NL2010766C2 - Solar panel and method for manufacturing such a solar panel. - Google Patents
Solar panel and method for manufacturing such a solar panel. Download PDFInfo
- Publication number
- NL2010766C2 NL2010766C2 NL2010766A NL2010766A NL2010766C2 NL 2010766 C2 NL2010766 C2 NL 2010766C2 NL 2010766 A NL2010766 A NL 2010766A NL 2010766 A NL2010766 A NL 2010766A NL 2010766 C2 NL2010766 C2 NL 2010766C2
- Authority
- NL
- Netherlands
- Prior art keywords
- layer
- conductive material
- solar cell
- conductor circuit
- conductive
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000004020 conductor Substances 0.000 claims description 125
- 239000000463 material Substances 0.000 claims description 29
- 238000010288 cold spraying Methods 0.000 claims description 24
- 229910052782 aluminium Inorganic materials 0.000 claims description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 20
- 238000005507 spraying Methods 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 238000003801 milling Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 239000011366 tin-based material Substances 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims 5
- 239000012212 insulator Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 230000000873 masking effect Effects 0.000 description 6
- 238000002955 isolation Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002998 adhesive polymer Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000006121 base glass Substances 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Energy (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Description
Solar panel and method for manufacturing such a solar panel
Field of the invention
The present invention relates to a solar panel. Also, the invention relates to a method for manufacturing such a solar panel.
Background
At present solar panel with EWT or MWT solar cells comprise a conductive patterned back sheet for contacting the electrical contacts on the rear surface of these types solar cells. Typically, such a back sheet comprises a carrier layer, usually a polymer layer, and a patterned conductive layer made of copper (or copper alloy). For connection of a junction box at the back of the module, the polymer layer at the rear side of the module should be locally opened and the tabs are soldered to the conductive layer. However, the cost of copper is relatively high and presents a bottleneck for implementation of these solar panel types in industry'.
In the prior art, alternatives have been considered such as an aluminum based conductive layer, since aluminum is comparatively cheap. However, soldering solar cell contacts to aluminum is cumbersome, since the wettability of aluminum by the solder is usually poor, yielding poor and relatively unreliable electrical interconnections Also, a high contact resistance on aluminum is observed when conductive adhesive is used to connect a solar cell contact to the aluminum conductive layer.
To solve these difficulties, prior art aluminum conductor layers on back sheets have been covered by vacuum deposition or cladding of a metal layer with better properties for using conductive adhesive or solder on aluminum and typically higher cost. Additionally, such deposition techniques are time consuming and thus relatively expensive, and therefore do not provide a solution. Also for applying solder techniques a layer thickness of 1-2 pm at least is needed.
It is an object of the invention to overcome the disadvantages of the prior art.
Summary of the invention
The object is achieved by a solar panel provided with a stack comprising at least one solar cell and a back-sheet layer; the at least one solar cell being arranged as a back contacted solar cell with a front surface for receiving radiation and a rear surface provided with electrical contacts; the back-sheet layer having a surface provided with a patterned conductor circuit layer of a first conductive material, the conductor circuit layer being arranged with contacting areas each located at a location corresponding and aligned to a location of one of the electrical contacts on the at least one solar cell; the at least one solar cell being arranged on top of the conductor circuit layer with the rear surface of the at least one solar cell facing the patterned conductor circuit surface; each electrical contact of the at least one solar cell being in conductive contact with a corresponding one of the contacting areas on the conductor circuit by a body of conductive connecting material; the conductor circuit layer comprising at the location of the contacting area a patch or islet of a second conductive material wherein each patch is arranged in between the body of conductive connecting material on one electrical contact and the layer of the first conductive material.
Advantageously, the solar panel provides a back sheet which has good interconnection properties as patches are only at locations where properties such as good electrical contact and mechanical adhesion are required. This saves on the amount of the relatively costly metal with these properties to be used in the production of the solar panel. Thus a solar panel can have a conductive circuit layer of a low cost first material that has poor interconnection properties, with only local patches of a second material with good properties where needed.
According to an aspect of the invention there is provided a solar panel as described above, wherein the first conductive material is an aluminum based metal.
According to an aspect of the invention there is provided a solar panel as described above, wherein the second conductive material is selected from a group comprising a copper based material, a tin based material and a nickel based material.
According to an aspect of the invention there is provided a solar panel as described above, wherein each patch has an areal size that substantially matches the area of a contact on the solar cell.
According to an aspect of the invention there is provided a solar panel as described above, wherein the patch areal size has a diameter of about 2 mm.
According to an aspect of the invention there is provided a solar panel as described above, wherein the patch of second conductive material has penetrated a native oxide layer on the first conductive material and directly contacts the first conductive material.
According to an aspect of the invention there is provided a solar panel as described above, wherein a thickness of the islets of second conductive material does not exceed 50 micron.
Additionally, the present invention relates to a method for manufacturing a solar panel provided with a stack comprising at least one solar cell and a back-sheet layer, comprising: - providing the at least one solar cell being arranged as a back contacted solar cell with a front surface for receiving radiation and a rear surface provided with electrical contacts; - providing a back- sheet layer having a conductive surface of a first conductive material; - patterning the conductive surface with a conductor circuit layer being arranged with a layout of contacting areas each located at a location corresponding and aligned to a location of one of the electrical contacts on the at least one solar cell; - placing the at least one solar cell on top of the conductor circuit layer with the rear surface of the at least one solar cell facing the patterned conductor circuit surface; - conductively contacting each electrical contact of the at least one solar cell with a corresponding one of the contacting areas on the conductor circuit by a body of conductive connecting material; - creating at the location of each contacting area a patch or islet of a second conductive material before said conductively contacting each electrical contact with the corresponding contacting area, with each patch being arranged in between the body of conductive connecting material on one electrical contact and the layer of the first conductive material, wherein the creation of each patch comprises a cold spraying of the second conductive material by a spraying device.
The method uses cold spraying to apply the metal. In this manner, the patch of second conductive material is applied under atmospheric conditions at typically room temperature. In comparison with the prior art vacuum technology, the method of the present invention is relatively simple, less time consuming and lower in cost.
In an embodiment, the cold spraying comprises positioning an outlet of the spraying device at the location of each contacting area on the conductor circuit layer that corresponds to the location of the corresponding electrical contact on the at least one solar cell. As a result, the method allows to create patches only at predetermined locations on the conductor circuit layer of the back sheet.
In yet a further embodiment, the positioning of the outlet of the spraying device is done by a positioning robot.
Advantageously, this allows the method to be automated and to be implemented in high volume production facilities.
According to an aspect of the invention there is provided a method as described above, comprising: - selecting the second conductive material from a group comprising a copper based material, a tin based material and a nickel based material.
According to an aspect of the invention there is provided a method as described above, wherein the back-sheet layer comprises an insulating carrier layer and a conductive layer of the first conductive material and said patterning the conductive surface of the back sheet comprises milling the back sheet to create the conductor circuit layer.
According to an aspect of the invention there is provided a method as described above, wherein the insulating carrier layer comprises either a base polymer layer or a base glass layer or in general a base isolator material layer.
According to an aspect of the invention there is provided a method as described above, wherein preceding the step of cold spraying, a masking layer is positioned on the conductor circuit layer; openings in the masking layer being defined for exposing the location of each patch on the conductor circuit layer during the cold spraying.
According to an aspect of the invention there is provided a method as described above, further comprising: removal of the masking layer after said cold spraying.
According to an aspect of the invention there is provided a method as described above, further comprising: - from a rear side of the solar panel creating an opening in at least the insulating carrier layer upto an interface between the insulating carrier layer and the first conductive material layer; - creating at the location of the opening in at least the insulating carrier layer a rear surface patch or islet of the second conductive material in the first conductive material layer; - conductively contacting a contact of a junction box device with the rear surface patch of second conductive material through the opening in at least the insulating carrier layer, wherein the creation of each rear surface patch comprises a cold spraying of the second conductive material by a spraying device.
According to an aspect of the invention there is provided a method as described above, comprising: providing at the rear side of the solar panel a support layer on the insulating carrier layer, and before the creation of the opening in the insulating carrier layer, creating an opening in the support layer to the insulating carrier layer.
The present invention also relates to a tool for use in the method for manufacturing of a solar panel provided with a stack comprising at least one solar cell and a back-sheet contact layer as described above, comprising: a supporting surface for supporting at least the back-sheet layer, and an cold spraying application device for applying each patch on the conductor circuit layer.
According to an aspect of the invention there is provided a tool as described above, wherein the cold spraying application device comprises a cold spraying device mounted on a positioning robot, the robot being configured to position the cold spraying device along the supporting surface.
According to an aspect of the invention there is provided a tool as described above, further comprising a milling device.
Advantageous embodiments are further defined by the dependent claims.
Brief description of drawings
The invention will be explained in more detail below with reference to a few drawings in which illustrative embodiments thereof are shown. They are intended exclusively for illustrative purposes and not to restrict the inventive concept, which is defined by the claims.
In the following figures, the same reference numerals refer to similar or identical components in each of the figures.
Figure 1 shows a schematic cross-section of a solar panel with MWT solar cells; Figure 2 shows a plane view of a back sheet provided with a patterned conductor circuit layer according to an embodiment of the invention;
Figure 3 shows a cross-section of the patterned conductor circuit layer at a location of a contacting area with a rear contact of a solar cell;
Figure 4 shows a cross-section of the patterned conductor circuit layer at a location of a second contacting area of the circuit layer with a contact of a junction box on a rear side of the solar panel module;
Figure 5 shows schematically a tool according to an embodiment of the invention. Detailed description of embodiments
Figure 1 shows a schematic cross-section of a solar panel with MWT solar cells.
A solar panel construction 1 comprises a transparent front layer 10, and a plurality of solar cells 14, a conductor circuit layer 20 and an insulating carrier 24.
The plurality of solar cells 14 are arranged adjacent to each other. Each solar cell which comprises a semiconductor substrate is arranged as a back contacted solar cell with a front surface for receiving radiation from a radiation source such as the Sun. The front surface of each solar cell is directed towards and attached to the transparent front layer 10 of the panel 1. Typically, the solar cell is attached to the transparent front layer 10 by a transparent adhesive polymer layer 12 or in some cases by a transparent glass frit layer 12.
In a back contacted solar cell both cathode and anode electrical contacts 15, 17 are all arranged at the rear surface. Back contacted solar cells may be of the MWT (metal-wrap-through), EWT (Emitter wrap-through), IBC (interdigitated back-contact) or other back-contact silicon substrate type, that comprise all contacts at the rear of the cell either by conductive vias through the silicon substrate to connect the front surface region with rear surface electrical contact(s) of the solar cell or by having both the p-and n-type junctions and electrical contact(s) at the rear of the solar cell.
As an example, in metal wrap through (MWT) solar cells, metal conductors (or vias) 15, 17 run through the semiconductor substrate to bring electrical contacts from the substrate’s front surface to the rear surface. (In figure 1 only the MWT contacts that collect charge carriers from the front surface of the solar cell are shown).
Both cathode and anode contacts are connected to a conductor circuit layer 20 supported by the insulating carrier layer 24. As an isolation usually a transparent adhesive polymer layer 23 is present between the solar cell rear surface and the conductor circuit layer, with openings in the intermediate isolation at the location of the solar cell contacts. The conductor circuit layer 20 is patterned to have a layout to connect the contacts of the solar cells in either serial or parallel connection (depending on the design).
It will be appreciated that alternatively, the insulating carrier layer 24 may be either a polymer layer or a glass layer or in general an isolator material.
Typically, the connection between an electrical contact on the solar cell and the conductor circuit layer is made by a solder or conductive adhesive body 19.
In between adjacent solar cells isolation 25 may be present. Additional back support layers 26 may be arranged under the insulating carrier 24.
Figure 2a shows a plane view of a rear surface of two adjacent solar cells 14.
On the rear surface 11 of each solar cell 14, a number of cathode and anode electrical contacts 15, 17 are arranged. In this non-limiting example, electrical contacts 15 of one polarity are arranged in three parallel rows with two parallel rows of electrical contacts 17 of the opposite polarity in between them.
Figure 2b shows a plane view of a surface of a back sheet provided with a patterned conductor circuit layer 20, according to an embodiment of the invention. The layout of the conductor circuit layer 20 corresponds with the layout of the electrical contacts of the back-contacted solar cells of Figure 2a.
The conductor circuit layer comprises one or more patterned conductive areas 32, 33, 34. For example, the conductive areas may be interdigitated, but other pattern shapes and pattern arrangements are also possible, as will be appreciated by the person skilled in the art. Further, it is noted that the layout of the conductor circuit layer matches substantially the layout of the electrical contacts 15, 17 on the rear surface of the back-contacted solar cells 14 and with the arrangement of the solar cells 14 next to each other.
As mentioned above, in the prior art the conductor circuit layer 20 is a copper based layer, which has high conductance and good contacting properties for solders and conductive adhesives. Such a copper layer is relatively costly, however.
As an alternative the conductor circuit layer 20 is an aluminum based layer, with relatively high conductance and relatively low cost. Adversely, the wettability of aluminum by the solder or conductive adhesive is poor, yielding poor and relatively unreliable electrical interconnections between a solar cell contact and the conductor circuit layer.
As shown in figure 2b, the present invention provides that at the predetermined location of the contacting area of the solar cell contact and the conductor circuit layer a patch 22 or islet of a second conductive material is applied. The patch 22 is arranged in between the solder body 19 on the corresponding electrical contacts 15, 17 and the layer of aluminum based material.
The second conductive material is selected from a group of conductive materials that has good wettability properties for conductive contact with the solder or conductive adhesive body 19 on the solar cell.
In a further embodiment, the second conductive material is selected based on having good soldering properties with the soldering material and/or to be compatible with conductive adhesives in the connection 19 between the solar cell contact and the conductive circuit layer 20.
According to an embodiment, the second conductive material is selected from a group comprising a copper based material, a tin based material and a nickel based material.
Preferably, the second conductive material is applied on the aluminum based material by cold spraying, i.e., a powder of the second conductive material is mixed with a gas flow, sprayed at high flow rate and at relatively low temperature on the surface of the aluminum based material. The term “low temperature” is defined as a temperature well below melting temperature of the first and second conductive material to avoid damage to the first conductive material.
The term “high flow rate” is defined as the rate necessary to crush or breakthrough the oxide layer on the aluminum carrier foil and to deform the particles in such a way that a compact dense layer is formed.
The application of the patches of the second conductive material on the aluminum based conductor circuit layer 20 can be done in various manners.
The application of the patches by cold spraying can be done using a spraying device with a nozzle that focuses the sprayed second conductive material powder to form a patch at the location of each contacting area on the conductor circuit layer that corresponds to the location of the corresponding electrical contact on the at least one solar cell. In an embodiment, this method can be implemented by using a positioning robot that is coupled to the spraying device. The conductor circuit layer can be positioned on a supporting table coupled to the robot. The robot can position the nozzle of the spraying device in accordance with the predetermined locations for the patches 22 on the conductor circuit layer 20.
Alternatively, a masking layer can be positioned on the conductor circuit layer. In the masking layer openings have been defined for exposing the conductor circuit layer at the locations under the openings to create patches there during cold spraying. After cold spraying the masking layer is removed.
Figure 3 shows a cross-section of the patterned conductor circuit layer at a location of a contacting area with a rear contact of a solar cell. It has been found that during cold spraying the particles of the second conductive material powder penetrate a the native oxide layer 21 on the aluminum based material, form a local patch 22 of the second conductive material that directly contacts the aluminum based material.
As a result the contact between the solder body or conductive adhesive on the solar cell and the conductor circuit layer is improved: The local patch 22 has the properties of the second conductive material that allow a proper electrical contact and mechanical contact with the solder body or conductive adhesive 19. At the same time the local patch has a proper electrical contact and mechanical contact with the aluminum based material of the conductor circuit layer 20.
Figure 4 shows a cross-section of the patterned conductor circuit layer at a location of a second contacting area of the circuit layer with a contact of a junction box. From the rear side of the solar panel module, the support layer 26 and isolation carrier 24 are locally opened at a position 27 where a contact of a junction box will be located when the junction box is mounted at the rear side of the solar panel.
The created opening exposes the back surface of the patterned conductor circuit layer where the contact of the junction box is to be connected.
According to an embodiment of the invention in the second contacting area of the patterned conductor circuit layer a local patch 22a of the second conductive material is arranged. According to the invention, the local patch 22a is applied on the circuit layer by means of cold spraying in a similar manner as the local patch arranged in between the circuit layer and a rear contact of the solar cell.
Figure 5 shows schematically a tool 50 according to an embodiment of the invention.
The tool 50 comprises a spraying device 52, a positioning robot 54 and a supporting table 56. The supporting table 56 is arranged for supporting a back sheet layer comprising the conductor circuit layer 20 and its insulating carrier layer 24. The spraying device 52 is arranged for cold spraying powder of the second conductive material through a nozzle at predetermined locations on the conductor circuit layer, the predetermined locations corresponding with the locations of the contacts on the solar cells to be placed on the conductor circuit layer.
The spraying device 52 is mounted on a movable part of the robot that can be positioned at substantially any position above the plane of the supporting table. Such a movable part could a X-Y movable arm.
In an embodiment, the tool 50 may be combined with a milling device (not shown) configured for milling the conductor circuit layer into a predetermined pattern as described above. The milling device can be mounted on the same movable part as the spraying device or on an additional movable part of the robot.
In an embodiment, the tool combined with the milling device is arranged to create openings in the rear surface of the support layer 26 and isolation carrier 24 up to the interface with the patterned conductor circuit layer 20 so as to expose the rear surface of the patterned conductor circuit layer 20. After milling to create an opening in the rear surface, the spraying device 52 can be positioned over the opening and apply the local patch 22a through the opening onto the exposed patterned conductor circuit layer 20.
The invention has been described with reference to the preferred embodiment. Obvious modifications and alterations will occur to others upon reading and understanding the preceding detailed description. It is intended that the invention be construed as including all such modifications and alterations insofar as they come within the scope of the appended claims.
Claims (20)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2010766A NL2010766C2 (en) | 2013-05-07 | 2013-05-07 | Solar panel and method for manufacturing such a solar panel. |
NL2012558A NL2012558C2 (en) | 2013-05-07 | 2014-04-03 | Solar panel and method for manufacturing such a solar panel. |
PCT/NL2014/050286 WO2014182165A1 (en) | 2013-05-07 | 2014-05-05 | Solar panel and method for manufacturing such a solar panel |
US14/889,960 US20160099359A1 (en) | 2013-05-07 | 2014-05-05 | Solar panel and method for manufacturing such a solar panel |
EP14725554.1A EP2994941B1 (en) | 2013-05-07 | 2014-05-05 | Solar panel and method for manufacturing such a solar panel |
CN201480034523.6A CN105308756B (en) | 2013-05-07 | 2014-05-05 | Solar panel and the method for manufacturing this solar panel |
KR1020157033877A KR102234830B1 (en) | 2013-05-07 | 2014-05-05 | Solar panel and method for manufacturing such a solar panel |
TW103116065A TWI633676B (en) | 2013-05-07 | 2014-05-06 | Solar panel and method for manufacturing such a solar panel |
US16/444,796 US20190386156A1 (en) | 2013-05-07 | 2019-06-18 | Method for manufacturing a solar panel |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2010766A NL2010766C2 (en) | 2013-05-07 | 2013-05-07 | Solar panel and method for manufacturing such a solar panel. |
NL2010766 | 2013-05-07 |
Publications (1)
Publication Number | Publication Date |
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NL2010766C2 true NL2010766C2 (en) | 2014-11-10 |
Family
ID=48951541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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NL2010766A NL2010766C2 (en) | 2013-05-07 | 2013-05-07 | Solar panel and method for manufacturing such a solar panel. |
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NL (1) | NL2010766C2 (en) |
Citations (6)
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US4234351A (en) * | 1978-07-14 | 1980-11-18 | The Boeing Company | Process for fabricating glass-encapsulated solar cell arrays and the product produced thereby |
FR2877144A1 (en) * | 2004-10-22 | 2006-04-28 | Solarforce Soc Par Actions Sim | MONOLITHIC MULTILAYER STRUCTURE FOR THE CONNECTION OF SEMICONDUCTOR CELLS |
US7432596B1 (en) * | 2004-10-12 | 2008-10-07 | Energy Innovations, Inc. | Apparatus and method for bonding silicon wafer to conductive substrate |
US20120103408A1 (en) * | 2010-08-05 | 2012-05-03 | Solexel, Inc. | Backplane reinforcement and interconnects for solar cells |
US20120234593A1 (en) * | 2011-03-18 | 2012-09-20 | Applied Materials, Inc. | Conductive foils having multiple layers and methods of forming same |
WO2012160765A1 (en) * | 2011-05-20 | 2012-11-29 | パナソニック株式会社 | Multi-junction compound solar cell, multi-junction compound solar battery, and method for manufacturing same |
-
2013
- 2013-05-07 NL NL2010766A patent/NL2010766C2/en not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4234351A (en) * | 1978-07-14 | 1980-11-18 | The Boeing Company | Process for fabricating glass-encapsulated solar cell arrays and the product produced thereby |
US7432596B1 (en) * | 2004-10-12 | 2008-10-07 | Energy Innovations, Inc. | Apparatus and method for bonding silicon wafer to conductive substrate |
FR2877144A1 (en) * | 2004-10-22 | 2006-04-28 | Solarforce Soc Par Actions Sim | MONOLITHIC MULTILAYER STRUCTURE FOR THE CONNECTION OF SEMICONDUCTOR CELLS |
US20120103408A1 (en) * | 2010-08-05 | 2012-05-03 | Solexel, Inc. | Backplane reinforcement and interconnects for solar cells |
US20120234593A1 (en) * | 2011-03-18 | 2012-09-20 | Applied Materials, Inc. | Conductive foils having multiple layers and methods of forming same |
WO2012160765A1 (en) * | 2011-05-20 | 2012-11-29 | パナソニック株式会社 | Multi-junction compound solar cell, multi-junction compound solar battery, and method for manufacturing same |
EP2660874A1 (en) * | 2011-05-20 | 2013-11-06 | Panasonic Corporation | Multi-junction compound solar cell, multi-junction compound solar battery, and method for manufacturing same |
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