MY175054A - Bonding material and bonding method in which said bonding material is used - Google Patents
Bonding material and bonding method in which said bonding material is usedInfo
- Publication number
- MY175054A MY175054A MYPI2014701818A MYPI2014701818A MY175054A MY 175054 A MY175054 A MY 175054A MY PI2014701818 A MYPI2014701818 A MY PI2014701818A MY PI2014701818 A MYPI2014701818 A MY PI2014701818A MY 175054 A MY175054 A MY 175054A
- Authority
- MY
- Malaysia
- Prior art keywords
- bonding
- carbon atoms
- particle diameter
- bonding material
- primary particle
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 abstract 2
- 125000004432 carbon atom Chemical group C* 0.000 abstract 2
- 238000001035 drying Methods 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- 239000011164 primary particle Substances 0.000 abstract 2
- 239000004332 silver Substances 0.000 abstract 2
- 229910052709 silver Inorganic materials 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- 238000009835 boiling Methods 0.000 abstract 1
- 238000004807 desolvation Methods 0.000 abstract 1
- 239000002270 dispersing agent Substances 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
Landscapes
- Powder Metallurgy (AREA)
Abstract
The occurrence of uneven drying in the center and end of a surface of a bonding layer during a desolvation process of a pre-drying step is reduced to ensure highly reliable bonding without peeling of a bonding surface even after repeated exposure to heat shock after bonding. The bonding material of the present invention to achieve the object contains silver nanoparticles coated with organic substance having 6 or less carbon atoms and having an average primary particle diameter of 10 to 30 nm as main silver particles, silver nanoparticles coated with an organic substance having 6 or less carbon atoms and having an average primary particle diameter of 100 to 200 nm as secondary silver particles, two kinds of solvents having different boiling points, and a dispersant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI2014701818A MY175054A (en) | 2012-01-20 | 2012-01-20 | Bonding material and bonding method in which said bonding material is used |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/051277 WO2013108408A1 (en) | 2012-01-20 | 2012-01-20 | Bonding material and bonding method in which said bonding material is used |
| MYPI2014701818A MY175054A (en) | 2012-01-20 | 2012-01-20 | Bonding material and bonding method in which said bonding material is used |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY175054A true MY175054A (en) | 2020-06-03 |
Family
ID=79265625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2014701818A MY175054A (en) | 2012-01-20 | 2012-01-20 | Bonding material and bonding method in which said bonding material is used |
Country Status (1)
| Country | Link |
|---|---|
| MY (1) | MY175054A (en) |
-
2012
- 2012-01-20 MY MYPI2014701818A patent/MY175054A/en unknown
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