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Application filed by Vishay Infrared Components IncfiledCriticalVishay Infrared Components Inc
Publication of MY139875ApublicationCriticalpatent/MY139875A/en
Encapsulation Of And Coatings For Semiconductor Or Solid State Devices
(AREA)
Casting Or Compression Moulding Of Plastics Or The Like
(AREA)
Abstract
AN INJECTION CASTING SYSTEM (10) FOR ENCAPSULATING SEMICONDUCTOR PRODUCTS AND METHOD OF USE INCLUDES A MOLD UNIT (12) HAVING A CAVITY (26), A SUBSTRATE MATERIAL PLACED AGAINST THE CAVITY (26), THE CAVITY (26) BEING FILLED BY A LIQUID DISPENSER (44) IN CONTACT WITH THE BOTTOM OF THE CAVITY (26) AND A RUNNING CHANNEL (42) AT THE BOTTOM OF THE CAVITY (26) TO RECEIVE THE LIQUID DISPENSER (44) FOR EVEN DISPERSION OF EPOXY (54) IN THE CAVITY (26) FROM THE BOTTOM OF THE CAVITY UPWARD TO THE TOP OF THE CAVITY.
MYPI200517802004-04-232005-04-22Injection casting system for encapsulating semiconductor devices and method of use
MY139875A
(en)