MY120645A - Lead frame and method of manufacturing the lead frame - Google Patents

Lead frame and method of manufacturing the lead frame

Info

Publication number
MY120645A
MY120645A MYPI20005787A MYPI20005787A MY120645A MY 120645 A MY120645 A MY 120645A MY PI20005787 A MYPI20005787 A MY PI20005787A MY PI20005787 A MYPI20005787 A MY PI20005787A MY 120645 A MY120645 A MY 120645A
Authority
MY
Malaysia
Prior art keywords
lead frame
thin plate
plate material
manufacturing
inclusion
Prior art date
Application number
MYPI20005787A
Inventor
Se-Chul Park
Dong-Il Shin
Sung-Il Kang
Sang-Hoon Lee
Bae-Soon Jang
Original Assignee
Samsung Techwin Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Techwin Co Ltd filed Critical Samsung Techwin Co Ltd
Publication of MY120645A publication Critical patent/MY120645A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Punching Or Piercing (AREA)

Abstract

A METHOD FOR MANUFACTURING A LEAD FRAME INCLUDING THE STEPS OF ELECTROCLEANING THE SURFACE OF A THIN PLATE MATERIAL, ELECTROPOLISHING THE ELECTROCLEANED THIN PLATE MATERIAL, REMOVING INCLUSIONS ON THE SURFACE OF THE ELETROPOLISHED THIN PLATE MATERIAL, RINSING THE INCLUSION-REMOVED THIN PLATE MATERIAL WITH AN ACIDIC SOLUTION, AND FORMING MULTI-PLATED LAYER ON THE RINSE MATERIAL. THE LEAD FRAME MANUFACTURED BY THE METHOD HAS 5 OR LESS INCLUSION EACH HAVING APPROXIMATELY 1 ( )M, ON THE SURFACE AREA OF 1600 ( )M2, WHICH INPEDE A WIRE ONDING P[ROPERTY OR SOLDER WETTABILITY ON THE LEAD FRAME.
MYPI20005787A 2000-08-17 2000-12-08 Lead frame and method of manufacturing the lead frame MY120645A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20000047498 2000-08-17
KR10-2000-0068500A KR100378485B1 (en) 2000-08-17 2000-11-17 Lead frame and method of manufacturing the same

Publications (1)

Publication Number Publication Date
MY120645A true MY120645A (en) 2005-11-30

Family

ID=19683526

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20005787A MY120645A (en) 2000-08-17 2000-12-08 Lead frame and method of manufacturing the lead frame

Country Status (2)

Country Link
KR (1) KR100378485B1 (en)
MY (1) MY120645A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100819797B1 (en) * 2002-05-02 2008-04-07 삼성테크윈 주식회사 Manufacturing method of lead frame and lead frame manufactured thereby

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60225455A (en) * 1984-04-24 1985-11-09 Kobe Steel Ltd Lead frame
JPH0368788A (en) * 1989-08-03 1991-03-25 Hitachi Cable Ltd Production of copper bar for lead frame
US5167794A (en) * 1990-04-16 1992-12-01 Mitsubishi Denki Kabushiki Kaisha Method for producing lead frame material
JPH0866830A (en) * 1994-08-29 1996-03-12 Sumitomo Metal Mining Co Ltd Electropolishing method of copper and copper alloy made lead frame
JPH08168924A (en) * 1994-12-19 1996-07-02 Sumitomo Metal Mining Co Ltd Electrolytic polishing method and manufacture of lead frame using it
JPH0964264A (en) * 1995-08-28 1997-03-07 Dainippon Printing Co Ltd Partial plating method for lead frame
US5660708A (en) * 1994-11-21 1997-08-26 Sumitomo Metal Mining Company, Limited Process for manufacturing a lead frame
JPH10237694A (en) * 1997-02-24 1998-09-08 Kobe Steel Ltd Production of copper alloy for lead frame excellent in resin adhesion

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60225455A (en) * 1984-04-24 1985-11-09 Kobe Steel Ltd Lead frame
JPH0368788A (en) * 1989-08-03 1991-03-25 Hitachi Cable Ltd Production of copper bar for lead frame
US5167794A (en) * 1990-04-16 1992-12-01 Mitsubishi Denki Kabushiki Kaisha Method for producing lead frame material
JPH0866830A (en) * 1994-08-29 1996-03-12 Sumitomo Metal Mining Co Ltd Electropolishing method of copper and copper alloy made lead frame
US5660708A (en) * 1994-11-21 1997-08-26 Sumitomo Metal Mining Company, Limited Process for manufacturing a lead frame
US5843290A (en) * 1994-11-21 1998-12-01 Sumitomo Metal Mining Co., Limited Electrolytic polishing apparatus
JPH08168924A (en) * 1994-12-19 1996-07-02 Sumitomo Metal Mining Co Ltd Electrolytic polishing method and manufacture of lead frame using it
JPH0964264A (en) * 1995-08-28 1997-03-07 Dainippon Printing Co Ltd Partial plating method for lead frame
JPH10237694A (en) * 1997-02-24 1998-09-08 Kobe Steel Ltd Production of copper alloy for lead frame excellent in resin adhesion

Also Published As

Publication number Publication date
KR20020014644A (en) 2002-02-25
KR100378485B1 (en) 2003-03-29

Similar Documents

Publication Publication Date Title
WO2003009361A3 (en) Planar metal electroprocessing
WO2001088954A3 (en) Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing
WO2001099173A3 (en) Method of treating a substrate
WO2004075265A3 (en) Methods for selectively bumping integrated circuit substrates and related structures
EP1115153A3 (en) Semiconductor substrate and process for its production
DE102005054872A1 (en) Vertical power semiconductor device e.g. MOSFET, has diffusion solder layer arranged on outer surface of plating, where thickness of plating on electrode contact surface is more than thickness of plating on control electrode surface
EP1408551A4 (en) Method for producing bonding wafer
TW200628574A (en) Adhesion promoter, electroactive layer and electroactive device comprising same, and method
EP1187216A4 (en) Method for manufacturing bonded wafer
MY125775A (en) Method for treating substrates for microelectronics and substrates obtained by said method.
EP1583156A3 (en) Ultraviolet sensor and method for manufacturing the same
HK1069010A1 (en) Lead frame and its manufacturing method
ITGE940122A0 (en) MACHINE FOR SLUSH MANUFACTURING.
HK1037425A1 (en) Method for manufacturing semiconductor device.
EP1241003A3 (en) Imageable element having a protective overlayer
EP1049133A3 (en) Enhancing adhesion of deposits on exposed surfaces in process chamber
EP1439575A3 (en) Semiconductor device with a lead frame and method of manufacturing the same
EP0999584A3 (en) Method for manufacturing semiconductor device
ZA992721B (en) Method for fabricating an excavator base.
EP1538681A3 (en) Process for producing optical semiconductor device
FR2829911B1 (en) ACTUATOR, SEAT ACTUATOR FAMILY AND METHOD FOR MANUFACTURING SUCH AN ACTUATOR
WO2007078799A3 (en) Low resistivity package substrate and its manufacturing method
EP2767580A3 (en) Composition for the protection of glassware in a dishwashing process
ZA975207B (en) A method for manufacturing shaped wafers, an intermediate product and a wafer obtained by this method, and an associated mould.
MY120645A (en) Lead frame and method of manufacturing the lead frame