MY134674A - Belt for feeding semiconductor lead frame strip - Google Patents

Belt for feeding semiconductor lead frame strip

Info

Publication number
MY134674A
MY134674A MYPI20014285A MYPI20014285A MY134674A MY 134674 A MY134674 A MY 134674A MY PI20014285 A MYPI20014285 A MY PI20014285A MY PI20014285 A MYPI20014285 A MY PI20014285A MY 134674 A MY134674 A MY 134674A
Authority
MY
Malaysia
Prior art keywords
belt
lead frame
frame strip
semiconductor lead
fingers
Prior art date
Application number
MYPI20014285A
Inventor
Jae Song Chung
Original Assignee
Astjetec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Astjetec Co Ltd filed Critical Astjetec Co Ltd
Publication of MY134674A publication Critical patent/MY134674A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Belt Conveyors (AREA)
  • Manipulator (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

DISCLOSED IS A BELT (1) ADAPTED FOR FEEDING A SEMICONDUCTOR LEAD FRAME STRIP (5) IN A STATE WHEREIN A PLURALITY OF FINGERS (3) ARE COUPLED TO THE BELT (1) AND THE SEMICONDUCTOR LEAD FRAME STRIP (5) IS GRASPED BETWEEN THE PLURALITY OF FINGERS (3) AND THE BELT (1). A PLURALITY OF PROJECTIONS (10) ARE INTEGRALLY FORMED ON AN EDGE OF THE BELT (1) AT LOCATIONS CORRESPONDING TO GRASPING DISTAL END PORTIONS (30) OF THE PLURALITY OF FINGERS (3) IN A MANNER SUCH THAT THE PLURALITY OF PROJECTIONS (10) CAN BE ENGAGED WITH THE GRASPING DISTAL END PORTIONS (30) OF THE PLURALITY OF FINGERS (3), RESPECTIVELY, WITH THE BELT (1) AND THE PLURALITY OF FINGERS (3) CONSTITUTING GRASPING MEANS FOR THE SEMICONDUCTOR LEAD FRAME STRIP (5).(FIG 9)
MYPI20014285A 2000-12-28 2001-09-12 Belt for feeding semiconductor lead frame strip MY134674A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2020000036794U KR200225469Y1 (en) 2000-12-28 2000-12-28 Feeding Belt For Semi-Conductor Lead Frame Strip

Publications (1)

Publication Number Publication Date
MY134674A true MY134674A (en) 2007-12-31

Family

ID=19675106

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20014285A MY134674A (en) 2000-12-28 2001-09-12 Belt for feeding semiconductor lead frame strip

Country Status (3)

Country Link
KR (1) KR200225469Y1 (en)
CN (1) CN1217833C (en)
MY (1) MY134674A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4422047B2 (en) * 2005-02-28 2010-02-24 セイコーインスツル株式会社 Pallet for transporting electronic parts and method of manufacturing electronic parts using the same
CN105789100B (en) * 2016-05-17 2018-11-13 安徽大华半导体科技有限公司 Lead frame for semiconductor packaging system grips system

Also Published As

Publication number Publication date
CN1217833C (en) 2005-09-07
KR200225469Y1 (en) 2001-06-01
CN1361055A (en) 2002-07-31

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