NL122783C - - Google Patents

Info

Publication number
NL122783C
NL122783C NL122783DA NL122783C NL 122783 C NL122783 C NL 122783C NL 122783D A NL122783D A NL 122783DA NL 122783 C NL122783 C NL 122783C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL122783C publication Critical patent/NL122783C/xx
Priority claimed from US132335A external-priority patent/US3149375A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B11/00Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses
    • B30B11/34Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses for coating articles, e.g. tablets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00Other methods of shaping glass
    • C03B19/06Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/32Sealing leading-in conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49194Assembling elongated conductors, e.g., splicing, etc.
    • Y10T29/49195Assembling elongated conductors, e.g., splicing, etc. with end-to-end orienting
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • Y10T29/49208Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921Contact or terminal manufacturing by assembling plural parts with bonding
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4998Combined manufacture including applying or shaping of fluent material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Motors, Generators (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Wire Processing (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
NL122783D 1961-08-18 NL122783C (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US132335A US3149375A (en) 1961-08-18 1961-08-18 Apparatus and method for molding cup-shaped bodies
US326317A US3259974A (en) 1961-08-18 1963-11-06 Method for molding cup-shaped bodies

Publications (1)

Publication Number Publication Date
NL122783C true NL122783C (de)

Family

ID=26830274

Family Applications (2)

Application Number Title Priority Date Filing Date
NL281748D NL281748A (de) 1961-08-18
NL122783D NL122783C (de) 1961-08-18

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL281748D NL281748A (de) 1961-08-18

Country Status (4)

Country Link
US (1) US3259974A (de)
DE (1) DE1255204B (de)
GB (1) GB1007182A (de)
NL (2) NL122783C (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3389461A (en) * 1965-04-08 1968-06-25 Ibm Molded insulator base having embedded terminals and method of forming the same
US3444618A (en) * 1965-09-23 1969-05-20 Whirlpool Co Method of forming electrical elements
CN111332055B (zh) * 2020-03-23 2024-08-06 浙江哈尔斯真空器皿股份有限公司 杯或壶的薄壁金属外壳表面连续图案的压制模具

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1648721A (en) * 1925-01-20 1927-11-08 Bound Brook Oil Less Bearing Method of and machine for forming bodies by pressure
US1922527A (en) * 1928-03-03 1933-08-15 American Crayon Co Apparatus for molding pencils and the like
US1813576A (en) * 1928-04-24 1931-07-07 Kattwinkel Hans Manufacture of friction bodies for brake and clutch purposes
US2166205A (en) * 1937-05-29 1939-07-18 Rca Corp Fixed capacitor
US2276380A (en) * 1937-12-24 1942-03-17 Du Pont Electric blasting initiator
FR856652A (fr) * 1938-06-20 1940-08-01 Egyesu Lt Izzolampa Es Villamo Procédé et appareil pour la fabrication, par compression, de corps en verre munis d'amenées de courant
US2256769A (en) * 1938-10-10 1941-09-23 Imp Molded Products Corp Method and apparatus for molding plastic objects
US2758183A (en) * 1952-03-05 1956-08-07 Seci Process for making electric resistors and electric resistors made with that process
US2821748A (en) * 1953-05-08 1958-02-04 Baldwin Lima Hamilton Corp Apparatus for compacting and ejecting flanged articles by single plunger action
NL83093C (de) * 1954-03-27
BE566982A (de) * 1957-04-24
US3009578A (en) * 1958-04-15 1961-11-21 Gulf Research Development Co Pre-stressed reinforced ion-exchange membrane and method of making same

Also Published As

Publication number Publication date
GB1007182A (en) 1965-10-13
NL281748A (de)
US3259974A (en) 1966-07-12
DE1255204B (de) 1967-11-30

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