NL185051B - METHOD FOR MANUFACTURING A CONDUCTOR PLATE EQUIPPED WITH BUILDING ELEMENTS - Google Patents
METHOD FOR MANUFACTURING A CONDUCTOR PLATE EQUIPPED WITH BUILDING ELEMENTSInfo
- Publication number
- NL185051B NL185051B NL7810034A NL7810034A NL185051B NL 185051 B NL185051 B NL 185051B NL 7810034 A NL7810034 A NL 7810034A NL 7810034 A NL7810034 A NL 7810034A NL 185051 B NL185051 B NL 185051B
- Authority
- NL
- Netherlands
- Prior art keywords
- manufacturing
- conductor plate
- building elements
- plate equipped
- building
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19787806329 DE7806329U1 (en) | 1978-02-28 | 1978-02-28 | |
DE2809013A DE2809013C2 (en) | 1978-02-28 | 1978-02-28 | Method of manufacturing a printed circuit board loaded with components |
Publications (3)
Publication Number | Publication Date |
---|---|
NL7810034A NL7810034A (en) | 1979-08-30 |
NL185051B true NL185051B (en) | 1989-08-01 |
NL185051C NL185051C (en) | 1990-01-02 |
Family
ID=25773955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7810034A NL185051C (en) | 1978-02-28 | 1978-10-04 | METHOD FOR MANUFACTURING A CONDUCTOR PLATE EQUIPPED WITH BUILDING ELEMENTS |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH639516A5 (en) |
FR (1) | FR2418606A1 (en) |
GB (1) | GB2026918B (en) |
NL (1) | NL185051C (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2210818A (en) * | 1987-10-10 | 1989-06-21 | Plessey Co Plc | A process for soldering a component to a printed circuit board |
US4982376A (en) * | 1989-04-20 | 1991-01-01 | U.S. Philips Corporation | Method of mounting electrical and/or electronic components on a single-sided printed board |
CN115551188B (en) * | 2022-11-30 | 2023-07-25 | 苏州浪潮智能科技有限公司 | Switch, vehicle, photovoltaic device, circuit board and circuit board manufacturing method |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1209146A (en) * | 1957-05-27 | 1960-02-29 | Thomson Houston Comp Francaise | Improvements in the assembly of electrical elements on printed circuits |
US3786172A (en) * | 1972-12-07 | 1974-01-15 | Accra Point Arrays Corp | Printed circuit board method and apparatus |
-
1978
- 1978-09-21 FR FR7827064A patent/FR2418606A1/en active Granted
- 1978-10-03 CH CH1025878A patent/CH639516A5/en not_active IP Right Cessation
- 1978-10-04 NL NL7810034A patent/NL185051C/en not_active IP Right Cessation
-
1979
- 1979-02-26 GB GB7906660A patent/GB2026918B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2026918A (en) | 1980-02-13 |
NL185051C (en) | 1990-01-02 |
GB2026918B (en) | 1982-11-03 |
FR2418606B1 (en) | 1981-12-11 |
FR2418606A1 (en) | 1979-09-21 |
CH639516A5 (en) | 1983-11-15 |
NL7810034A (en) | 1979-08-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BA | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
A85 | Still pending on 85-01-01 | ||
V1 | Lapsed because of non-payment of the annual fee |