MY144581A - Adhesive composition and a use thereof - Google Patents

Adhesive composition and a use thereof

Info

Publication number
MY144581A
MY144581A MYPI20072174A MY144581A MY 144581 A MY144581 A MY 144581A MY PI20072174 A MYPI20072174 A MY PI20072174A MY 144581 A MY144581 A MY 144581A
Authority
MY
Malaysia
Prior art keywords
adhesive composition
softening point
resin
phenolic
aromatic epoxy
Prior art date
Application number
Inventor
Tsuyoshi Honda
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of MY144581A publication Critical patent/MY144581A/en

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Abstract

AN ADHESIVE COMPOSITION COMPRISING (A) AN AROMATIC EPOXY RESIN HAVING A SOFTENING POINT OF FROM 500C TO 100 OC AND (B)A PHENOLIC RESIN HAVING A SOFTENING POINT OF FROM 500C TO 100 OC IN SUCH AN AMOUNT THAT A MOLAR RATIO OF THE PHENOLIC HYDROXYL GROUP OF THE PHENOLIC RESIN (B) TO THE EPOXY GROUP OF THE AROMATIC EPOXY RESIN (A) RANGES FROM 0.8 TO 1.2. THE ADHESIVE COMPOSITION IS SUITABLE FOR MAKING AIRTIGHT VESSELS FOR ELECTRONIC ELEMENTS.
MYPI20072174 2006-12-05 2007-12-05 Adhesive composition and a use thereof MY144581A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006328735A JP4395505B2 (en) 2006-12-05 2006-12-05 Adhesive composition and method of using the composition

Publications (1)

Publication Number Publication Date
MY144581A true MY144581A (en) 2011-10-14

Family

ID=39599964

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20072174 MY144581A (en) 2006-12-05 2007-12-05 Adhesive composition and a use thereof

Country Status (2)

Country Link
JP (1) JP4395505B2 (en)
MY (1) MY144581A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101251200B1 (en) * 2008-08-20 2013-04-08 주식회사 엘지화학 Adhesive composition, adhesive film, dicing die bonding film, semiconductor wafer and semiconductor device
KR101191111B1 (en) 2008-09-24 2012-10-15 주식회사 엘지화학 Adhesive composition, adhesive film, dicing die bonding film, semiconductor wafer and semiconductor device

Also Published As

Publication number Publication date
JP2008138148A (en) 2008-06-19
JP4395505B2 (en) 2010-01-13

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