MY108587A - Process and device for the strip mounting of smt capable semiconductor chips and an smd board mounted thereby. - Google Patents

Process and device for the strip mounting of smt capable semiconductor chips and an smd board mounted thereby.

Info

Publication number
MY108587A
MY108587A MYPI91000858A MYPI19910858A MY108587A MY 108587 A MY108587 A MY 108587A MY PI91000858 A MYPI91000858 A MY PI91000858A MY PI19910858 A MYPI19910858 A MY PI19910858A MY 108587 A MY108587 A MY 108587A
Authority
MY
Malaysia
Prior art keywords
semiconductor chips
smt
smd
strip mounting
board mounted
Prior art date
Application number
MYPI91000858A
Inventor
Scheuenpflug Richard
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of MY108587A publication Critical patent/MY108587A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)

Abstract

A PROCESS AND A DEVICE FOR THE STRIP MOUNTING OF SMT-CAPABLE SEMICONDUCTOR CHIPS (1), WHICH HAVE RIBBON CONTACTS (2) LED ON THEIR SURFACE UP TO THE CHIP EDGE AND ARE APPLIED ALREADY SEPARATED IN THE WAFER MATRIX TO A SELF-ADHESIVE FOIL (6),IS INTENDED TO ENABLE AUTOMATED MOUNTING OF THE SEMICONDUCTOR CHIPS (1) ON AN SMD PRINTED CONDUCTOR BOARD. AN ADHESIVE LAYER (4) IS APPLIED SELECTIVELY TO A FOIL TAPE (3), AND THE SEMICONDUCTOR CHIPS (1) ARE DETACHED SEQUENTIALLY FROM THE SELF-ADHESIVE FOIL (6), APPLIED AT DEFINED SEPARATIONS TO THE FOIL TAPE AND BONDED THERETO.THE METHOD ACCORDING TO THE INVENTION AND THE DEVICE ARE APPLIED IN SMD CHIP MOUNTING.(FIG. 1)
MYPI91000858A 1990-08-23 1991-05-21 Process and device for the strip mounting of smt capable semiconductor chips and an smd board mounted thereby. MY108587A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4026665 1990-08-23

Publications (1)

Publication Number Publication Date
MY108587A true MY108587A (en) 1996-10-31

Family

ID=6412751

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI91000858A MY108587A (en) 1990-08-23 1991-05-21 Process and device for the strip mounting of smt capable semiconductor chips and an smd board mounted thereby.

Country Status (5)

Country Link
EP (1) EP0472086B1 (en)
KR (1) KR920005681A (en)
DE (1) DE59104215D1 (en)
HK (1) HK218296A (en)
MY (1) MY108587A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1029954C2 (en) 2005-09-14 2007-03-15 Assembleon Nv Method for heating a strip-shaped carrier as well as such a device.

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3009727C2 (en) * 1980-03-13 1986-08-07 Siemens AG, 1000 Berlin und 8000 München Method for holding components provided with connecting wires in carrier belts
DE3630317A1 (en) * 1986-09-05 1988-03-10 Itt Ind Gmbh Deutsche Device for inserting SMD components into packaging belts
IL83989A (en) * 1986-09-25 1991-03-10 Illinois Tool Works Reuseable carrier tape
US4829665A (en) * 1986-12-01 1989-05-16 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic components

Also Published As

Publication number Publication date
EP0472086A2 (en) 1992-02-26
DE59104215D1 (en) 1995-02-23
EP0472086A3 (en) 1992-12-30
EP0472086B1 (en) 1995-01-11
KR920005681A (en) 1992-03-28
HK218296A (en) 1996-12-27

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