MY125665A - Laminating method of film-shaped organic die-bonding material, die bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device - Google Patents

Laminating method of film-shaped organic die-bonding material, die bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device

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Publication number
MY125665A
MY125665A MYPI9601492A MY125665A MY 125665 A MY125665 A MY 125665A MY PI9601492 A MYPI9601492 A MY PI9601492A MY 125665 A MY125665 A MY 125665A
Authority
MY
Malaysia
Prior art keywords
die
bonding
semiconductor device
film
laminating
Prior art date
Application number
Inventor
Aizou Kaneda
Takashi Masuko
Tooru Kikuchi
Yasuo Miyadera
Yuusuke Miyamae
Akio Kotato
Akira Kageyama
Iwao Maekawa
Makoto Saitou
Masami Yusa
Mituo Yamasaki
Shinji Takeda
Tadaji Satou
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP17349395A external-priority patent/JP3215014B2/en
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of MY125665A publication Critical patent/MY125665A/en

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  • Die Bonding (AREA)

Abstract

A LAMINATING METHOD AND A MACHINE ARE PROVIDED FOR SUCCESSIVELY HEATING AND COMPRESSION-BONDING A FILM-SHAPED ORGANIC DIE-BONDING MATERIAL ON A LEADFRAME WITH GOOD PRODUCTIVITY BUT WITHOUT VOIDS AND FURTHER TO AVOID PACKAGE CRACKING UPON MOUNTING A CHIP. A LEADFRAME (7) IS PLACED ON A TRAVELLING TABLE (8) AND IS HEATED THERE. A FILM-SHAPED ORGANIC DIE-BONDING MATERIAL (2) IS PUNCHED OUT AND THE RESULTING FILM IS TACK-BONDED TO A DIE PAD ON THE LEADFRAME. THE LEADFRAME WITH THE FILM TACK-BONDED THEREON IS THEN MOVED TO A POSITION B BY THE TRAVELLING TABLE. AFTER THE FILM IS PRESSED BY A COMPRESSION-BONDING ELEMENT AT THE POSITION B, A CHIP IS MOUNTED ON THE FILMESHAPED ORGANIC DIE-BONDING MATERIAL (2). (FIGURE 1)
MYPI9601492 1995-04-28 1996-04-19 Laminating method of film-shaped organic die-bonding material, die bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device MY125665A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10601695 1995-04-28
JP17349395A JP3215014B2 (en) 1994-10-31 1995-07-10 Laminating method of film-shaped organic die bonding material, die bonding method, laminating device, die bonding device, semiconductor device, and method of manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
MY125665A true MY125665A (en) 2006-08-30

Family

ID=45893896

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI9601492 MY125665A (en) 1995-04-28 1996-04-19 Laminating method of film-shaped organic die-bonding material, die bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
MYPI0304170 MY136814A (en) 1995-04-28 1996-04-19 Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI0304170 MY136814A (en) 1995-04-28 1996-04-19 Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device

Country Status (1)

Country Link
MY (2) MY125665A (en)

Also Published As

Publication number Publication date
MY136814A (en) 2008-11-28

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