NL1025639A1 - Interposer, interposer housing and device assembly, which uses this interposer and interposer housing. - Google Patents
Interposer, interposer housing and device assembly, which uses this interposer and interposer housing.Info
- Publication number
- NL1025639A1 NL1025639A1 NL1025639A NL1025639A NL1025639A1 NL 1025639 A1 NL1025639 A1 NL 1025639A1 NL 1025639 A NL1025639 A NL 1025639A NL 1025639 A NL1025639 A NL 1025639A NL 1025639 A1 NL1025639 A1 NL 1025639A1
- Authority
- NL
- Netherlands
- Prior art keywords
- interposer
- housing
- device assembly
- interposer housing
- assembly
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15182—Fan-in arrangement of the internal vias
- H01L2924/15184—Fan-in arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/388,997 US6819001B2 (en) | 2003-03-14 | 2003-03-14 | Interposer, interposer package and device assembly employing the same |
US38899703 | 2003-03-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
NL1025639A1 true NL1025639A1 (en) | 2004-09-16 |
NL1025639C2 NL1025639C2 (en) | 2005-05-26 |
Family
ID=32962177
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL1025639A NL1025639C2 (en) | 2003-03-14 | 2004-03-04 | Interposer, interposer housing and device assembly, which uses this interposer and interposer housing. |
Country Status (6)
Country | Link |
---|---|
US (1) | US6819001B2 (en) |
JP (1) | JP5568205B2 (en) |
CN (1) | CN100454532C (en) |
DE (1) | DE102004012595A1 (en) |
IL (1) | IL160581A0 (en) |
NL (1) | NL1025639C2 (en) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
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US6990176B2 (en) | 2003-10-30 | 2006-01-24 | General Electric Company | Methods and apparatus for tileable sensor array |
US7019346B2 (en) * | 2003-12-23 | 2006-03-28 | Intel Corporation | Capacitor having an anodic metal oxide substrate |
US7242073B2 (en) * | 2003-12-23 | 2007-07-10 | Intel Corporation | Capacitor having an anodic metal oxide substrate |
US20060091538A1 (en) * | 2004-11-04 | 2006-05-04 | Kabadi Ashok N | Low profile and tight pad-pitch land-grid-array (LGA) socket |
US7230334B2 (en) * | 2004-11-12 | 2007-06-12 | International Business Machines Corporation | Semiconductor integrated circuit chip packages having integrated microchannel cooling modules |
US7795784B2 (en) * | 2005-01-11 | 2010-09-14 | Koninklijke Philips Electronics N.V. | Redistribution interconnect for microbeamforming(s) and a medical ultrasound system |
KR100652397B1 (en) * | 2005-01-17 | 2006-12-01 | 삼성전자주식회사 | Stack type semiconductor package using an interposer print circuit board |
US20080229835A1 (en) * | 2005-06-07 | 2008-09-25 | Koninklijke Philips Electronics, N.V. | Mullticomponent Backing Block for Ultrasound Sensor Assemblies |
JP4507101B2 (en) * | 2005-06-30 | 2010-07-21 | エルピーダメモリ株式会社 | Semiconductor memory device and manufacturing method thereof |
JP2007139912A (en) * | 2005-11-15 | 2007-06-07 | Sharp Corp | Driving-element mounted display device |
JP4744360B2 (en) * | 2006-05-22 | 2011-08-10 | 富士通株式会社 | Semiconductor device |
TWI326908B (en) * | 2006-09-11 | 2010-07-01 | Ind Tech Res Inst | Packaging structure and fabricating method thereof |
US20080068815A1 (en) * | 2006-09-18 | 2008-03-20 | Oliver Richard Astley | Interface Assembly And Method for Integrating A Data Acquisition System on a Sensor Array |
US7518226B2 (en) * | 2007-02-06 | 2009-04-14 | Stats Chippac Ltd. | Integrated circuit packaging system with interposer |
KR101387701B1 (en) * | 2007-08-01 | 2014-04-23 | 삼성전자주식회사 | Semiconductor packages and methods for manufacturing the same |
KR101623880B1 (en) * | 2008-09-24 | 2016-05-25 | 삼성전자주식회사 | Semiconductor package |
US7973272B2 (en) * | 2009-03-09 | 2011-07-05 | Bae Systems Information And Electronic Systems Integration, Inc. | Interface techniques for coupling a microchannel plate to a readout circuit |
US7923290B2 (en) * | 2009-03-27 | 2011-04-12 | Stats Chippac Ltd. | Integrated circuit packaging system having dual sided connection and method of manufacture thereof |
US7936060B2 (en) * | 2009-04-29 | 2011-05-03 | International Business Machines Corporation | Reworkable electronic device assembly and method |
JPWO2011030504A1 (en) * | 2009-09-11 | 2013-02-04 | パナソニック株式会社 | Electronic component mounting body, manufacturing method thereof, and interposer |
US8008121B2 (en) | 2009-11-04 | 2011-08-30 | Stats Chippac, Ltd. | Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate |
US8405229B2 (en) * | 2009-11-30 | 2013-03-26 | Endicott Interconnect Technologies, Inc. | Electronic package including high density interposer and circuitized substrate assembly utilizing same |
US8363418B2 (en) | 2011-04-18 | 2013-01-29 | Morgan/Weiss Technologies Inc. | Above motherboard interposer with peripheral circuits |
US9013041B2 (en) * | 2011-12-28 | 2015-04-21 | Broadcom Corporation | Semiconductor package with ultra-thin interposer without through-semiconductor vias |
US9006908B2 (en) * | 2012-08-01 | 2015-04-14 | Marvell Israel (M.I.S.L) Ltd. | Integrated circuit interposer and method of manufacturing the same |
WO2014121300A2 (en) * | 2013-02-04 | 2014-08-07 | American Semiconductor, Inc. | Photonic data transfer assembly |
US20140264938A1 (en) * | 2013-03-14 | 2014-09-18 | Douglas R. Hackler, Sr. | Flexible Interconnect |
KR20160036667A (en) | 2013-09-27 | 2016-04-04 | 인텔 코포레이션 | Dual-sided die packages |
JP2015082524A (en) * | 2013-10-21 | 2015-04-27 | ソニー株式会社 | Wiring board and semiconductor device |
US9613857B2 (en) * | 2014-10-30 | 2017-04-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electrostatic discharge protection structure and method |
US11309192B2 (en) | 2018-06-05 | 2022-04-19 | Intel Corporation | Integrated circuit package supports |
DE102020206769B3 (en) * | 2020-05-29 | 2021-06-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | MICROELECTRONIC ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME |
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US3982268A (en) * | 1973-10-30 | 1976-09-21 | General Electric Company | Deep diode lead throughs |
JPH0233960A (en) * | 1988-07-23 | 1990-02-05 | Nec Corp | Semiconductor device |
US5366380A (en) * | 1989-06-13 | 1994-11-22 | General Datacomm, Inc. | Spring biased tapered contact elements for electrical connectors and integrated circuit packages |
JPH04159740A (en) | 1990-10-23 | 1992-06-02 | Matsushita Electric Ind Co Ltd | Chip bonding method |
US5258648A (en) * | 1991-06-27 | 1993-11-02 | Motorola, Inc. | Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery |
JPH05198697A (en) * | 1992-01-20 | 1993-08-06 | Fujitsu Ltd | Formation of metal via on silicon substrate and fabrication of multi chip module |
JPH0810738B2 (en) * | 1993-08-30 | 1996-01-31 | 株式会社日立製作所 | Semiconductor device and manufacturing method thereof |
JPH08236658A (en) * | 1995-02-27 | 1996-09-13 | Nec Eng Ltd | Integrated circuit package |
JP3863213B2 (en) * | 1996-03-27 | 2006-12-27 | 株式会社ルネサステクノロジ | Semiconductor device |
US6219237B1 (en) * | 1998-08-31 | 2001-04-17 | Micron Technology, Inc. | Structure and method for an electronic assembly |
JP2000138313A (en) * | 1998-10-30 | 2000-05-16 | Shinko Electric Ind Co Ltd | Semiconductor device and its manufacture |
CA2266158C (en) * | 1999-03-18 | 2003-05-20 | Ibm Canada Limited-Ibm Canada Limitee | Connecting devices and method for interconnecting circuit components |
JP2000307025A (en) | 1999-04-23 | 2000-11-02 | Matsushita Electric Ind Co Ltd | Electronic part, manufacture thereof, and electronic part package |
JP2001217388A (en) * | 2000-02-01 | 2001-08-10 | Sony Corp | Electronic device and method for manufacturing the same |
US6459582B1 (en) * | 2000-07-19 | 2002-10-01 | Fujitsu Limited | Heatsink apparatus for de-coupling clamping forces on an integrated circuit package |
US7271491B1 (en) * | 2000-08-31 | 2007-09-18 | Micron Technology, Inc. | Carrier for wafer-scale package and wafer-scale package including the carrier |
JP2002083846A (en) | 2000-09-07 | 2002-03-22 | Nec Corp | Pin for mounting and mounting device |
JP2002110865A (en) * | 2000-09-27 | 2002-04-12 | Toshiba Corp | Circuit device |
DE10142116A1 (en) * | 2001-08-30 | 2002-11-14 | Infineon Technologies Ag | Electronic component used as logical unit comprises first semiconductor chip and second semiconductor chip each having contact surfaces on their active surfaces, substrate with contact connection surfaces and external contact surfaces |
CN2534677Y (en) * | 2002-01-21 | 2003-02-05 | 威盛电子股份有限公司 | Connect-disconnect integrated circuit apparatus |
-
2003
- 2003-03-14 US US10/388,997 patent/US6819001B2/en not_active Expired - Lifetime
-
2004
- 2004-02-26 IL IL16058104A patent/IL160581A0/en unknown
- 2004-03-04 NL NL1025639A patent/NL1025639C2/en not_active IP Right Cessation
- 2004-03-09 CN CNB2004100282983A patent/CN100454532C/en not_active Expired - Lifetime
- 2004-03-12 DE DE102004012595A patent/DE102004012595A1/en not_active Withdrawn
- 2004-03-12 JP JP2004070540A patent/JP5568205B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE102004012595A1 (en) | 2004-10-28 |
CN1531081A (en) | 2004-09-22 |
JP2004282072A (en) | 2004-10-07 |
US20040178484A1 (en) | 2004-09-16 |
CN100454532C (en) | 2009-01-21 |
JP5568205B2 (en) | 2014-08-06 |
NL1025639C2 (en) | 2005-05-26 |
IL160581A0 (en) | 2004-07-25 |
US6819001B2 (en) | 2004-11-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AD1A | A request for search or an international type search has been filed | ||
RD2N | Patents in respect of which a decision has been taken or a report has been made (novelty report) |
Effective date: 20050119 |
|
PD2B | A search report has been drawn up | ||
V1 | Lapsed because of non-payment of the annual fee |
Effective date: 20131001 |