and the same dimensions, it is, however, conceivable, that super-shaped unit cells with different geometries are combined together, such as complementarily shaped unit cells. The unit cells are preferably realized in a regular pattern onto the dielectric substrate.
In order to enhance the isolation properties of the EBG structure according to the invention, the following strategies can be implemented: firstly, it is possible to increase the dimensions (the length and/or the width and/or the thickness) of the EBG structure. Secondly, the density of unit cells embedded in the structure can be increased. Thirdly, the distance between adjacent unit cells can be reduced, e.g. by using complementarily shaped metal tiles (resulting in a fine tiling of the conductive layer applied onto the individual dielectric layer). Fourthly, the number of dielectric layers, as well as the number of conductive layers can be increased, wherein the number and/or design and/or size of the metal tiles may differ per layer.
Each dielectric layer is typically made of a dielectric (semi-)rigid plate or substrate. Each dielectric layer preferably comprises at least one dielectric base layer selected from the group consisting of: a paper base, a glass fibre cloth base, a composite base (CEM series), a laminated multilayer board base and, a special material base (ceramic, metal core base, etc.). More preferably, the dielectric layer comprises a composite material composed of woven fiberglass cloth with an epoxy resin binder that is flame resistant (self-extinguishing). A suitable example of this woven glass fibre cloth based material is FR4. The operating frequency band of the EBG structure is typically directly correlated to the thickness of the dielectric layer, in and in particular the overall thickness of the laminate of layers, said laminate also being referred to as a substrate. For an EBG structure operating in the frequency range from 5.15 GHz to 5.875 GHz, the substrate thickness is preferably between 2 mm and 5 mm, and is more preferably selected to be about 3 mm.
Each conductive tile forming, constituting, and/or making part of aEBG (unit) cell is commonly made of metal, preferably copper. However, other metals, like e.g. tin, aluminium, gold, palladium, zinc, cadmium, lead, chromium, nickel, silver and manganese may also be used. Commonly, though not necessarily, all unit cells are made out of the same material. Typically, each cell is physically connected by means of a conductive pin, also referred to as a “via, directly or indirectly to the ground plane. In case the EBG structure comprises a plurality of dielectric layers and a plurality of conductive layers, wherein each conductive layer is applied onto a dielectric layer and comprises a pattern of super-shaped tiles. Preferably, tiles positioned on the top of each other are mutually physically connected by means of pins (vias), wherein the tile positioned closest to the ground plane is physically connected to the ground plane by means of a pin (via). The assembly of tiles stacked on top of each other, wherein the tiles are mutually connected by means of a via, is also referred to as a EBG unit cell. Here, the EBG unit cell may comprise dielectric material positioned in between (each) two tiles stacked onto each other. Each pin (via) extends along a through-hole made in a dielectric layer, and preferably each dielectric layer. Each pin (via) preferably extends along a through-hole made in the dielectric laminate (substrate). The diameter of the pin (via) can also be used to fine tune the frequency response of the EBG structure. For an EBG structure operating in the frequency range from 5.15 GHz to 5.875 GHz, the typical diameter of each pin (via) and each through-hole is selected to be between 0.25 and 1.0 mm, and is preferably set equal to about 0.9 mm.
As already indicated above, the radio-frequency characteristics and effectiveness of the EBG structure can greatly be enhanced by using complementary tiling of supershaped tiles. In this way, the EBG structure according to the invention, and consequently an antenna system wherein one or more of said EBG structures are used and/or integrated, can be made smaller (more compact). The EBG structure can have various geometries, such as a (rectangular) strip, a cube, a ring, an angular shape or any other imaginable shape. The EBG structure may also have a more complicated shape, and may e.g. comprises multiple EBG structure segments which are mutually connected and which mutually enclose an angle.
The ground plane is commonly formed of a thin sheet or plate, typically with a thickness of less than 1 mm. The shape and dimensions of (a top view of) the ground plane may be identical to the shape and dimensions of (a top view of) the (lowest) dielectric layer to which the ground plane is connected. The ground plane and/or at least one dielectric layer preferably has a base profile defined by the polar function:
1 m, — cos—L (0 +/ /
a 4
. m., — srn--φ b 4 a, b e R+: , m2, n3, n2, n3 e R, a, b, η, Ψ 0 wherein:
- pd(q>) is a curve located in the XY-plane; and
- φ e [0, 2n) is the angular coordinate.
In a preferred embodiment the dielectric layer and/or the ground plane has at least one base profile, which is substantially supershaped, wherein m > 4. This parameter condition leads to unconventional symmetric shape of the dielectric layer and/or ground plane including sharp edges. A further preferred boundary condition is that a # b, and preferably that at least one value of n1, n2, and n3 deviates from 2. Also these boundary conditions lead to an unconventionally shaped dielectric layer and/or ground plane.
The dielectric layer(s) and/or ground plane can either be flat or non-planar, such as curved and/or segmented.
In a preferred embodiment, the EBG structure comprises: a shared (or common) ground plane, and a plurality of distant EBG components disposed on said shared ground plane, wherein each EBG component comprises: at least one dielectric layer, and a plurality of conductive tiles disposed on each dielectric layer and electromagnetically coupled to the shared ground plane, wherein at least a number
function:
1 m, cos—l(D +/ 1 . — si m. n——
a 4 b 4
wherein:
- Pd(q>) is a curve located in the XY-plane; and
- φ e [0, 2n) is the angular coordinate.
Example of applications of the proposed class of EBG structures according to the invention include fencing for isolation enhancement in ΜΙΜΟ antenna systems. The EBG structure is configured to operate in various regions of the electromagnetic spectrum, such as radio waves, microwaves, millimetre waves, Terahertz frequencies and visible light as well as, typically, the Wi-Fi bands (2.4 GHz / 5 GHz).
The invention also relates to a EBG component, In particular a metal tile and/or a ground plane and/or a dielectric layer, for use in an EBG structure according to the invention. Preferably, said EBG component comprises at least one dielecfric layer configured to be disposed on a ground plane; and a plurality of conductive (metal) tiles disposed on each dielectric layer and configured to be electrically connected to the ground plane, wherein at least a number of (metal) tiles has a base profile defined by the polar function:
P/<P) =
Γ
a, b e If; , m2, n}, n2, n2 e R, a, b, n, 0 wherein:
- Pd(cp) is a curve located in the XY-plane; and
- φ e [0, 2n) is the angular coordinate.
The invention further relates to an antenna device comprising: at least one EBG structure, in particular according to the invention, said EBG structure comprising: a ground plane (also referred to as ground substrate), and at least one EBG component disposed on said ground plane, wherein each EBG component comprises: at least one dielectric layer, and a plurality of conductive tiles disposed on each dielectric layer and electrically connected to the shared ground plane, wherein at least a number of tiles has a base profile defined by the polar function:
m, —cos— a 4
. m. I — sin —-φ I b 4 I a, b e R+: , m2, nx, n2, n3 e R, a, b, η, Ψ 0 wherein:
- pd(q>) is a curve located in the XY-plane; and φ e [0, 2n) is the angular coordinate.
wherein the antenna device further comprises a plurality of antenna units, wherein the ground plane of the EBG structure serves as ground plane for at least one antenna unit, and wherein at least one EBG component is positioned in between two antenna units. The antenna units may be identical antenna units, although it is /
imaginable that at least two different types of antenna units are used in the antenna device.
Preferably, at least one antenna unit used in the antenna device according to the invention is formed by a dual-band antenna unit, wherein the outside of the antenna unit is of a multi-faced design which is supported by a support body that is designed to be mounted onto the ground plane of the antenna device, wherein the outside of the component includes the following faces: a top face which is provided with an electrically conductive flare layer that encloses at least one flare slot; one or two side faces adjacent to the top face that are provided with an electrically conductive feed strip and an electrically conductive ground strip which strips are both electrically connected to the flare layer; a bottom face that is not adjacent to the top face, which is designed to be mounted onto the ground plane; wherein the ground strip is electrically connectable to the ground plane onto which the component is to be mounted, and wherein the feed strip is electrically connectable to an appropriate RF chain. Preferably, the dual-band antenna is operable in the frequency ranges of 2.4 - 2.5 GHz and 4.9 - 6.0 GHz. A more detailed description of further this dual-band antenna unit is described in the non-prepublished Dutch patent application NL2019365, the subject-matter of which patent application is hereby incorporated by reference.
Preferably, at least one (other) antenna unit used in the antenna device according to the invention is formed by a dual-port antenna unit, also referred to as a dual antenna. The dual-port antenna is in fact an antenna assembly, wherein at least two different antennas are combined and, preferably, integrated. More in particular, the dual-port antenna comprises at least one slot antenna and at least one dipole antenna. The dual-port antenna preferably comprises:
- at least one slot antenna, comprising:
o a first dielectric substrate, o a first conductive ground plane provided with at least one, preferably I-shaped, slot attached to a first side of the first dielectric substrate, and o at least one first probing structure connected to a second side, opposite to the first side, of the dielectric substrate; and
- at least one dipole antenna, comprising:
c> second dielectric substrate, o at least two conductive patches (or arms) applied onto a first side of the second dielectric substrate, wherein the patches (or arms) are positioned at a distance from each other, o at least one second probing structure connected to said patches (or arms), and o at least one second ground plane positioned at a distance from said second dielectric substrate, wherein the second ground plane faces a second side, opposite to the first side, of the second dielectric substrate;
and wherein the at least one slot antenna is positioned in between the second dielectric substrate and the second ground plane, such that the second dielectric substrate and the second ground plane engage with opposite side edges of the at least one slot antenna. Hence, the slot antenna acts as distance holder for spacing the second ground plane and the second dielectric substrate apart. To stabilize this antenna assembly, It is preferred to apply one or more further dielectric distance holders, e.g. plastic pins, wherein each further distance holder co-acts with both the second dielectric substrate and the second ground plane. Preferably, the second dielectric substrate and the second ground plane are oriented substantially parallel.
More preferably, the second dielectric substrate and the second ground plane are oriented substantially perpendicular with respect to the first dielectric substrate. This will commonly improve the isolation between both antennas (less interference). The patches (arms), also referred to as flares, preferably have a base profile defined by the polar function:
p/<P) =
1 m, — cos— ' y
ci 4
a,b eR’eR, adxn, wherein:
pd(cp) is a curve located in the XY-plane; and φ e [0, 2n) is the angular coordinate.
Hence, the patches (dipole antenna arms) preferably have a supershaped base profile.
3Γ~ □
Preferably, one side edge of the slot antenna is positioned substantially in between the patches (dipole antenna arms). This will commonly (also) improve the isolation between both antennas (less interference). Commonly, this dual-port antenna is configured for use in a single frequency band, such as 5Ghz. The dipole antenna and the slot antenna can be activated selectively and independent of each other. To this end, an electronic switch can be applied. It is imaginable that the dipole antenna and the slot antenna operate simultaneously. Typically, the slot antenna has a quasiomnidirectional radiation pattern (with respect to the plane of the slot antenna). This makes the slot antenna ideally suitable to be activated when mounted onto a ceiling. The dipole antenna has a broadside radiation pattern, which makes this antenna ideally suitable to be used when mounted to a wall. The second dielectric substrate is preferably configured to attach the dual-port antenna to a supporting structure, such as the ground plane or another substrate of the antenna device. To this end, the second dielectric substrate may be provided with fastening holes. The dual-port antenna described above, and in the figure’s description below can be produced and marketed separately, and may therefore be regarded as separate invention (apart from the EBG structure).
The invention will be elucidated on the basis of non-limitative exemplary embodiments shown in the enclosed figures. Herein:
figure 1a shows a schematic representation of an antenna device according to the invention;
figure 1 b shows a graph of the isolation enhancement which can be achieved by the antenna device of figure 1a;
figures 2a-c show schematic representations of an EBG structure according to the invention;
figures 3a and 3b show schematic representations of further embodiment of an antenna device according to the invention;
figure 4 shows a schematic representation of a possible single supershape structure of an EBG component according to the invention;
figure 5 shows a schematic representation of a possible dual supershape structure of an EBG component according to the invention;
figure 6 shows a schematic representation of a single supershape structure of an EBG component according to the invention;
figures 7a-h show a plurality of examples of possible shapes of base profiles of conductive patches of EBG components according to the invention;
figure 8 shows a schematic representation of a supershaped EBG component; figures 9a-h show a plurality of examples of possible supershapes of EBG components according to the invention;
figure 10 shows a schematic representation of a supershaped EBG component comprising two independent supershaped structures according to the invention; figure 11 shows a perspective view of a supershaped structure as shown in figure 10;
figures 12a-c show the measurement set-up of three different antenna devices, wherein figure 12c shows an antenna device according to the invention;
figure 12d shows a graph of the isolation enhancement between the antenna devices as shown In figures 12a-c;
figures 13a and 13b show an antenna unit according to the invention, in particular a single-band antenna unit as shown in figures 12a-c; and figure 14 shows in more detail the ground plane and the slot antenna of the antenna unit shown in figure 13.
Figure 1a shows a schematic representation of an antenna device (1) according to the invention. The antenna device (1) comprises a conductive metal plate (3), also referred to as ground plane (3), and an electromagnetic band gap (EBG) component (4) disposed on said ground plane (3). The assembly of the EBG component (4) and the ground plane (3) is referred to as an EBG structure according to the invention. The EBG component (4) comprises a plurality of conductive tiles (6), arranged according to a periodic pattern andseparated by small gaps. Tiles (6) positioned on top of each other are mutually connected by means of vias (not shown), by means of which the tiles (6) are connected to the ground plane (3). The EGB component (4) comprises at least one dielectric layer (5) disposed on said ground plane (3) and a plurality of conductive tiles (6) disposed on the dielectric layer (5) and electrically connected to the shared ground plane (3). The conductive tiles (6) have a base profile defined by the polar function of the Gielis’ Formula. More detailed sketches of the EBG structure (4) are shown in figures 2ac. The antenna device (1) furthermore comprises a plurality of antenna units (7, 8). In the shown embodiment, the antenna device (1) comprises a first antenna unit (7) and a second antenna unit (8). The metal plate (3) of the antenna device (1) serves as a ground plane (3) for said plurality of antenna units (7,8). In the shown configuration, the EBG component (4) is positioned in between two antenna units (7, 8). The EBG component (4) functions as an additional coupling path between the two antennas (7, 8). The presence of the EBG component (4) increases the isolation between the first antenna unit (7) and the second antenna unit (8) without compromising efficiency, gain and radiation pattern characteristics of the antennas (7, 8).
Figure 1b shows a graph of the isolation enhancement between an antenna device (1) which makes use of an EBG component (4), as shown in figure 1b, and an antenna device without an EBG component. The x-axis shows the frequency (in GHz) and the y-axis shows the isolation value (in dB). Figure 1b shows that the EBG component according to the invention can improve isolation by 10 to 20 dB as compared to systems without an EBG component. This is achieved by tiling a laminate using supershaped conductive tiles based on the Gielis Formula, which laminate is shown in more details in figures 2a-2c.
Figures 2a-c show schematic representations of the EBG component (4) as shown in figure 1a. Corresponding reference signs therefore correspond to similar units. The EGB component (4) comprises a first dielectric layer (5A) and a second dielectric layer (5B). The first dielectric layer (5A) and the second dielectric layer (5B) are disposed on top of each other, and form a laminate together. Both dielectric layers (5A, 5B) comprise a plurality of conductive tiles (6A, 6B). The tiles (6A, 6B) of each dielectric layer (5A, 5B) have a base profile defined by the Gielis’ formula, resulting in a supershaped profile. In the shown embodiment, the tiles (6A) of the first dielectric layer (5A) are arranged in a periodic pattern. The tiles (6B) of the second dielectric layer (5B) are arranged according to substantially the same pattern as the periodic pattern of the first dielectric layer (5A). The conductive tiles (6A, 6B) on both dielectric layers (5A, 5B) can both be physically connected to the ground plane (not shown) by the same via conductor (9). The EBG component (4) comprises a plurality of via conductors (9), wherein each via conductor (9) is enclosed by a through-hole (10) made in each dielectric layer (5A, 5B). Reference number 5” of figure 2c indicates the stacked dielectric layers (5A, 5B).
Figures 3a and 3b show a schematic representation of another possible embodiment of an antenna device (11) according to the invention. Figure 3a shows a perspective view, whereas figure 3b shows a top view. The antenna device (11) comprises a (shared) ground plane (13) and a plurality of EBG components (14A, 14B) disposed on the ground plane (13). The EBG components (14A, 14B) each comprises a plurality of dielectric layers, and a plurality of conductive tiles disposed on each dielectric layer and electromagnetically coupled to the shared ground plane (13). Stacked tiles are connected by means of vias, wherein each via is also connected to the ground plane (13). The antenna device (11) comprises a first EBG structure (14A) and a second EBG structure (14B). Both the first and the second EBG structures (14A, 14B) are substantially similar to the EBG structure shown in figures 2a-c. The antenna device (11) furthermore comprises a plurality of dualband antenna units (17A, 17B, 17C, 18A, 18B, 180). Each dual-band antenna unit (17A, 17B, 170, 18A, 8B, 8C) is configured to operate in various regions of the electromagnetic spectrum, such as for example the Wi-Fi bands (2.4 GHz / 5 GHz). The antenna device (11) also comprises a plurality of single-band antenna units (19A, 19B, 190, 19D). Each single-band antenna unit (19A, 19B, 190, 19D) Is configured to operate for example at 5 GHz. The arrangement of the single-band antenna units (19A, 19B, 190, 19D) Is a non-limitative example of a possible arrangement of the antenna units. A more detailed description of this dual-band antenna unit (19A, 19B, 190, 19D) is provided in the non-prepublished Dutch patent applications NL2019365 and NL2019798, the subject-matter of which patent applications is hereby incorporated by reference.
Figure 4 shows a schematic representation of a possible single supershaped structure of an EBG component (24) according to the invention. The EGB component (24) comprises a first dielectric layer (25A), a second dielectric layer (25B) and a third dielectric layer (250). The dielectric layers (25A, 25B, 250) are disposed on top of each other, and form a laminate together. Each dielectric layer (25A, 25B, 25C) comprises a plurality of conductive tiles (26A, 26B, 260). The tiles (26A, 26B, 260) of each dielectric layer (25A, 25B, 250) have a base profile defined by the Glells’ formula. The tiles (26A, 26B, 26C) featuring supershaped geometry are also shown isolated from the dielectric layer in this figure. The conductive tiles (26A, 26B, 26C) are physically connected to each other and to the ground plane (23) by a via (29).
Figure 5 shows a schematic representation of a possible dual complementarily supershaped unit cell of an EBG component (34) according to the invention, and of an EBG structure according to the invention. The figure shows a first supershaped structure (S1) and a second supershaped structure (S2). The EBG component (34) consists of a three layer (35A, 35B, 35C) dielectric laminate structure. The supershapes (S1, S2) are separated from each other by small gaps (30).
Figure 6 shows a schematic representation of a single supershaped structure of an EBG component (44). The EBG component (44) is a single layer (45) component. The shape of the conductive tiles (46) is defined by the polar function of the Gielis Formula.
Figures 7a-h show a plurality of examples of possible shapes of base profiles (20ah) of conductive tiles of EBG components according to the invention. Each base profile (20a-h) has a different supershape based on the Gielis’ formula:
Pj ( Φ) ~.....
1 m. — COS— +/
a 4
a, b e R*; m,, m2, nx, n2, n3 e R, a, b, n, wherein:
- Pd(cp) is a curve located In the XY-plane; and
- φ e [0, 2n) is the angular coordinate.
Each figure reports the parameter values used in the Gielis’ formula to create the shown supershape. The parameter m determines the number of pseudo-vertices of the supershaped base profile (20a-h). The parameters n1, n2 and n3 determine the convexity/concavity characteristics of the supershaped curve. The parameters a and b are fixed in the shown examples and determine the area of the curve.
Figure 8 shows a schematic representation of a supershaped EBG component. The figure shows a unit cell (80). The unit cell (80) is a supershaped structure that repeats itself infinitely with a repetition factor dx and dy. A perspective view of one isolated unit cell (80) is shown. The unit cell (80) comprises at least one conductive tile (86). The figures show that the conductive layer (86) can comprise a first supershaped tile (S1) or a second supershaped tile (S2). The second supershaped structure (S2) is complementary to the first supershaped structure (S1). This results in that the unit structure comprises two dependent supershapes. The dielectric substrate layer (85) is only shown in the first perspective view and is made invisible in the second
3r~ □
perspective view. The supershapes (S1, S2) are separated by a gap (G). Each conductive tile (86) is physically connected to the ground plane (83) by an individual via (89). The thickness of the substrate (85) is for example 3 mm, the material can be FR4 (relative permittivity=4.3, tan delta 0.025), the diameter of the via (89) is for example 0.9 mm, and the gap is for example 0.26 mm. The supershape of the tiles in figure 8 are based on the Gielis’ formula, using the following parameters: a-b-2.44 mm, m=8, n1=n2=n3=5.
Figures 9a-h show a plurality of examples of possible complementary supershapes of EBG components according to the invention. The supershapes are created by changing only a single parameter (m) in contrast to the supershapes shown in figure 8. All figures 9a-h show a structure which comprises two dependent complementary supershapes (S1, S2).
Figure 10 shows a schematic representation of a supershaped EBG structure comprising two independent supershaped tiles (S1 and S2). The independent supershapes (S1, S2) are separated by each other via a gap (G).
The Gielis equation parameters for obtaining the first tile (S1) as shown in this figure are: a= b=1, m = 4, n1= 2.1 and n2=n3= 9.
The Gielis equation parameters for obtaining the second tile (S2) as shown in this figure are: a~ b~2.26, m = 4, n1= 10 and n2=n3= 11. The dimension of a and b is typically related to the ratio of n1 to n2=n3.
Figure 11 shows a perspective view of a supershaped structure as shown in figure 10, comprising two independent supershapes (S1, S2). Each supershaped tile is electrically connected to a ground plate by means of a via (119).
Figures 12a-c show the measurement set-up of three different antenna devices. The first antenna device (101) (fig. 12a) shows an antenna device without an EBG component. The second antenna device (201) (fig. 12b) shows an antenna device with two square-shaped EBG components (204). These are conventional EBG components, which do not comprise a supershape. The third antenna device (301) (fig. 12c) shows an antenna device (301) with two EBG components (304) comprising a supershaped structure. Each antenna device (101,201, 301) comprises a plurality of dual-band antenna units (107A, 107B, 108A, 108B, 108C, 207A, 207B, 208A, 208B, 208C, 307A, 307B, 308A, 308B, 308C). Each dual-band antenna unit (107A,
107B, 108A, 108B, 1080, 207A, 207B, 208A, 208B, 208C, 307A, 307B, SOSA, 308B, 308C) is configured to operate in various regions of the electromagnetic spectrum, such as for example Wi-Fi bands (2.4 GHz/5 GHz). Each antenna device (101,201, 301) also comprises a plurality of single-band antenna units (109A, 109B, 1090, 109D, 209A, 209B, 209C, 209D, 309A, 309B, 309C, 309D). Each single-band antenna units (109A, 109B, 109C, 109D, 209A, 209B, 2090, 209D, 309A, 309B, 3090, 309D) is configured to operate for example at 5 GHz. Each antenna device (101, 201, 301) comprises a conductive, metal ground plane (103, 203, 303). The EGB components (204, 304) are optimized to cover the 5.15 GHz-5.875 GHz frequency range. The EBG components of the second antenna device (201) and the third antenna device (301) are realized on the same substrate material. The dimensions of the EBG components (204, 304) are equal.
Figure 12d shows a graph of the isolation enhancement when comparing the first antenna device (101), to the second antenna device (201), to the third antenna device (301), as shown in figures 12a-c. The x-axis of the graph shows the frequency (in GHz) and the y-axis shows the isolation value (in dB). Figure 12d shows that using a conventional EBG component (204) already can improve isolation by about 5 dB as compared to the antenna system without an EBG component. The graph further shows that by using a supershaped EBG component (304) the isolation can be further improved by additional 5-1 OdB, at least.
Figures 13a and 13b show an antenna unit (109) according to the invention, in particular a single-band antenna unit as shown in figures 12a-c. This is referred to 109A, 109B, 109C, 109D, 209A, 209B, 2090, 209D, 309A, 309B, 3090 and 309D. Figures 13a and 13b show a different perspective view of the antenna unit (109). The antenna unit (109) is a dual-port antenna, comprising a slot antenna (130) and a dipole antenna (131). The single-band antenna (109) is configured to operate for example at 5 GHz. In the shown embodiment, both the slot antenna (130) and the dipole antenna (131) are configured to operate in the Wi-Fi band at 5 GHz.
The slot antenna (130) is mounted on a conductive ground plane (132). The ground plane (132) is shown in more detail in figure 14. The dipole antenna (131) comprises a RGB and is placed at a predefined distance (d1) from the ground plane (132). This distance is preferably relatively small, for example between 5 and 10 mm. Between the ground plane (132) and the dipole antenna (131) a distance holder (134) is present. In the shown embodiment, the distance holder (134) comprises a reinforcement rib (135). The distance holder (134) and/or reinforcement rib (135) can for example be made out of plastic. The dipole antenna (131) comprises two flares (133A, 133B). The shape of the conductive flares (133A, r~
133B) is defined by the polar function of the Gielis’ formula:
ρ,,ίφ)-
1 m. ί / 1 .
—- cos—-φ +/ — sin —+
a 4 ' / ™- b 4
a,b e ffC;,m,n3 e R, a,b,nx Φ 0
Where the x-dimension of the flare is scaled by a factor Ki according to:
= K3 pd (<p) cos(0) and the y-dimension of the flare is scaled by a factor K2 according to: Υά(φ) = K2 pd (<p)sin(ö)
The optimized parameters for the dipole flares as shown in the figure are Ki =5.3 mm, K2=4.2 mm, a=b=1, m=1, n1=18and n2=n3=2.2. Possibly the parameters for the dipole flares can be chosen within the following ranges: Ki=5.3-5.4, K2=4.2-5.2, 20 a=b=1, m=1.2, n1=15-50, n2=n3=2.2-5.
The flares (133A, 133B) are not in contact with each other. The distance between the flares (133A, 133B) is preferably about 0.3 mm. The slot antenna (130) is mounted perpendicular to the dipole antenna (131). Each flare (133A, 133B) is 25 positioned at a different side of the slot antenna (130) (as seen from a top view). The slot antenna (130) is shown in more detail in figure 14. The antenna unit (109) according to the invention features good Isolation characteristics. Furthermore, the antenna unit (109) according to the invention features well behaved radiation patterns. Another benefit is that the antenna unit according to the invention is 30 relatively easy to manufacture. Experiments show that the isolation between two ports, where the first port is connected to the dipole antenna (131) and the second port is connected to the slot antenna (130), is about 28 dB in the 5.15-5.875 GHz frequency range. This results in a total measured antenna efficiency for the first port between 75 and 80% and a total measured antenna efficiency for the second port 35 between 64 and 75%. The measured efficiency accounts for the losses of a 15 cm long 1.32 mm thick coaxial cable. The peak realized gain for the first port is between 5.4 dBi and 5.8 dBi. The peak realized gain for the second port is between 4.4 dBi and 5.5 dBi.
Figure 14 shows the antenna unit (109) of figure 13, and in more detail the ground plane (132) and the slot antenna (130). The ground plane (132) is a conductive metal plate (132). The ground plane (132) is for example manufactured from metal or stainless steel. The ground plane (132) comprises holes (137A) for positioning the antenna unit (109) on an antenna device according to the invention, in particular to the ground plane of such antenna device, via mechanical securing. The ground plane (132) furthermore comprises holes (137B) for enabling mounting the distance holder. The slot antenna (130) comprises a PCB which comprises a radiating slot (138). The radiating slot (138) is shown in the front side of the slot antenna (130). The radiating slot (138) has a Roman l-shaped configuration. Obviously, other slot configurations are also possible. For example, an H-shaped radiating slot. The back side of the slot antenna (130) comprises a feeding pin (139). A RF feeding cable can be connected to the feeding pin (139).
In a possible embodiment, the antenna unit can be modified such that it is configured to operate at both 5 GHz and 2.4 GHz. The dipole antenna (131) can for example operate at 2.4 GHz and the slot antenna (130) can operate at 5 GHz, or vice versa.
It will be apparent that the invention is not limited to the working examples shown and described herein, but that numerous variants are possible within the scope of the attached claims that will be obvious to a person skilled in the art.
The above-described inventive concepts are illustrated by several illustrative embodiments. It is conceivable that individual inventive concepts may be applied without, in so doing, also applying other details of the described example. It is not necessary to elaborate on examples of all conceivable combinations of the abovedescribed inventive concepts, as a person skilled in the art will understand numerous inventive concepts can be (re)combined in order to arrive at a specific application.
The verb “comprise” and conjugations thereof used in this patent publication are understood to mean not only “comprise”, but are also understood to mean the kJ phrases “contain”, “substantially consist of”, “formed by” and conjugations thereof.

Claims (26)

ConclusiesConclusions 1. Elektromagnetische Band Gap- (EBG-) structuur omvattende:An electromagnetic band gap (EBG) structure comprising: een geleidend grondvlak, ten minste één op het grondvlak aangebrachte diëlektrische laag; en een aantal op elke diëlektrische laag aangebrachte geleidende tegels, dat elektrisch met het grondvlak is verbonden, waarbij ten minste een aantal tegels een basisprofiel heeft dat is bepaald door de polaire functie:a conductive base, at least one dielectric layer disposed on the base; and a number of conductive tiles arranged on each dielectric layer, electrically connected to the ground surface, at least a number of tiles having a base profile determined by the polar function: a,b e R^m,,m2,nx,n2,n3 eR, a,b,n{ 0 waarin:a, be R ^ m ,, m 2 , n x , n 2 , n 3 eR, a, b, n { 0 where: - pd(q>) een in het XY-vlak gelegen kromme is; en- pd (q>) is a curve located in the XY plane; and - φ e [0, 2n) de hoekcoördinaat is.- φ e [0, 2n) is the angular coordinate. 2. EBG-structuur volgens conclusie 1, waarbij alle tegels een basisprofiel hebben dat is bepaald door de polaire functie:2. EBG structure according to claim 1, wherein all tiles have a basic profile that is determined by the polar function: a,b & \m},m2,n},n2,n3 eR, a,b,n} a() waarin:a, b & \ m } , m 2 , n } , n 2 , n 3 eR, a, b, n } a () where: - pd(rp) een in het XY-vlak gelegen kromme is; en- pd (rp) is a curve located in the XY plane; and - φ e [0, 2n) de hoekcoördinaat is.- φ e [0, 2n) is the angular coordinate. 3. EBG-structuur volgens conclusie 1 of 2, waarbij de EBG-structuur een aantal verschillend gevormde geleidende tegels omvat, dat op elke diëlektrische laag is aangebracht en elektrisch met het grondvlak is verbonden, waarbij bij voorkeur alle tegels een basisprofiel hebben dat is bepaald door de polaire functie:3. EBG structure according to claim 1 or 2, wherein the EBG structure comprises a number of differently shaped conductive tiles, which is applied to each dielectric layer and is electrically connected to the base, all tiles preferably having a base profile that is determined by the polar function: Ρ/φ) = a,b e Μ*;ζμ,,eR, a,b,n{ +0 waarin:Ρ / φ) = a, be Μ *; ζμ ,, eR, a, b, n { +0 where: - pd(cp) een in het XY-vlak gelegen kromme is; en- pd (cp) is a curve located in the XY plane; and - φ e [0, 2n) de hoekcoördinaat is.- φ e [0, 2n) is the angular coordinate. 4. EBG-structuur volgens conclusie 3, waarbij de basisprofielen van ten minste twee verschillend gevormde tegels een ten minste gedeeltelijk complementaire vorm hebben.The EBG structure of claim 3, wherein the base profiles of at least two differently shaped tiles have an at least partially complementary shape. 5. EBG-structuur volgens één van de voorgaande conclusies, waarbij de op elke diëlektrische laag aangebrachte metaaltegels in een patroon zijn aangebracht, bij voorkeur een periodiek patroon.EBG structure according to one of the preceding claims, wherein the metal tiles arranged on each dielectric layer are arranged in a pattern, preferably a periodic pattern. 6. EBG-structuur volgens één van de voorgaande conclusies, waarbij de op elke diëlektrische laag aangebrachte tegels op een afstand van elkaar zijn aangebracht.EBG structure according to one of the preceding claims, wherein the tiles arranged on each dielectric layer are arranged at a distance from each other. 7. EBG-structuur volgens één van de voorgaande conclusies, waarbij ten minste een aantal tegels prismatisch is gevormd.EBG structure according to one of the preceding claims, wherein at least a number of tiles are prismatically shaped. 8. EBG-structuur volgens één van de voorgaande conclusies, waarbij ten minste een aantal tegels een in hoofdzaak vlakke (2D-) geometrie hebben.EBG structure according to one of the preceding claims, wherein at least a number of tiles have a substantially flat (2D) geometry. 9. EBG-structuur volgens één van de voorgaande conclusies, waarbij elke tegel fysiek met het grondvlak is verbonden door middel van een geleidende via, die wordt omsloten door een in ten minste één diëlektrische laag gemaakt doorgaand gat.9. EBG structure according to one of the preceding claims, wherein each tile is physically connected to the ground surface by means of a conductive via, which is enclosed by a through hole made in at least one dielectric layer. 10. EBG-structuur volgens één van de voorgaande conclusies, waarbij de EBGstructuur een aantal gestapelde of boven op elkaar aangebrachte diëlektrische lagen omvat, waarbij er een aantal geleidende tegels op elke diëlektrische laag is aangebracht.The EBG structure according to any of the preceding claims, wherein the EBG structure comprises a number of stacked or superimposed dielectric layers, a plurality of conductive tiles being arranged on each dielectric layer. 11. EBG-structuur volgens conclusie 10, waarbij het aantal op een diëlektrische laag aangebrachte geleidende tegels en het aantal op een andere diëlektrische laag aangebrachte geleidende tegels volgens in hoofdzaak hetzelfde patroon is aangebracht.11. EBG structure according to claim 10, wherein the number of conductive tiles arranged on one dielectric layer and the number of conductive tiles arranged on another dielectric layer are arranged in substantially the same pattern. 12. EBG-structuur volgens conclusie 9 en conclusie 10 of 11, waarbij een aantal op verschillende diëlektrische lagen aangebrachte tegels fysiek met het grondvlak is verbonden door middel van dezelfde viageleider, die wordt omsloten door een in elke diëlektrische laag gemaakt doorgaand gat.12. EBG structure according to claim 9 and claim 10 or 11, wherein a number of tiles arranged on different dielectric layers is physically connected to the ground surface by means of the same via conductor, which is enclosed by a through hole made in each dielectric layer. 13. EBG-structuur volgens conclusie 9 en conclusie 10 of 11, waarbij een aantal op verschillende diëlektrische lagen aangebrachte tegels fysiek met het grondvlak is verbonden door middel van dezelfde via, die wordt omsloten door een in elke diëlektrische laag gemaakt doorgaand gat.The EBG structure according to claim 9 and claim 10 or 11, wherein a plurality of tiles arranged on different dielectric layers is physically connected to the ground surface through the same via, which is enclosed by a through hole made in each dielectric layer. 14. EBG-structuur volgens één van de voorgaande conclusies, waarbij a + b.EBG structure according to one of the preceding claims, wherein a + b. 15. EBG-structuur volgens één van de voorgaande conclusies, waarbij ten minste één waarde van ni, n2 en n3 afwijkt van 2.EBG structure according to one of the preceding claims, wherein at least one value of n 1, n 2 and n 3 deviates from 2. 16. EBG-structuur volgens één van de voorgaande conclusies, waarbij de parametrische voorstelling van de driedimensionale vorm van ten minste een aantal tegels, in het bijzonder tegels aangebracht op een bovenste diëlektrische laag, is gebaseerd op twee loodrechte dwarsdoorsnedes pi(Θ) en ρ2(φ):EBG structure according to one of the preceding claims, wherein the parametric representation of the three-dimensional shape of at least a number of tiles, in particular tiles applied to an upper dielectric layer, is based on two perpendicular cross sections pi (Θ) and ρ 2 (φ): x = ρλ (id) cos d.p2 (φ) cos φ y - ρ^ϋ)sin ϋ·.ρ2(φ)οο^φ z-ρ2(φρήηφ waarin:x = ρ λ (id) cos dp 2 (φ) cos φ y - ρ ^ ϋ) sin ϋ · .ρ 2 (φ) οο ^ φ z-ρ 2 (φρήηφ where: - p is bepaald door de in conclusie 1 gepresenteerde functie,- p is determined by the function presented in claim 1, - 0 < θ < 2ττ, en- 0 <θ <2ττ, and - - 1/2K < φ < 1/2ττ.- - 1 / 2K <φ < 1 / 2ττ. 17. EBG-structuur volgens één van de voorgaande conclusies, waarbij de ten minste ene diëlektrische laag een rechthoekige vorm heeft.The EBG structure according to any of the preceding claims, wherein the at least one dielectric layer has a rectangular shape. 18. EBG-structuur volgens één van de voorgaande conclusies, waarbij de ten minste ene diëlektrische laag een ringvorm heeft.The EBG structure of any one of the preceding claims, wherein the at least one dielectric layer has a ring shape. 19. EBG-structuur volgens één van de voorgaande conclusies, waarbij de ten minste ene diëlektrische laag een rechthoekige vorm heeft.The EBG structure of any one of the preceding claims, wherein the at least one dielectric layer has a rectangular shape. 20. EBG-structuur volgens één van de voorgaande conclusies, waarbij het grondvlak een rechthoekige en/of schijfachtige vorm heeft.EBG structure according to one of the preceding claims, wherein the base has a rectangular and / or disk-like shape. 21. EBG-structuur volgens één van de voorgaande conclusies, waarbij het grondvlak groter is dan de ten minste ene diëlektrische laag.The EBG structure according to any of the preceding claims, wherein the ground plane is larger than the at least one dielectric layer. 22. EBG-structuur volgens één van de voorgaande conclusies, waarbij het grondvlak en/of ten minste één diëlektrische laag een basisprofiel heeft dat is bepaald door de polaire functie:The EBG structure according to any of the preceding claims, wherein the ground plane and / or at least one dielectric layer has a basic profile that is determined by the polar function: 1 m,1 m, -cos— sin—®-cos— sin — ® 4 Ψ «,άew2,zzi5«2,n3 eR, a,b,ns + 0 waarin:4 Ψ «, άew 2, zz i5« 2, N 3, a, b, n s + 0 in which: - Ροΐ(φ) een in het XY-vlak gelegen kromme is; en- Ροΐ (φ) is a curve located in the XY plane; and - φ e [0, 2n) de hoekcoördinaat is.- φ e [0, 2n) is the angular coordinate. 23. EBG-structuur volgens één van de voorgaande conclusies, waarbij de EBG- structuur omvat:The EBG structure of any one of the preceding claims, wherein the EBG structure comprises: - een gedeeld grondvlak, en- a shared ground plane, and - een aantal op het gedeelde grondvlak aangebrachte op afstand gelegen- a number of remotely arranged on the shared ground surface EBG-componenten, waarbij elke EBG-component omvat:EBG components, each EBG component comprising: o ten minste één diëlektrische laag, en o een aantal geleidende tegels dat op elke diëlektrische laag is aangebracht en elektromagnetisch met het gedeelde grondvlak is gekoppeld, waarbij ten minste een aantal tegels een basisprofiel heeft dat is bepaald door de polaire functie:o at least one dielectric layer, and o a number of conductive tiles applied to each dielectric layer and electromagnetically coupled to the divided ground surface, at least a number of tiles having a basic profile determined by the polar function: ρ/φ) =ρ / φ) = 1 . m, — sin— b 4 a,b e ',mx,m2,nx,n2,n3 eR, a,b,nx ^0 waarin:1. m, - sin - b 4 a, be ', m x , m 2 , n x , n 2 , n 3 eR, a, b, n x ^ 0 where: - Pd(<p) een in het XY-vlak gelegen kromme is; en- Pd (<p) is a curve located in the XY plane; and - φ e [0, 2n) de hoekcoördinaat is.- φ e [0, 2n) is the angular coordinate. 24. EBG-component voor gebruik in een EBG-structuur volgens één van de voorgaande conclusies, waarbij de component ten minste één diëlektrische laag omvat die is uitgevoerd om op een grondvlak van een EBG-structuur te worden aangebracht; en een aantal geleidende vlakken dat op elke diëlektrische laag is aangebracht en is uitgevoerd om elektromagnetisch met het grondvlak te worden gekoppeld, waarbij ten minste een aantal vlakken een basisprofiel heeft dat is bepaald door de polaire functie:An EBG component for use in an EBG structure according to any one of the preceding claims, wherein the component comprises at least one dielectric layer designed to be applied to a base of an EBG structure; and a plurality of conductive surfaces disposed on each dielectric layer and configured to be electromagnetically coupled to the ground surface, at least a plurality of surfaces having a base profile defined by the polar function: Prf(<P) = a,b e W;mx,m2,nx,n2,n3 eR, a,b,nx ^0 waarin:P rf (<P) = a, be W; m x , m 2 , n x , n 2 , n 3 eR, a, b, n x ^ 0 where: - pa(cp) een in het XY-vlak gelegen kromme is; en φ e [0, 2n) de hoekcoördinaat is.pa (cp) is a curve located in the XY plane; and φ e [0, 2n) is the angular coordinate. 25. Antenne-inrichting omvattende:25. Antenna device comprising: - ten minste één EBG-structuur, in het bijzonder volgens één van de conclusies 1 tot en met 23, waarbij de EBG-structuur omvat:- at least one EBG structure, in particular according to one of claims 1 to 23, wherein the EBG structure comprises: o een grondvlak, en o ten minste één op het grondvlak aangebrachte EBG-component, waarbij elke EBG-component omvat:o a base, and o at least one EBG component disposed on the base, each EBG component comprising: ten minste één diëlektrische laag, en een aantal geleidende tegels dat op elke diëlektrische laag is aangebracht en elektrisch met het gedeelde grondvlak is verbonden, ρ/φ) waarbij ten minste een aantal tegels een basisprofiel heeft dat is bepaald door de polaire functie:at least one dielectric layer, and a plurality of conductive tiles applied to each dielectric layer and electrically connected to the shared ground surface, ρ / φ) wherein at least a plurality of tiles have a basic profile determined by the polar function: 1 m, — cos—Lcp a 4 «2 +/ / / 1 . m, ' — sin—-q>1 m, - cos - L cp a 4 «2 + / / / 1. m, '- sin - q> - b 4 «3 a,b eR, a,b,n} ^ 0 waarin:- b 4 «3 a, b eR, a, b, n } ^ 0 in which: - pd(cp) een in het XY-vlak gelegen kromme is; en- pd (cp) is a curve located in the XY plane; and - φ e [0, 2n) de hoekcoördinaat is; en- φ e [0, 2n) is the angular coordinate; and - een aantal antenne-eenheden, waarbij het grondvlak van de EBG-structuur dient als een grondvlak voor het aantal antenne-eenheden, en waarbij ten minste één EBG-component tussen twee antenne-eenheden in is gepositioneerd.- a number of antenna units, wherein the base of the EBG structure serves as a base for the number of antenna units, and wherein at least one EBG component is positioned between two antenna units. 26. Antenne-inrichting volgens conclusie 25, waarbij de EBG-structuur een aantal EBG-componenten omvat dat hetzelfde grondvlak deelt, waarbij het gedeelde grondvlak van de EBG-componenten dient als een grondvlak voor het aantal antenne-eenheden.The antenna device of claim 25, wherein the EBG structure comprises a plurality of EBG components that share the same ground plane, the shared ground plane of the EBG components serving as a ground plane for the plurality of antenna units. Fiq. 1bFiq. 1b ÖO 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0.000 0000 0000 0000 0000 0000 0000 00000000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0.000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 Ο Ο 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 ο ο 0000 0000 Θ000 0000 0000 Θ000 0000 0000 0000 0000 0000 0000 0000 0000 ο ο 0000 0000 0000 0000 ι or ι or 0000 0000
n1 = 1 m ™ 7 n1 1 n2 = 1 n3 = 1 a = 1 b = 1n1 = 1 m ™ 7 n1 1 n2 = 1 n3 = 1 a = 1 b = 1 Fkl 7dFkl 7d W* m = 6 n1 ™ 1 n2 = 1 n3 = 1 a = 1 b = 1 m ··· 6 n1 1.5 n2 = 1 n3 = 1 a 1 b = 1 m = 6 n1 ™ 2 n2 = 1 n3 = 1 a = 1 b = 1W * m = 6 n1 ™ 1 n2 = 1 n3 = 1 a = 1 b = 1 m ··· 6 n1 1.5 n2 = 1 n3 = 1 a 1 b = 1 m = 6 n1 ™ 2 n2 = 1 n3 = 1 a = 1 b = 1 GG GG 119119 101101 S-Parameters [Magnitude in dB]S-Parameters [Magnitude in dB] -20 -i-----------:------------:-----------:-----------:------------:-----------:-----------:------------20 -i -----------: ------------: -----------: --------- -: ------------: -----------: -----------: ---------- - 5 5.2 5.4 5.6 5.8 6 6.2 6.4 6.6 6.8 75 5.2 5.4 5.6 5.8 6 6.2 6.4 6.6 6.8 7 Frequency / GHzFrequency / GHz 134134 133B133B 134134 137A 137A137A 137A 130 139130 139 BACK SIDE ig. 14BACK SIDE ig. 14
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CN106299727A (en) * 2016-11-03 2017-01-04 云南大学 Low-cross coupling 4 unit ultra broadband mimo antenna
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US20160344093A1 (en) * 2015-05-20 2016-11-24 Panasonic Intellectual Property Management Co., Ltd. Antenna device, wireless communication apparatus, and radar apparatus
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