NL101297C - - Google Patents

Info

Publication number
NL101297C
NL101297C NL101297DA NL101297C NL 101297 C NL101297 C NL 101297C NL 101297D A NL101297D A NL 101297DA NL 101297 C NL101297 C NL 101297C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL101297C publication Critical patent/NL101297C/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Bipolar Transistors (AREA)
NL101297D 1956-06-12 NL101297C (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US590901A US2887628A (en) 1956-06-12 1956-06-12 Semiconductor device construction

Publications (1)

Publication Number Publication Date
NL101297C true NL101297C (fr)

Family

ID=24364199

Family Applications (2)

Application Number Title Priority Date Filing Date
NL217849D NL217849A (fr) 1956-06-12
NL101297D NL101297C (fr) 1956-06-12

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL217849D NL217849A (fr) 1956-06-12

Country Status (5)

Country Link
US (1) US2887628A (fr)
DE (1) DE1085261B (fr)
FR (1) FR1175953A (fr)
GB (1) GB822770A (fr)
NL (2) NL101297C (fr)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3142791A (en) * 1955-12-07 1964-07-28 Motorola Inc Transistor and housing assembly
GB827117A (en) * 1958-01-03 1960-02-03 Standard Telephones Cables Ltd Improvements in or relating to semi-conductor devices
GB818464A (en) * 1956-03-12 1959-08-19 Gen Electric Co Ltd Improvements in or relating to semiconductor devices
US2984774A (en) * 1956-10-01 1961-05-16 Motorola Inc Transistor heat sink assembly
US3089067A (en) * 1957-09-30 1963-05-07 Gen Motors Corp Semiconductor device
US3113252A (en) * 1958-02-28 1963-12-03 Gen Motors Corp Means for encapsulating transistors
US3150298A (en) * 1958-04-16 1964-09-22 Motorola Inc Stud-mounted rectifier
US3058041A (en) * 1958-09-12 1962-10-09 Raytheon Co Electrical cooling devices
NL244815A (fr) * 1959-02-09
NL266908A (fr) * 1959-05-15
US3005867A (en) * 1959-10-30 1961-10-24 Westinghouse Electric Corp Hermetically sealed semiconductor devices
US3025437A (en) * 1960-02-05 1962-03-13 Lear Inc Semiconductor heat sink and electrical insulator
NL135544C (fr) * 1960-09-20
US3250963A (en) * 1961-03-16 1966-05-10 Texas Instruments Inc Sensor device and method of mounting
DE1251871B (fr) * 1962-02-06 1900-01-01
NL294340A (fr) * 1962-07-27 1900-01-01
US3209065A (en) * 1962-08-02 1965-09-28 Westinghouse Electric Corp Hermetically enclosed electronic device
US3265802A (en) * 1963-11-18 1966-08-09 Mitronics Inc Cap for hermetically sealed semiconductor
US3271722A (en) * 1963-12-03 1966-09-06 Globe Union Inc Electrical component and thermally improved electrical insulating medium therefor
USB411062I5 (fr) * 1964-11-13
US3457476A (en) * 1965-02-12 1969-07-22 Hughes Aircraft Co Gate cooling structure for field effect transistors
US3515952A (en) * 1965-02-17 1970-06-02 Motorola Inc Mounting structure for high power transistors
US3506886A (en) * 1965-03-08 1970-04-14 Itt High power transistor assembly
GB1147645A (en) * 1965-07-01 1969-04-02 English Electric Co Ltd Housings for semi-conductor devices
US3377525A (en) * 1965-12-03 1968-04-09 Gen Electric Electrically insulated mounting bracket for encased semicon-ductor device
US3462654A (en) * 1966-10-05 1969-08-19 Int Rectifier Corp Electrically insulating-heat conductive mass for semiconductor wafers
US3419763A (en) * 1966-10-31 1968-12-31 Itt High power transistor structure
US3522491A (en) * 1967-05-31 1970-08-04 Wakefield Eng Inc Heat transfer apparatus for cooling semiconductor components
US3716759A (en) * 1970-10-12 1973-02-13 Gen Electric Electronic device with thermally conductive dielectric barrier
FR2156651B1 (fr) * 1971-10-01 1977-08-26 Gen Electric
US4222373A (en) * 1977-07-26 1980-09-16 Davis Michael A Ceramic solar collector
DE2755404A1 (de) * 1977-12-13 1979-06-21 Bosch Gmbh Robert Halbleiteranordnung
US4303935A (en) * 1977-12-13 1981-12-01 Robert Bosch Gmbh Semiconductor apparatus with electrically insulated heat sink
US4299715A (en) * 1978-04-14 1981-11-10 Whitfield Fred J Methods and materials for conducting heat from electronic components and the like
JPS5550646A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Integrated circuit device
US4301357A (en) * 1979-08-23 1981-11-17 Kv33 Corporation Electrically heated wax spatula using a diode as the heating element
US4602678A (en) * 1983-09-02 1986-07-29 The Bergquist Company Interfacing of heat sinks with electrical devices, and the like
JPS6066843A (ja) * 1983-09-22 1985-04-17 Hitachi Ltd 集積回路パツケ−ジ
US6616999B1 (en) * 2000-05-17 2003-09-09 Raymond G. Freuler Preapplicable phase change thermal interface pad
US6652705B1 (en) 2000-05-18 2003-11-25 Power Devices, Inc. Graphitic allotrope interface composition and method of fabricating the same
US6483707B1 (en) 2001-06-07 2002-11-19 Loctite Corporation Heat sink and thermal interface having shielding to attenuate electromagnetic interference
US6672378B2 (en) * 2001-06-07 2004-01-06 Loctite Corporation Thermal interface wafer and method of making and using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2740075A (en) * 1956-03-27 Metal rectifier assemblies
US2820929A (en) * 1958-01-21 Transistor holders
US2738452A (en) * 1950-06-30 1956-03-13 Siemens Ag Dry multi-pellet rectifiers
US2825014A (en) * 1953-11-30 1958-02-25 Philips Corp Semi-conductor device
US2725505A (en) * 1953-11-30 1955-11-29 Rca Corp Semiconductor power devices
CH328594A (fr) * 1954-07-03 1958-03-15 Csf Dispositif électronique comportant un élément semi-conducteur
NL110715C (fr) * 1954-12-16 1900-01-01

Also Published As

Publication number Publication date
FR1175953A (fr) 1959-04-03
DE1085261B (de) 1960-07-14
NL217849A (fr)
US2887628A (en) 1959-05-19
GB822770A (en) 1959-10-28

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