MY141420A - Shape of wire loop, semiconductor device provided with wire loop having such a shape and wire bonding method - Google Patents

Shape of wire loop, semiconductor device provided with wire loop having such a shape and wire bonding method

Info

Publication number
MY141420A
MY141420A MYPI20052100A MYPI20052100A MY141420A MY 141420 A MY141420 A MY 141420A MY PI20052100 A MYPI20052100 A MY PI20052100A MY PI20052100 A MYPI20052100 A MY PI20052100A MY 141420 A MY141420 A MY 141420A
Authority
MY
Malaysia
Prior art keywords
wire
shape
wire loop
semiconductor device
device provided
Prior art date
Application number
MYPI20052100A
Inventor
Mizuho Shirato
Hiromi Fujisawa
Tadahisa Akita
Original Assignee
Kaijo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Kk filed Critical Kaijo Kk
Priority to MYPI20052100A priority Critical patent/MY141420A/en
Publication of MY141420A publication Critical patent/MY141420A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Abstract

A WIRE LOOP INCLUDES A WIRE (3) CONNECTING A FIRST BONDING POINT (A) AND A SECOND BONDING POINT (Z) THERETHROUGH, WHEREIN AN ADDITIONAL WIRE LOOP (P) IS FORMED AFTER WIRE BONDING AT THE SECOND BONDING POINT (Z) WITHOUT CUTTING THE WIRE (3) AND THE ADDITIONAL WIRE LOOP (P) IS BONDED TO THE SECOND BONDING POINT (Z) OR TO THE VICINITY THEREOF WHILE PART OF THE WIRE (3) IS CRUSHED.
MYPI20052100A 2005-05-10 2005-05-10 Shape of wire loop, semiconductor device provided with wire loop having such a shape and wire bonding method MY141420A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI20052100A MY141420A (en) 2005-05-10 2005-05-10 Shape of wire loop, semiconductor device provided with wire loop having such a shape and wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20052100A MY141420A (en) 2005-05-10 2005-05-10 Shape of wire loop, semiconductor device provided with wire loop having such a shape and wire bonding method

Publications (1)

Publication Number Publication Date
MY141420A true MY141420A (en) 2010-04-30

Family

ID=44256719

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20052100A MY141420A (en) 2005-05-10 2005-05-10 Shape of wire loop, semiconductor device provided with wire loop having such a shape and wire bonding method

Country Status (1)

Country Link
MY (1) MY141420A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220199571A1 (en) * 2020-12-23 2022-06-23 Skyworks Solutions, Inc. Apparatus and methods for tool mark free stitch bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220199571A1 (en) * 2020-12-23 2022-06-23 Skyworks Solutions, Inc. Apparatus and methods for tool mark free stitch bonding

Similar Documents

Publication Publication Date Title
TW200629450A (en) Wire loop, semiconductor device having same and wire bonding method
TW200633237A (en) Semiconductor device and method for producing the same
MY159064A (en) Semiconductor die package and method for making the same
TW200729442A (en) Semiconductor die package using leadframe and clip and method of manufacturing
MY135211A (en) Semiconductor device having a wire loop with a crushed part on a ball, loop wire bonding method and loop wire bonding apparatus for carrying out such method
TW200520123A (en) Method for mounting semiconductor chip and semiconductor chip-mounted board
SG152986A1 (en) Integrated circuit package system with shield
TW200721421A (en) Semiconductor structure and method of assembly
TW200739874A (en) Integrated circuit package system
SG163530A1 (en) Copper wire bonding on organic solderability preservative materials
WO2010068652A3 (en) Semiconductor die package with clip interconnection
WO2007100927A3 (en) Method of packaging a semiconductor die and package thereof
TW200640325A (en) Wiring board manufacturing method
TW200634946A (en) Device and method for fabricating double-sided SOI wafer scale package with through via connections
TW200943517A (en) Semiconductor die package including embedded flip chip
TW200605981A (en) System and method for low loop wire bonding
SG170099A1 (en) Integrated circuit package system with warp-free chip
SG151238A1 (en) Integrated circuit package system including die having relieved active region
TW200627555A (en) Method for wafer level package
SG142326A1 (en) Integrated circuit package system with heat slug
TW200725827A (en) Structure and process of chip package
TW200721411A (en) Solder layer, heat-dissipating substrate using the same and manufacturing method thereof
TW200621624A (en) Assembly
TW200614458A (en) Flip chip bga process and package with stiffener ring
TW200731426A (en) Method of fabricating an exposed die package