MY6900225A - Joined structures and methods of making same - Google Patents

Joined structures and methods of making same

Info

Publication number
MY6900225A
MY6900225A MY1969225A MY6900225A MY6900225A MY 6900225 A MY6900225 A MY 6900225A MY 1969225 A MY1969225 A MY 1969225A MY 6900225 A MY6900225 A MY 6900225A MY 6900225 A MY6900225 A MY 6900225A
Authority
MY
Malaysia
Prior art keywords
methods
making same
joined structures
joined
structures
Prior art date
Application number
MY1969225A
Other languages
English (en)
Original Assignee
Texas Instruments Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Incorporated filed Critical Texas Instruments Incorporated
Publication of MY6900225A publication Critical patent/MY6900225A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3013—Au as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Die Bonding (AREA)
MY1969225A 1962-03-02 1969-12-31 Joined structures and methods of making same MY6900225A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US177068A US3242391A (en) 1962-03-02 1962-03-02 Gold-germanium eutectic alloy for contact and alloy medium on semiconductor devices

Publications (1)

Publication Number Publication Date
MY6900225A true MY6900225A (en) 1969-12-31

Family

ID=22647049

Family Applications (1)

Application Number Title Priority Date Filing Date
MY1969225A MY6900225A (en) 1962-03-02 1969-12-31 Joined structures and methods of making same

Country Status (3)

Country Link
US (1) US3242391A (https=)
GB (1) GB1027525A (https=)
MY (1) MY6900225A (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1386343A (fr) * 1963-11-26 1965-01-22 Mémoires matricielles à cryosars bistables et procédé de fabrication de telles mémoires
FR1393375A (fr) * 1964-01-24 1965-03-26 Radiotechnique Procédé de réalisation d'un contact ohmique sur du silicium de forte résistivité
US3361592A (en) * 1964-03-16 1968-01-02 Hughes Aircraft Co Semiconductor device manufacture
US3324361A (en) * 1964-12-11 1967-06-06 Texas Instruments Inc Semiconductor contact alloy
US3461462A (en) * 1965-12-02 1969-08-12 United Aircraft Corp Method for bonding silicon semiconductor devices
US3607148A (en) * 1969-07-23 1971-09-21 Motorola Inc Solder preforms on a semiconductor wafer
US4186410A (en) * 1978-06-27 1980-01-29 Bell Telephone Laboratories, Incorporated Nonalloyed ohmic contacts to n-type Group III(a)-V(a) semiconductors
GB2031223A (en) * 1978-09-22 1980-04-16 Gen Instrument Corp Method for bonding a refractory metal contact member to a semiconductor body
US4418857A (en) * 1980-12-31 1983-12-06 International Business Machines Corp. High melting point process for Au:Sn:80:20 brazing alloy for chip carriers
US4824009A (en) * 1981-12-31 1989-04-25 International Business Machines Corporation Process for braze attachment of electronic package members
US4518112A (en) * 1982-12-30 1985-05-21 International Business Machines Corporation Process for controlled braze joining of electronic packaging elements
JP2760107B2 (ja) * 1989-12-07 1998-05-28 住友電気工業株式会社 セラミックス基板の表面構造およびその製造方法
DE102010013610B4 (de) * 2010-03-22 2013-04-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum stoffschlüssigen Verbinden von elektronischen Bauelementen oder Kontaktelementen und Substraten
US9893043B2 (en) * 2014-06-06 2018-02-13 Taiwan Semiconductor Manufacturing Company, Ltd. Method of manufacturing a chip package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2796563A (en) * 1955-06-10 1957-06-18 Bell Telephone Labor Inc Semiconductive devices
US2935453A (en) * 1957-04-11 1960-05-03 Sylvania Electric Prod Manufacture of semiconductive translating devices
US2942166A (en) * 1959-03-23 1960-06-21 Philco Corp Semiconductor apparatus

Also Published As

Publication number Publication date
GB1027525A (https=)
US3242391A (en) 1966-03-22

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