MY192218A - Sintering press and method for sintering electronic components on a substrate - Google Patents

Sintering press and method for sintering electronic components on a substrate

Info

Publication number
MY192218A
MY192218A MYPI2019003670A MYPI2019003670A MY192218A MY 192218 A MY192218 A MY 192218A MY PI2019003670 A MYPI2019003670 A MY PI2019003670A MY PI2019003670 A MYPI2019003670 A MY PI2019003670A MY 192218 A MY192218 A MY 192218A
Authority
MY
Malaysia
Prior art keywords
sintering
presser
substrate
electronic components
press
Prior art date
Application number
MYPI2019003670A
Inventor
Nicola Schivalocchi
Original Assignee
Amx Automatrix S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=58701745&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY192218(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Amx Automatrix S R L filed Critical Amx Automatrix S R L
Publication of MY192218A publication Critical patent/MY192218A/en

Links

Classifications

    • H10W72/073—
    • H10P95/90—
    • H10W72/0198—
    • H10W72/01365—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07152—
    • H10W72/07173—
    • H10W72/07183—
    • H10W72/07311—
    • H10W72/07331—
    • H10W72/07332—

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Press Drives And Press Lines (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A sintering press to sinter electronic components (10) on a substrate (12) comprises a pressing unit (14) comprising a multi-rod cylinder (20) having a front head (22) and a rear head (24) which jointly delimit a compression chamber (26). In the front head (22), presser rods (28) parallel and independent of each other are slidingly supported. Each presser rod (28) is coaxial and barycentric to a respective electronic component (10) to be sintered and has a thrust section proportional to the force to be applied to the respective electronic component (10). In the compression chamber (26) a sealing membrane (30) extends, which is deformed so as to abut against the presser rods for transferring the sintering pressure on each presser rod (28). (Fig. 3)
MYPI2019003670A 2017-01-02 2017-12-29 Sintering press and method for sintering electronic components on a substrate MY192218A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT102017000000191A IT201700000191A1 (en) 2017-01-02 2017-01-02 PRESS AND METHOD OF SINTERIZATION OF ELECTRONIC COMPONENTS ON A SUBSTRATE
PCT/IB2017/058520 WO2018122795A1 (en) 2017-01-02 2017-12-29 Sintering press and method for sintering electronic components on a substrate

Publications (1)

Publication Number Publication Date
MY192218A true MY192218A (en) 2022-08-09

Family

ID=58701745

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019003670A MY192218A (en) 2017-01-02 2017-12-29 Sintering press and method for sintering electronic components on a substrate

Country Status (10)

Country Link
US (1) US11380647B2 (en)
EP (1) EP3563409B1 (en)
JP (1) JP7141724B2 (en)
KR (1) KR102427842B1 (en)
CN (1) CN110140201B (en)
ES (1) ES2870636T3 (en)
IT (1) IT201700000191A1 (en)
MY (1) MY192218A (en)
PH (1) PH12019501477A1 (en)
WO (1) WO2018122795A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT201800006846A1 (en) 2018-07-02 2020-01-02 PRESSING GROUP FOR A SINTERING PRESS OF ELECTRONIC COMPONENTS ON A SUBSTRATE
IT201800007256A1 (en) * 2018-07-17 2020-01-17 PRESSING ORGAN, PRESSING GROUP AND SINTERING PRESS OF ELECTRONIC COMPONENTS ON A SUBSTRATE
IT201800020275A1 (en) * 2018-12-20 2020-06-20 Amx Automatrix S R L SINTERING PRESS FOR SINTERING ELECTRONIC COMPONENTS ON A SUBSTRATE
IT201800020272A1 (en) 2018-12-20 2020-06-20 Amx Automatrix S R L SINTERING PRESS FOR SINTERING ELECTRONIC COMPONENTS ON A SUBSTRATE
EP3709342A1 (en) 2019-03-12 2020-09-16 Infineon Technologies AG Arrangement and method for joining at least two joining members using a foil on a carrier element interposed between the upper one of the joining members and a pressure exerting part
DE102021118949B4 (en) 2021-07-22 2024-10-10 Semikron Elektronik Gmbh & Co. Kg Device and method for pressure sintering
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DE102021126718A1 (en) 2021-10-14 2023-04-20 Pink Gmbh Thermosysteme SINTERING DEVICE FOR CONNECTING COMPONENTS OF AT LEAST AN ELECTRONIC ASSEMBLY
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US20240030181A1 (en) * 2022-07-22 2024-01-25 Asmpt Singapore Pte. Ltd. Apparatus for applying a sintering force via a compressible film
US20250256476A1 (en) * 2022-08-25 2025-08-14 Pink Gmbh Thermosysteme Sintering device and method
IT202300013680A1 (en) * 2023-06-30 2024-12-30 Amx Automatrix S R L FILM REMOVAL FRAME FOR A SINTERING PRESS
KR102832985B1 (en) * 2023-09-12 2025-07-14 주식회사 브로젠 Sysmem of coining bumps of a substrate and method of coining bumps of a substrate
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CN119347215A (en) * 2024-09-03 2025-01-24 中科光智(重庆)科技有限公司 A nano silver sintering machine

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Also Published As

Publication number Publication date
US20190326250A1 (en) 2019-10-24
JP2020516048A (en) 2020-05-28
EP3563409A1 (en) 2019-11-06
PH12019501477A1 (en) 2020-03-09
WO2018122795A1 (en) 2018-07-05
EP3563409B1 (en) 2021-02-17
KR20190099043A (en) 2019-08-23
JP7141724B2 (en) 2022-09-26
CN110140201A (en) 2019-08-16
CN110140201B (en) 2023-08-04
ES2870636T3 (en) 2021-10-27
US11380647B2 (en) 2022-07-05
KR102427842B1 (en) 2022-08-01
IT201700000191A1 (en) 2018-07-02

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