MY187114A - Method and apparatus for separating a component from a thermoset polymer adhered to the component - Google Patents

Method and apparatus for separating a component from a thermoset polymer adhered to the component

Info

Publication number
MY187114A
MY187114A MYPI2018703571A MYPI2018703571A MY187114A MY 187114 A MY187114 A MY 187114A MY PI2018703571 A MYPI2018703571 A MY PI2018703571A MY PI2018703571 A MYPI2018703571 A MY PI2018703571A MY 187114 A MY187114 A MY 187114A
Authority
MY
Malaysia
Prior art keywords
component
thermoset polymer
separating
polymer adhered
adhered
Prior art date
Application number
MYPI2018703571A
Inventor
Xiaodong Li
Yanru Lu
Xi Jiang Yin
Original Assignee
Singapore Polytechnic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singapore Polytechnic filed Critical Singapore Polytechnic
Publication of MY187114A publication Critical patent/MY187114A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0812—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using induction
    • B32B2310/0818—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using induction using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Photovoltaic Devices (AREA)

Abstract

Various embodiments may provide a method of separating a component from a thermoset polymer adhered to the component according to various embodiments. The method may include providing the component and the thermoset polymer adhered to the component. The method may further include providing radio frequency electromagnetic waves to induce a current in an electrically conductive surface of the component. The current may generate heat to reduce a bonding force adhering the thermoset polymer to the component so that the component is separated from the thermoset polymer.
MYPI2018703571A 2016-04-19 2017-04-19 Method and apparatus for separating a component from a thermoset polymer adhered to the component MY187114A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG10201603100XA SG10201603100XA (en) 2016-04-19 2016-04-19 Method and apparatus for separating a component from a thermoset polymer adhered to the component
PCT/SG2017/050215 WO2017184079A1 (en) 2016-04-19 2017-04-19 Method and apparatus for separating a component from a thermoset polymer adhered to the component

Publications (1)

Publication Number Publication Date
MY187114A true MY187114A (en) 2021-09-01

Family

ID=60116920

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018703571A MY187114A (en) 2016-04-19 2017-04-19 Method and apparatus for separating a component from a thermoset polymer adhered to the component

Country Status (3)

Country Link
MY (1) MY187114A (en)
SG (1) SG10201603100XA (en)
WO (1) WO2017184079A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106414636B (en) * 2014-05-30 2020-04-14 汉高股份有限及两合公司 Method and apparatus for disassembling display module bonded by liquid optically clear adhesive
CN112349807B (en) * 2019-08-09 2022-06-14 泰州隆基乐叶光伏科技有限公司 Method for extracting battery piece
DE102021129301B3 (en) 2021-11-10 2023-01-19 SOLAR MATERIALS GmbH Method and device for processing a solar module
WO2023222417A1 (en) * 2022-05-17 2023-11-23 SOLAR MATERIALS GmbH Method for processing a layer element

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3935390A1 (en) * 1988-10-25 1990-04-26 Toshiba Kawasaki Kk METHOD FOR DISASSEMBLING RESIN-MOLDED DEVICES
FR2787366B1 (en) * 1998-12-17 2001-02-16 Eurocopter France METHOD AND DEVICE FOR REMOVING AN ADHESIVE RETAINED PLATE FROM A SUPPORT PART
US7358724B2 (en) * 2005-05-16 2008-04-15 Allegro Microsystems, Inc. Integrated magnetic flux concentrator
CN101783279B (en) * 2009-01-15 2011-11-16 展晶科技(深圳)有限公司 Method for spearing two materials
GB2492548B (en) * 2011-07-04 2015-12-30 Rolls Royce Plc Adhesive fastening element with first and second members for holding a work piece
JP5995089B2 (en) * 2012-05-31 2016-09-21 パナソニックＩｐマネジメント株式会社 Silicon wafer peeling method and silicon wafer peeling apparatus
ITBA20130021A1 (en) * 2013-03-12 2014-09-13 Politecnico Di Bari "CRYOGENIC PROCESS FOR THE RECOVERY OF RIGID MONO OR POLY-CRYSTALLINE MATERIALS OR AMORFI COVERED WITH PLASTIC MATERIALS"
US9283598B2 (en) * 2014-05-20 2016-03-15 The Boeing Company Methods, systems, and devices for radio-frequency assisted removal of sealant

Also Published As

Publication number Publication date
SG10201603100XA (en) 2017-11-29
WO2017184079A1 (en) 2017-10-26

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