MY196392A - Resin Molded Member - Google Patents
Resin Molded MemberInfo
- Publication number
- MY196392A MY196392A MYPI2019005230A MYPI2019005230A MY196392A MY 196392 A MY196392 A MY 196392A MY PI2019005230 A MYPI2019005230 A MY PI2019005230A MY PI2019005230 A MYPI2019005230 A MY PI2019005230A MY 196392 A MY196392 A MY 196392A
- Authority
- MY
- Malaysia
- Prior art keywords
- resin molded
- molded member
- stacked
- peripheral edge
- design surface
- Prior art date
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
A resin molded member (10) includes a first portion (11) including a design surface, a back surface as an opposite surface of the design surface, and an opening portion penetrating the resin molded member from the design surface to the back surface, and a second portion (12) molded integrally with the first portion and made of a resin material different from that of the first portion, wherein the second portion includes a peripheral edge portion (12a) formed at a peripheral edge of the opening portion, a stacked portion (12b) stacked on the back surface of the first portion and connected to the peripheral edge portion, and an exposed portion (12c) connected to the stacked portion and exposed through the design surface. (Figure 3)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018178681A JP6976917B2 (en) | 2018-09-25 | 2018-09-25 | Resin molding member |
Publications (1)
Publication Number | Publication Date |
---|---|
MY196392A true MY196392A (en) | 2023-03-28 |
Family
ID=69995611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2019005230A MY196392A (en) | 2018-09-25 | 2019-09-11 | Resin Molded Member |
Country Status (2)
Country | Link |
---|---|
JP (2) | JP6976917B2 (en) |
MY (1) | MY196392A (en) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2734164B2 (en) * | 1990-03-29 | 1998-03-30 | 三菱マテリアル株式会社 | Multiple mold equipment |
JP3278926B2 (en) | 1992-09-29 | 2002-04-30 | 株式会社デンソー | Semiconductor pressure sensor |
JPH09131756A (en) * | 1995-11-09 | 1997-05-20 | Sony Corp | Insert molding method |
JP3400336B2 (en) * | 1998-02-19 | 2003-04-28 | 森六株式会社 | Manufacturing method of vehicle interior parts |
JP4484307B2 (en) * | 2000-04-14 | 2010-06-16 | 株式会社東郷製作所 | Molding equipment for forming different materials |
JP3740558B2 (en) * | 2000-12-13 | 2006-02-01 | サカイヤ銘版株式会社 | Synthetic resin molded product and method for producing the same |
JP2008000983A (en) * | 2006-06-22 | 2008-01-10 | Seiko Epson Corp | Double color molded member, double color product, electronic device, and metal plating method |
JP5235470B2 (en) * | 2008-03-31 | 2013-07-10 | ダイハツ工業株式会社 | Injection mold and injection molding method |
JP5441589B2 (en) * | 2009-09-29 | 2014-03-12 | ダイハツ工業株式会社 | Injection molding method |
JP2011156749A (en) * | 2010-02-01 | 2011-08-18 | Kojima Press Industry Co Ltd | Three-color molding method |
JP6336764B2 (en) * | 2014-01-31 | 2018-06-06 | マクセルホールディングス株式会社 | Resin parts for automobile and manufacturing method thereof |
JP2017039277A (en) * | 2015-08-20 | 2017-02-23 | 京セラ株式会社 | Electronic equipment and production method thereof |
-
2018
- 2018-09-25 JP JP2018178681A patent/JP6976917B2/en active Active
-
2019
- 2019-09-11 MY MYPI2019005230A patent/MY196392A/en unknown
-
2021
- 2021-09-22 JP JP2021154599A patent/JP7102596B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP7102596B2 (en) | 2022-07-19 |
JP2020049683A (en) | 2020-04-02 |
JP6976917B2 (en) | 2021-12-08 |
JP2021191642A (en) | 2021-12-16 |
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