MY124258A - Method of testing electronic components and testing apparatus for electronic components - Google Patents

Method of testing electronic components and testing apparatus for electronic components

Info

Publication number
MY124258A
MY124258A MYPI99003532A MYPI9903532A MY124258A MY 124258 A MY124258 A MY 124258A MY PI99003532 A MYPI99003532 A MY PI99003532A MY PI9903532 A MYPI9903532 A MY PI9903532A MY 124258 A MY124258 A MY 124258A
Authority
MY
Malaysia
Prior art keywords
electronic components
electronic devices
test
defective
testing
Prior art date
Application number
MYPI99003532A
Inventor
Yoshihito Kobayashi
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of MY124258A publication Critical patent/MY124258A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H10P74/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)

Abstract

A METHOD OF JUDGING WHETHER AN ELECTRONIC COMPONENT IS GOOD OR DEFECTIVE IN ACCORDANCE WITH A RESPONSE OUTPUT SIGNAL BY INPUTTING A TEST SIGNAL TO THE IC TO BE TESTED,WHEREIN A COMMON TEST SIGNAL IS INPUT TO RESPECTIVE ELECTRONIC DEVICES A1 AND A2 OF A GROUP OF ELECTRONIC DEVICES COMPOSED OF A PLURALITY OF ELECTRONIC DEVICES, AND IN ACCORDANCE WITH A RESPONSE SIGNAL THEREOF, THE GROUP OF ELECTRONICDEVICES AS A WHOLE SUBJECTED TO THE TEST IS JUDGED TO BE GOOD OR DEFECTIVE. IN THE SECOND TEST, EACH OF THE DUTS A1 AND A2 OF THE GROUP OF ELECTRONIC DEVICES JUDGED TO BE DEFECTIVE IS INPUT A MUTUALLY INDEPENDENT TEST SIGNAL, AND IN ACCORDANCE WITH THE RESPONSE SIGNAL THEREOF, IT IS JUDGED WHETHER EACH WITH THE EACH OF THE ELECTRONIC DEVICES A1 AND A2 SUBJECTED TO THE TEST IS GOOD OR DEFECTIVE.
MYPI99003532A 1998-08-20 1999-08-17 Method of testing electronic components and testing apparatus for electronic components MY124258A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23386298A JP4018254B2 (en) 1998-08-20 1998-08-20 Testing method for electronic components

Publications (1)

Publication Number Publication Date
MY124258A true MY124258A (en) 2006-06-30

Family

ID=16961745

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI99003532A MY124258A (en) 1998-08-20 1999-08-17 Method of testing electronic components and testing apparatus for electronic components

Country Status (8)

Country Link
US (1) US6728652B1 (en)
JP (1) JP4018254B2 (en)
KR (1) KR20000017430A (en)
CN (1) CN1138984C (en)
DE (1) DE19939068A1 (en)
MY (1) MY124258A (en)
SG (1) SG80063A1 (en)
TW (1) TW484013B (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7027946B2 (en) * 2002-01-30 2006-04-11 Texas Instruments Incorporated Broadside compare with retest on fail
US7340364B1 (en) * 2003-02-26 2008-03-04 Advantest Corporation Test apparatus, and control method
KR100498496B1 (en) * 2003-05-07 2005-07-01 삼성전자주식회사 Testing method of remnant semiconductor device
WO2004108366A1 (en) * 2003-06-06 2004-12-16 Advantest Corporation Transport device, electronic component handling device, and transporting method for electronic component handling device
JP3990319B2 (en) * 2003-06-09 2007-10-10 株式会社アドバンテスト Transmission system, receiving device, test device, and test head
TWI260415B (en) * 2004-03-31 2006-08-21 Nanya Technology Corp Apparatus and method for testing semiconductor device
US7253650B2 (en) * 2004-05-25 2007-08-07 International Business Machines Corporation Increase productivity at wafer test using probe retest data analysis
KR100825774B1 (en) * 2006-03-22 2008-04-29 삼성전자주식회사 Handler with single door stocker
KR100790988B1 (en) * 2006-04-11 2008-01-03 삼성전자주식회사 Handler for semiconductor device inspection to maintain stable temperature in test environment
JP4684183B2 (en) * 2006-08-09 2011-05-18 株式会社日立ハイテクエンジニアリングサービス Test program generation system for semiconductor test equipment
JP4275163B2 (en) * 2006-09-22 2009-06-10 株式会社アドバンテスト Connector assembly, receptacle-type connector and interface device
WO2008044391A1 (en) 2006-10-05 2008-04-17 Advantest Corporation Testing device, testing method, and manufacturing method
JP2008227148A (en) * 2007-03-13 2008-09-25 Micronics Japan Co Ltd Semiconductor wafer testing method and apparatus
TWI472778B (en) * 2013-08-30 2015-02-11 Chroma Ate Inc System - level IC test machine automatic retest method and the test machine
TWI498573B (en) * 2013-11-05 2015-09-01 King Yuan Electronics Co Ltd Semiconductor Chip Retesting System and Retesting Method thereof
CN103592590B (en) * 2013-11-12 2016-01-13 上海大学 The test macro that a kind of LED component photoelectric heat is integrated and method
KR102102830B1 (en) * 2014-04-10 2020-04-23 (주)테크윙 Test handler, pushing device and test tray for testhandler, interface board for tester
CN105306151B (en) * 2014-07-04 2018-06-22 京信通信系统（中国）有限公司 The test data management method and system of a kind of RF power amplification
CN107037349A (en) * 2016-02-04 2017-08-11 沈阳晨讯希姆通科技有限公司 The intelligent test method and intelligent test system of circuit board
JP2018194356A (en) * 2017-05-15 2018-12-06 東京エレクトロン株式会社 Device inspection method
KR102610287B1 (en) * 2018-08-24 2023-12-06 (주)테크윙 Test tray and handler for testing electronic component
KR102742696B1 (en) * 2019-08-27 2024-12-16 삼성전자주식회사 test module, test handler and method for testing semiconductor device using the test module
CN110653181B (en) * 2019-08-30 2021-10-08 歌尔科技有限公司 Automatic retest machine for mainboard and retest method thereof
CN110726922A (en) * 2019-11-18 2020-01-24 格力电器（武汉）有限公司 A test device and method for a photosensitive detection board
US11726138B2 (en) * 2021-12-21 2023-08-15 Nanya Technology Corporation Method for testing semiconductor dies and test structure
CN117116796B (en) * 2023-08-30 2024-11-19 浙江达仕科技有限公司 Semiconductor element clamping and measuring module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0174224B1 (en) * 1984-07-27 1990-06-13 Fujitsu Limited Chip on chip type integrated circuit device
US5495486A (en) * 1992-08-11 1996-02-27 Crosscheck Technology, Inc. Method and apparatus for testing integrated circuits
US5654588A (en) * 1993-07-23 1997-08-05 Motorola Inc. Apparatus for performing wafer-level testing of integrated circuits where the wafer uses a segmented conductive top-layer bus structure
US5754559A (en) * 1996-08-26 1998-05-19 Micron Technology, Inc. Method and apparatus for testing integrated circuits
KR100216993B1 (en) * 1997-07-11 1999-09-01 윤종용 A test board for testing both integrated circuit device operating in merged data output mode and ic device operating standard mode
US5794175A (en) * 1997-09-09 1998-08-11 Teradyne, Inc. Low cost, highly parallel memory tester

Also Published As

Publication number Publication date
US6728652B1 (en) 2004-04-27
CN1245899A (en) 2000-03-01
TW484013B (en) 2002-04-21
KR20000017430A (en) 2000-03-25
JP4018254B2 (en) 2007-12-05
SG80063A1 (en) 2001-04-17
CN1138984C (en) 2004-02-18
DE19939068A1 (en) 2000-02-24
JP2000065894A (en) 2000-03-03

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