NL134842C - - Google Patents
Info
- Publication number
- NL134842C NL134842C NL134842DA NL134842C NL 134842 C NL134842 C NL 134842C NL 134842D A NL134842D A NL 134842DA NL 134842 C NL134842 C NL 134842C
- Authority
- NL
- Netherlands
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
- C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US200924A US3288747A (en) | 1962-06-08 | 1962-06-08 | Molding composition of powdered epoxy resin, and filler coated with normally solid curing agent |
Publications (1)
Publication Number | Publication Date |
---|---|
NL134842C true NL134842C (fr) |
Family
ID=22743761
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL134842D NL134842C (fr) | 1962-06-08 | ||
NL293777D NL293777A (fr) | 1962-06-08 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL293777D NL293777A (fr) | 1962-06-08 |
Country Status (7)
Country | Link |
---|---|
US (1) | US3288747A (fr) |
BE (1) | BE633164A (fr) |
CH (1) | CH425228A (fr) |
DK (1) | DK108410C (fr) |
ES (1) | ES288650A1 (fr) |
GB (1) | GB1009478A (fr) |
NL (2) | NL293777A (fr) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3388185A (en) * | 1964-02-20 | 1968-06-11 | Westinghouse Electric Corp | Solid epoxide coating compositions containing a mixture of mono and polyfunctional anhydrides |
GB1141405A (en) * | 1965-09-27 | 1969-01-29 | Matsushita Electric Ind Co Ltd | Insulating method for electrical machinery and apparatus |
US3485789A (en) * | 1966-05-20 | 1969-12-23 | Gen Electric | Pulverulent coating compositions and fluidized bed coating method |
US3963666A (en) * | 1971-06-15 | 1976-06-15 | Ciba-Geigy Corporation | Storage-stable, quick-curing epoxide resin moulding materials |
US3996175A (en) * | 1971-06-25 | 1976-12-07 | Ciba-Geigy Corporation | Storage-stable, quick-curing epoxide resin moulding materials |
US3923725A (en) * | 1972-09-29 | 1975-12-02 | Hitachi Ltd | Method for forming epoxy resin products |
US4146525A (en) * | 1977-06-20 | 1979-03-27 | Minnesota Mining And Manufacturing Company | High strength ceramic-polymer composites |
US4826896A (en) * | 1987-03-19 | 1989-05-02 | The Dexter Corporation | Encapsulating electronic components |
US5084501A (en) * | 1988-11-07 | 1992-01-28 | Armstrong World Industries, Inc. | Highly filled resin powder |
DE4327570A1 (de) * | 1993-08-17 | 1995-04-20 | Bayer Ag | Rieselfähige Preßmassen, Verfahren zu deren Herstellung und ihre Verwendung |
WO1997028203A1 (fr) * | 1996-02-02 | 1997-08-07 | Ciba Specialty Chemicals Holding Inc. | Poudre a mouler stable du point de vue du stockage, a base de resines epoxydes |
ES2191366T3 (es) | 1997-12-08 | 2003-09-01 | Vantico Gmbh & Co Kg | Novolacas como aceleradores no afectados por el agua para endurecedores de resina epoxi. |
WO2005033172A1 (fr) * | 2003-09-29 | 2005-04-14 | Siemens Aktiengesellschaft | Formulation de resine, ses utilisations et corps moule produit a partir de cette formulation |
US7485242B2 (en) * | 2004-01-23 | 2009-02-03 | Printar Ltd | Reactive fine particles |
US7763316B2 (en) * | 2006-05-18 | 2010-07-27 | Fairmount Minerals, Inc. | No hexa shell sand |
US7851342B2 (en) * | 2007-03-30 | 2010-12-14 | Intel Corporation | In-situ formation of conductive filling material in through-silicon via |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2773048A (en) * | 1952-08-25 | 1956-12-04 | Honeywell Regulator Co | Epoxy resin composition containing para, para' diamino diphenylmethane |
US3000750A (en) * | 1953-03-06 | 1961-09-19 | Dehydag Dentsche Hydrierwerke | Process of preparing dispersions of pulverulent material and preparations obtained thereby |
BE530703A (fr) * | 1953-07-29 | |||
US2866768A (en) * | 1955-03-18 | 1958-12-30 | Honeywell Regulator Co | Epoxy molding composition and method of molding with same |
-
0
- NL NL134842D patent/NL134842C/xx active
- BE BE633164D patent/BE633164A/xx unknown
- NL NL293777D patent/NL293777A/xx unknown
-
1962
- 1962-06-08 US US200924A patent/US3288747A/en not_active Expired - Lifetime
-
1963
- 1963-05-23 GB GB20714/63A patent/GB1009478A/en not_active Expired
- 1963-06-01 ES ES0288650A patent/ES288650A1/es not_active Expired
- 1963-06-05 CH CH701563A patent/CH425228A/fr unknown
- 1963-06-07 DK DK271263AA patent/DK108410C/da active
Also Published As
Publication number | Publication date |
---|---|
GB1009478A (en) | 1965-11-10 |
DE1545191A1 (de) | 1970-03-05 |
DK108410C (da) | 1967-12-04 |
CH425228A (fr) | 1966-11-30 |
ES288650A1 (es) | 1963-10-16 |
NL293777A (fr) | |
DE1545191B2 (de) | 1972-09-28 |
BE633164A (fr) | |
US3288747A (en) | 1966-11-29 |