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Application filed by Mitsui Mining & Smelting CofiledCriticalMitsui Mining & Smelting Co
Publication of MY119286ApublicationCriticalpatent/MY119286A/en
Preventing Corrosion Or Incrustation Of Metals
(AREA)
Parts Printed On Printed Circuit Boards
(AREA)
Abstract
A COPPER FOIL HAVING IMPROVED RESISTANCE TO ABRASION DAMAGE DURING THE MANUFACTURE OF PRINTED CIRCUIT BOARDS HAS A UNIFORM DEPOSIT OF BENZOTRIAZOLE (BTA) OR BTA DERIVATIVE, OPTIONALLY A MIXTURE THEREOF, OF AT LEAST ABOUT 5 MG/M2.
MYPI97024501996-06-171997-06-03Improved copper foil for printed circuit boards
MY119286A
(en)