MY103390A - Laser beam soldering apparatus and soldering method using the same - Google Patents

Laser beam soldering apparatus and soldering method using the same

Info

Publication number
MY103390A
MY103390A MYPI88000995A MYPI19880995A MY103390A MY 103390 A MY103390 A MY 103390A MY PI88000995 A MYPI88000995 A MY PI88000995A MY PI19880995 A MYPI19880995 A MY PI19880995A MY 103390 A MY103390 A MY 103390A
Authority
MY
Malaysia
Prior art keywords
soldering
laser beam
irradiation units
dish
same
Prior art date
Application number
MYPI88000995A
Inventor
Otobe Takashi
Matsui Syunke
Ito Yujiro
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of MY103390A publication Critical patent/MY103390A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A LASER BEAM SOLDERING APPARATUS IS PROVIDED FOR SOLDERING PARTS, SUCH AS, LEAD WIRES PROVIDED FOR AN IC CHIP WHICH ARE ARRANGED CLOSELY TO EACH OTHER. THE APPARATUS INCLUDES A PLURALITY OF LASER BEAM IRRADIATION UNITS (3) EMPLOYING A SEMICONDUCTOR LASER AND A MOUNTING DISH (1) FOR MOUNTING THE IRRADIATION UNITS. THE DISH HAS A PLURALITY OF THROUGH-HOLES (2) FOR RECEIVING THE IRRADIATION UNITS. THE IRRADIATION UNITS (3) ARE MOUNTED ON THE DISH (1) SO AS TO BE DIRECTED TO ONE FOCAL AREA TO FORM A DESIRED BEAM SPOT SHAPE. A SMALL BEAM SPOT HAVING SUFFICIENT HEAT FOR SOLDERING IS THEREBY OBTAINED. IN AN ALTERNATIVE FORM, THE UNITS (3) ARE MOUNTED ON A FLAT PLATE 1 AND ARE EACH ANGLED TO DIRECT THEIR BEAMS TO A COMMON AREA. (FIG. 1)
MYPI88000995A 1987-09-14 1988-09-06 Laser beam soldering apparatus and soldering method using the same MY103390A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62230051A JPS6475169A (en) 1987-09-14 1987-09-14 Soldering method

Publications (1)

Publication Number Publication Date
MY103390A true MY103390A (en) 1993-06-30

Family

ID=16901791

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI88000995A MY103390A (en) 1987-09-14 1988-09-06 Laser beam soldering apparatus and soldering method using the same

Country Status (3)

Country Link
JP (1) JPS6475169A (en)
KR (1) KR890004811A (en)
MY (1) MY103390A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6300668B2 (en) * 2014-07-04 2018-03-28 株式会社日立情報通信エンジニアリング Magnetic head manufacturing apparatus and magnetic head manufacturing method

Also Published As

Publication number Publication date
KR890004811A (en) 1989-05-10
JPS6475169A (en) 1989-03-20

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