NL172334C - METHOD FOR INCREASING THE BINDING CAPACITY OF COLD OR WARM-CURING RESINS WITH RESISTANCE TO SOLID INORGANIC MATERIALS - Google Patents

METHOD FOR INCREASING THE BINDING CAPACITY OF COLD OR WARM-CURING RESINS WITH RESISTANCE TO SOLID INORGANIC MATERIALS

Info

Publication number
NL172334C
NL172334C NLAANVRAGE7015866,A NL7015866A NL172334C NL 172334 C NL172334 C NL 172334C NL 7015866 A NL7015866 A NL 7015866A NL 172334 C NL172334 C NL 172334C
Authority
NL
Netherlands
Prior art keywords
warm
cold
increasing
resistance
inorganic materials
Prior art date
Application number
NLAANVRAGE7015866,A
Other languages
Dutch (nl)
Other versions
NL7015866A (en
NL172334B (en
Original Assignee
Dynamit Nobel Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691954354 external-priority patent/DE1954354C3/en
Application filed by Dynamit Nobel Ag filed Critical Dynamit Nobel Ag
Publication of NL7015866A publication Critical patent/NL7015866A/xx
Publication of NL172334B publication Critical patent/NL172334B/en
Application granted granted Critical
Publication of NL172334C publication Critical patent/NL172334C/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804—Compounds having Si-O-C linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Mold Materials And Core Materials (AREA)
  • Reinforced Plastic Materials (AREA)
NLAANVRAGE7015866,A 1969-10-29 1970-10-29 METHOD FOR INCREASING THE BINDING CAPACITY OF COLD OR WARM-CURING RESINS WITH RESISTANCE TO SOLID INORGANIC MATERIALS NL172334C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691954354 DE1954354C3 (en) 1969-10-29 Adhesive

Publications (3)

Publication Number Publication Date
NL7015866A NL7015866A (en) 1971-05-04
NL172334B NL172334B (en) 1983-03-16
NL172334C true NL172334C (en) 1983-08-16

Family

ID=5749523

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7015866,A NL172334C (en) 1969-10-29 1970-10-29 METHOD FOR INCREASING THE BINDING CAPACITY OF COLD OR WARM-CURING RESINS WITH RESISTANCE TO SOLID INORGANIC MATERIALS

Country Status (12)

Country Link
JP (1) JPS4812407B1 (en)
AT (1) AT308987B (en)
BE (1) BE758228A (en)
CA (1) CA968485A (en)
DK (1) DK129659B (en)
FI (1) FI56976C (en)
FR (1) FR2066679A5 (en)
GB (1) GB1324030A (en)
LU (1) LU61850A1 (en)
NL (1) NL172334C (en)
NO (1) NO134871C (en)
SE (1) SE429854B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49134602U (en) * 1973-03-12 1974-11-19

Also Published As

Publication number Publication date
NL7015866A (en) 1971-05-04
SE429854B (en) 1983-10-03
FI56976B (en) 1980-01-31
FI56976C (en) 1980-05-12
LU61850A1 (en) 1971-05-04
DE1954354B2 (en) 1977-06-30
NL172334B (en) 1983-03-16
NO134871C (en) 1976-12-29
DK129659B (en) 1974-11-04
JPS4812407B1 (en) 1973-04-20
AT308987B (en) 1973-07-25
NO134871B (en) 1976-09-20
CA968485A (en) 1975-05-27
DK129659C (en) 1975-04-14
BE758228A (en) 1971-04-01
DE1954354A1 (en) 1971-05-06
GB1324030A (en) 1973-07-18
FR2066679A5 (en) 1971-08-06

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Legal Events

Date Code Title Description
V4 Discontinued because of reaching the maximum lifetime of a patent