NL155129B - PROCEDURE FOR THE MANUFACTURE OF AN INTEGRATED CIRCUIT, AND AN INTEGRATED CIRCUIT, MANUFACTURED ACCORDING TO THIS PROCESS. - Google Patents
PROCEDURE FOR THE MANUFACTURE OF AN INTEGRATED CIRCUIT, AND AN INTEGRATED CIRCUIT, MANUFACTURED ACCORDING TO THIS PROCESS.Info
- Publication number
- NL155129B NL155129B NL666606265A NL6606265A NL155129B NL 155129 B NL155129 B NL 155129B NL 666606265 A NL666606265 A NL 666606265A NL 6606265 A NL6606265 A NL 6606265A NL 155129 B NL155129 B NL 155129B
- Authority
- NL
- Netherlands
- Prior art keywords
- integrated circuit
- procedure
- manufacture
- manufactured according
- manufactured
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01005—Boron [B]
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- H01L2924/01013—Aluminum [Al]
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- H01L2924/01079—Gold [Au]
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- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2081—Compound repelling a metal, e.g. solder
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US46503465A | 1965-06-18 | 1965-06-18 | |
US465035A US3401126A (en) | 1965-06-18 | 1965-06-18 | Method of rendering noble metal conductive composition non-wettable by solder |
Publications (2)
Publication Number | Publication Date |
---|---|
NL6606265A NL6606265A (en) | 1966-12-19 |
NL155129B true NL155129B (en) | 1977-11-15 |
Family
ID=27041182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL666606265A NL155129B (en) | 1965-06-18 | 1966-05-09 | PROCEDURE FOR THE MANUFACTURE OF AN INTEGRATED CIRCUIT, AND AN INTEGRATED CIRCUIT, MANUFACTURED ACCORDING TO THIS PROCESS. |
Country Status (5)
Country | Link |
---|---|
BE (1) | BE720136A (en) |
FR (1) | FR1483565A (en) |
GB (1) | GB1143815A (en) |
NL (1) | NL155129B (en) |
SE (1) | SE320425B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4017889A (en) * | 1974-12-23 | 1977-04-12 | International Business Machines Corporation | Ternary barrier structure for conductive electrodes |
-
0
- FR FR1483565D patent/FR1483565A/fr not_active Expired
- GB GB1143815D patent/GB1143815A/en not_active Expired
-
1966
- 1966-05-09 NL NL666606265A patent/NL155129B/en not_active IP Right Cessation
- 1966-06-20 SE SE8415/66A patent/SE320425B/xx unknown
-
1968
- 1968-08-29 BE BE720136A patent/BE720136A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
BE720136A (en) | 1969-02-03 |
SE320425B (en) | 1970-02-09 |
GB1143815A (en) | 1900-01-01 |
FR1483565A (en) | 1967-09-06 |
NL6606265A (en) | 1966-12-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
V1 | Lapsed because of non-payment of the annual fee | ||
NL80 | Abbreviated name of patent owner mentioned of already nullified patent |
Owner name: I B M |