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Application filed by Suki Tech Sdn BhdfiledCriticalSuki Tech Sdn Bhd
Priority to MYPI2017704758ApriorityCriticalpatent/MY197752A/en
Publication of MY197752ApublicationCriticalpatent/MY197752A/en
Testing Of Individual Semiconductor Devices
(AREA)
Abstract
A testing apparatus (100) for electronic components is provided herein. The testing apparatus (100) includes a top mounting block (42) and a bottom mounting block (46). The testing apparatus (100) further includes a contact element (48) located between the top mounting block (42) and the bottom mounting block (46), the contact element (48) configured to receive electrical leads of an electronic component, provide contact to the electrical leads, and facilitate electrical testing of the electronic component. The contact element (48) includes a bending curve with a substantially large radius, and a length of the bottom mounting block (46) is shorter than a length of the top mounting block (42) to provide bending space for the contact element (48) and increase lifespan of the contact element (48). ( Figure 3)
MYPI2017704758A2017-12-122017-12-12Testing apparatus for electronic components
MY197752A
(en)