MXPA99001234A - Hot flown mass adhesive application temperature b - Google Patents

Hot flown mass adhesive application temperature b

Info

Publication number
MXPA99001234A
MXPA99001234A MXPA/A/1999/001234A MX9901234A MXPA99001234A MX PA99001234 A MXPA99001234 A MX PA99001234A MX 9901234 A MX9901234 A MX 9901234A MX PA99001234 A MXPA99001234 A MX PA99001234A
Authority
MX
Mexico
Prior art keywords
weight percent
vinyl acetate
rosin
adhesive
ethylene
Prior art date
Application number
MXPA/A/1999/001234A
Other languages
Spanish (es)
Inventor
A Mehaffy Justin
Cole Ingrid
Original Assignee
National Starch And Chemical Investment Holding Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Starch And Chemical Investment Holding Corporation filed Critical National Starch And Chemical Investment Holding Corporation
Publication of MXPA99001234A publication Critical patent/MXPA99001234A/en

Links

Abstract

The present invention relates to a hot melt adhesive composition of low application temperature and its use in the formation of cartons, boxes or trays comprising ethylene vinyl acetate with more than 30 weight percent of AV and having a melt index of at least 700, a thermoplastic hydrocarbon resin derived from styrene, alpha-methylstyrene, and / or vinyltoluene, and polymers, copolymers and terpolymers thereof, a tackifier that promotes compatible adhesive, and a wax with a melting point of about 130 to 170 ° F (54.4 to 76.6 ° C), and optionally comprising ethylene vinyl acetate with less than about 30 weight percent by weight of vinyl acetate and having a melting index of about 400 to 25

Description

LOW APPLICATION HOT TEMPERATURE MAST ADHESIVE DESCRIPTION OF THE INVENTION Hot melt adhesives, 100% solid materials, which are applied to a substrate when melted and cooled to harden the adhesive layer, are widely used in industrial applications. Most commercially available hot melt adhesives require temperatures of 350 ° F (~ 177 ° C) or more to ensure complete melting of all components and also to achieve a satisfactory application viscosity. The need for such high temperatures has problems. The high temperatures increase the risks of the operators with respect to both burns and inhalation of residual volatiles. In addition, high temperatures require more energy, adding more demands on the manufacturing facility. Adhesive formulations, which can be applied at temperatures below 300 ° F (~ 149 ° C), can be prepared using low molecular weight components or a high wax content. Although these formulations achieve a low viscosity of application, there is a resultant loss of adhesive properties. Therefore to improve adhesion, one or more amorphous components are added. However, these amorphous components reduce the effective heat resistance, particularly under compressed cantilever bonds subjected to high temperatures for a prolonged duration. Therefore it may be desirable to have an adhesive which has good bond strength with exceptional heat resistance and application viscosity, even if prepared with low molecular weight components for application at low temperatures. The adhesive compositions of the present invention can be applied at temperatures below 200 to 300 ° F (93.3 to 148.8 ° C) yet provide exceptional heat resistance despite the use of low molecular weight components which could conventionally be thought to produce strength deficient to heat and cold. Accordingly, the adhesives of the present invention find use in box sealing operations. Corrugated boxes are frequently subjected to high pressures and adverse environmental conditions during transport. The adhesives of the present invention meet the stringent requirements for this and other applications. It has been found herein that melt adhesives are prepared from 1. 5 to 45 weight percent ethylene vinyl acetate with more than 30 wt% vinylacetate and having a melt index of at least 700 dg / min; 2. 10 to 60 weight percent of a thermoplastic hydrocarbon resin derived from styrene, alpha methylstyrene and / or vinyltoluene, and polymers, copolymers and terpolymers thereof; 3. 5 to 25 weight percent of a tackifier that promotes adhesion; 4. 10 to 40 weight percent of wax with a melting point of about 130 to 180 ° F (54.4 to 82.2 ° C); and optionally 5. 5 to 25 weight percent ethylene vinyl acetate comprising less than 30 weight percent vinyl acetate with a melt index of at least 400 dg / min, may be applied at temperatures of less than 200 to 300. ° F (93.3 to 148.8 ° C) still provides exceptional heat resistance. The percentages by weight are based on the total weight of the adhesive composition. The present invention is directed to hot melt adhesive compositions which can be applied at temperatures between 200 to 300 ° F (93.3 to 148.8 ° C) yet provides exceptional heat resistance despite the low molecular weight components. The ethylene vinyl acetate copolymers (VAE) useful herein are those containing at least about 30 weight percent vinyl acetate and having a melt index of at least about 700 dg / min, preferably at least about 1000 dg / min. Preferred copolymers are available from duPont under the designation Elvax EP4150 and comprise about 40 weight percent vinyl acetate by weight and have a melt index of about 1000 dg / min. the amount of the copolymer present in the adhesive ranges from about 5 to 45 weight percent, preferably about 20 to 40 weight percent. In addition to the components described above, the adhesive compositions of the present invention may optionally comprise a second VAE copolymer, specifically one containing less than about 30 weight percent vinyl acetate and having a melt index of about 400 to 2500 dg. / min. Preferred copolymers are available from Exxon under the designation ESCORENE and contain about 28 weight percent vinyl acetate by weight and have a melt index of about 800 dg / min. the amount of this copolymer present in the adhesive ranges from about 5 to 25 weight percent, preferably 10 to 20 weight%. The hot melt adhesive compositions of the present invention also comprise a thermoplastic hydrocarbon resin having a Ring and Ball softening point below 130 ° C, preferably 120 ° C. Representative resins include those derived from styrene, alpha methylstyrene, and / or vinyltoluene, and polymers, copolymers and terpolymers of styrene, alpha methylstyrene and / or vinyltoluene. KRYSTALEX ® 3100 is preferred, a low molecular weight thermoplastic hydrocarbon polymer derived primarily from alpha methylstyrene which has a Ring and Ball softening point of 97 to 103 ° C and is available from Hercules Inc. Thermoplastic hydrocarbon resins are present in the adhesive compositions of the present invention in an amount of 10 to 60 weight percent of the composition, preferably 15 to 35 weight percent. The compatible adhesive promoting tackifiers useful in the present invention include terpene, phenolic terpene, modified terpene and combinations thereof. Also included are the hydrogenated derivatives of the phenolic modified terpene resins, for example, as the resin product resulting from the condensation, in an acid medium, of a bicyclic terpene and a phenol. NIREZ 300, a phenolic modified terpene having a Ring and Ball softening point of about 112 ° C and available from the Arizona Chemical Company, is the most preferred modified terpene. Other compatible adhesive promoting tackifiers useful in the present invention include rosin, rosin derivatives, rosin ester, aliphatic hydrocarbons, aromatic hydrocarbons, aromatically modified aliphatic hydrocarbons and mixtures thereof. Examples of rosin ester tackifiers include both natural and modified rosin such as rosin gum, rosin wood, oil-tallow rosin, distilled rosin, hydrogenated rosin, dimerized rosin, polymerized rosin as well as glycerol and pentaerythritol esters of rosin natural and modified, such as, for example, the glycerol ether of polymerized rosin, the pentaerythritol ester of hydrogenated rosin, the phenolic modified pentaerythritol ester of rosin, and combinations thereof. The rosin ester, 100 ° C, with a 110 ° aliphatic hydrocarbon is the most preferred rosin ester. Commercially representative tackifiers include NIREZ V-2040 and NIREZ 300 from Arizona Chemical Company, and DERTOPHENE T 105 from DRT. Other commercially available tackifiers include SYLVATAC 100, ZONATAC and ZONESTER from Arizona Chemical Company, PERMALYN from Hercules, UNITAC Union Camp and NOVARES from Georgia Pacific. A compatible adhesive tackifier system is chosen for use in the present invention based on a number of factors including the structure of the tackifier system, molecular weight distribution and basic chemical structure of the tackifier system. These factors, together with others, impact the chemical and physical interaction between the mixture of wax, polymer and tackifier. The proper selection of components results in a hot melt adhesive of low application temperature prepared using predominantly low molecular weight components. For use in thisIt is also important that the tackifier resin has a Ring and Ball softening point of less than about 130 °, preferably less than 120 ° C. The compatibilizing tackifier resins are used in amounts of up to about 25 weight percent, preferably 10 weight percent, by weight of the adhesive composition. The present invention contemplates that the adhesive composition of the present invention comprises one or more of the tackifier resins that promote the above adhesive. Waxes suitable for use in the present invention are paraffin waxes having melting points in the range of about 130 to 160 ° F to 54.4 to 71.1 ° C), such as, for example, PACEMAKER of Citgo and R-2540 of Moore and Munger; and low-melting synthetic Fischer-Tropsch waxes having a melting point of less than about 180 ° C. The most preferred wax is paraffin wax with a melting point of 150.}. ° C. The wax component is used at levels of more than about 10 weight percent, preferably about 20 to 40 weight percent, by weight of the adhesive. The adhesives of the present invention also preferably contain a stabilizer or antioxidant. Among the applicable stabilizers or antioxidants included herein are hindered high molecular weight phenols and multifunctional phenols such as sulfur and phosphorus-containing phenol. Obstructed phenols are well known to those skilled in the art and can be characterized as phenolic compounds which also contain sterically bulky radicals in close proximity to the phenolic hydroxyl group thereof. In particular, the tertiary butyl groups are generally substituted on the benzene ring in at least one of the ortho positions relative to the phenolic hydroxyl group. The presence of these sterically bulky substituted radicals in the vicinity of the hydroxyl group serves to retard its frequency of stretching, and correspondingly, its reactivity; this obstacle thus provides the phenolic compound with its stabilizing properties. Representative hindered phenols include; 1,3,5-trimethyl-2,4,6-tris- (3,5-di-tert-butyl-4-hydroxybenzyl) -benzene; pentaerythrityl tetrakis-3 (3, 5-ditert-butyl-4-hydroxyphenyl) -propionate; n-octadecyl-3 (3,5-di-tert-butyl-4-hydroxyphenyl) -propionate; 4,4'-methylenebis (2,6-tert-butyl-phenol); 4,4'-thiobis (6-tert-butyl-o-cresol); 2, 6-di-tert-butylphenol; 6- (4-hydroxyphenoxy) -2,4-bis (n-octyl-thio) -1,3,5-triazine; 3, 5-di-tert-butyl-4-hydroxy-di-n-octylthiobenzoate) ethyl and sorbite hexa [3 - (3,5-di-tert-butyl-4-hydroxy-phenyl) propionate] May be increased the performance of these oxidants using, in conjunction therewith, known synergistic compounds such as, for example, thiopropionate esters and phosphites. It is particularly usefulj. the distearylthiodipropionate. These stabilizers, if used, are generally present in amounts of about 0.1 to 1.5 weight percent, preferably 0.25 to 1.0 weight percent. The present invention also contemplates the addition to the adhesive of a polymeric additive selected from the group consisting of polymers of ethylene methylacrylate containing up to 10 to 28 weight percent by weight of methyl acrylate, copolymers of ethylene acrylic acid having an acid number from 25 to 150, polyethylene, polypropylene, poly (butene-1-co-ethylene) polymers and ethylene n-butyl acrylate copolymers of low molecular weight and / or low melt index. When such an additive is present, it is present in amounts of up to about 15 weight percent by weight of the composition. Depending on the contemplated end uses of the adhesives, other additives such as plasticizers, pigments and dye products conventionally added to hot melt adhesives may be included. In addition, small amounts of additional tackifiers and / or waxes such as microcrystalline waxes, hydrogenated castor oil and synthetic waxes modified with vinyl acetate in minor amounts, ie up to about 10 weight percent by weight, may also be incorporated. , in the formulations of the present invention. A preferred embodiment of the present invention is directed to an adhesive composition comprising: a) 5 to 45 weight percent of ethylene vinyl acetate with more than 30 weight percent vinyl acetate and having a melt index of at least 700; b) 5 to 25 weight percent of ethylene vinyl acetate comprising less than 30 weight percent AV with a melt index of at least 400; c) 10 to 60 weight percent of a thermoplastic hydrocarbon resin derived from styrene, alphamethylstyrene and / or vinyltoluene, and polymers, copolymers and terpolymers thereof; d) 5 to 25 weight percent of a tackifier that promotes the compatible adhesive selected from the group consisting of rosin, rosin derivatives, rosin esters, aliphatic hydrocarbons, aromatic hydrocarbons, aromatically modified aliphatic hydrocarbons, rosin rosin, rosin wood, tallow oil rosin, distilled rosin, hydrogenated rosin, dimerized rosin, polymerized rosin, pale wood rosin glycerol ester, hydrogenated rosin glycerol ester, polymerized rosin glycerol ester, hydrogenated rosin pentaerythritol ester, modified ester phenolic of rosin, and combinations thereof; and e) 40 weight percent wax with a melting point of about 130 to 180 ° F (54.4 to 82.2 ° C). The adhesive compositions of the present invention are prepared by mixing the components in the melt at a temperature of about 121 ° C until a homogeneous mixture is obtained, about two hours. Various mixing methods are known in the art and any method that produces a homogeneous mixture is satisfactory. The resulting adhesives are characterized by a viscosity of less than about 3000 cps at 135 ° C. These can be applied at temperatures of 200 to 300 ° F (93.3 to 148.8 ° C) to provide superior bonding of adhesives even when exposed to a wide variety of temperature conditions. The adhesives possess excellent heat stability as characterized by the thermal stability test 200 hours at 250 ° F (121.1 ° C), which shows no signs of char formation, skin or gel. In addition, a link formed by two pieces of corrugated box substrate held together by} By 2 inches (1.27 to 5.08 cm) of compressed bead can maintain a cantilever pressure load of 2 to 2.5 psi for 24 hours at temperatures of or above 115 ° F (46.11 ° C). As such adhesives, they find particular use as binders, cartons and buckets and as sealing adhesives, for example, in the packaging of cereal, biscuit and beer products. The hot melt adhesives of the present invention are particularly useful for use in packaging, transformation, binding and non-spinning markets, especially primarily for sealing boxes and cartons and for use in the cigar industry. EXAMPLES In the following examples, which are provided for illustrative purposes only, all parts by weight and all temperatures are in degrees Celsius unless otherwise stated. In the examples, all adhesive formulations are prepared in a single blade mixer heated to 135 ° C by mixing the components until homogeneous. The adhesives are then subjected to various tests simulating the properties necessary for successful commercial applications. Melt viscosities are determined from the hot melt adhesives in a Brookfiel Model RVT Thermosel viscometer using a rod 27. The test specimens are then prepared to determine shear and shear strength at elevated temperature: a bead of adhesive is applied % inch (1.27 cm) wide at 121 ° C to a 50 lb. strip of Kraft paper 1 inch wide (2.54 cm) by 3 inches (7.62 cm) long across the width of the paper. A second piece of Kraft paper of the same dimensions is immediately placed immediately on the first piece and 200 grams of weight is placed on top of the composite construction. The width of the bead of compressed adhesive is% inches (1.27 cm). Desquamation at elevated temperature and shear at elevated temperature is determined attaching a 100-gram weight to each specimen and placed on the specimens in a forced air oven. The temperature is increased in increments of 5.5 ° C (10 ° F) from 38 ° C the specimens remain at a given temperature for 15 minutes for conditioning. The warm up cycle is run until the final link fails. Each specimen is prepared for desquamation and shear and tested in duplicate. The value of flaking and high shear stress shown is the average temperature of the failure of the two links. In some cases, the sample fails as soon as the temperature is being adjusted within the 10 ° increments and is indicated as such.
The adhesive is determined at various temperatures by applying a 1 / inch (1.27 cm) bead of adhesive to a 2-inch by 3-inch piece (as indicated) and a second piece is immediately contacted. of cardboard box in contact. The bond is aged at each temperature for 24 hours. The links are separated by hand and a determination is made as to the failure and presence or absence of fiber tear (DF) is indicated. "Moderate" refers to 50 to 95 percent fiber tearing. "Light" refers to 5 to 50% fiber tearing; and "No" refers to 0 to 5 percent fiber tear. Heat pressure is measured by forming a composite composite of adhesive (2 xy¿ inches (6.35 compression) between two pieces of specific corrugated dimensions.) Then the bead of adhesive forming this compound is placed under approximately 2 pounds of cantilever pressure. 24 hours at high temperatures.The maximum temperature at which this construction remains intact for at least 24 hours is not indicated.The fog point is determined by heating the adhesive mixtures at 121 ° C and applying a small bead. (about 1 gram) of the melted adhesive to the bulb of an ASTM thermometer. The temperature at which the melted adhesive becomes cloudy is then indicated. These measurements of the cloud point provide an indication of the total compatibility of the hot melts, ie the compatibility of the individual ingredients with each other. Products showing nebulous spots near or at the softening point of the wax used in the formulation reflect a total compatible product. The cloudiness that develops as the material cools is the result of the developed crystallization of the wax component (causing refraction of the light that passes through the sample). Systems that have nebulosity points much larger than the wax softening point exhibit a micro separation that changes the refractive index of the melted adhesive.Incompatibility is defined as a cloudiness point of greater than or equal to 250 ° F ( 121.1 ° C) The practical meaning of the products with some points of cloudiness is as follows: (1) poor inherent compatibility with a tendency to phase separation after prolonged heating and heating and cooling cycles as experienced in operations commercial (2) Deficient flow properties resulting in "stretching" from nozzle equipment operated by fire, air or electricity EXAMPLE 1 The following materials are used to prepare a series of adhesives according to the present invention: ELVAX 4150 is an ethylene vinyl acetate polymer comprising 40% vinyl acetate, and having a melt index of 1 000, and available from E.l. duPont de Nemours "and Co. UL 8705 is an ethylene vinyl acetate polymer that comprises 28% vinyl acetate, with a melt index of 800, and available from Exxon, KRYSTALEZ® 3100 is a low-thermoplastic hydrocarbon polymer. molecular weight derived primarily from alpha-methylstyrene which has a Ring and Ball softening point of 97 to 103 ° C and is available from Hercules Inc. The rosin ester is SYLVATAC 4216 which is an ester of pentaerythritol rosin with a point of softening of 100 ° C and available from the Arizona Chemical Company WINNGTAC EXTRA is a styrene-aliphatic C-5 hydrocarbon with a softening point of 100 ° C and available from Goodyear NIREZ 300 is a phenolic modified terpene having a point of ring and ball softening at approximately 112 ° C and available from the Arizona Chemical Company.The antioxidant is chosen from IRGANOX 1010FF which is available from Ciba-Geigy. icas discussed above and the results are shown, together with the formulation of the adhesive, in Table I below. TABLE I Antioxidant 0.5 0.5 0.5 0.5 0.5 Paraffin 30 30 30 30 30 40/1000 VAE 22 20 35 35 35 28/800 VAE 13 15 KRYSTALEX ® 3100 25 25 25 35 25 Ester of rosin 10 10 100 ° C C5 (C9 125 ° C Phenolic terpene 125 ° C 10 Vise. A 250 ° F 1205 1245 1435 1155 1180 (121.1 ° C) Neb. 220 215 190 170 155 Clear Clear Clear Light Clear Clear Peeling 120 125 130 135 135 Shear force 145 145 140 140 140 Adhesion to corrugated Kraft 22.2 ° C Total Total Mod. Lightweight No 4. 5 Total Total Mod. No No -6.7 ° C Mod. Total Lightweight No or -17.8 ° C Lightweight Mod. Lightweight No No Heat pressure 125 ° F 120 ° F 115 ° F 125 ° F 120 ° F (51.6 ° C) (46.8 ° C) (46.11) (51.6 ° C) (46.8 ° C) Samples I, II and III are adhesives according to the present invention. Each of samples I, II and ITT show good cloud point values, good clarity, desirable heat pressure values and good adhesion. Samples A and B are for comparison purposes. The comparative sample is prepared according to Douglas et al., US Patent No. 3,932,331 which teaches the general use of paraffin or microcrystalline wax in combination with VAE and a copolymer of styrene and α-methylstyrene. Although sample A has good clarity and low cloud point, this mixture shows extremely poor adhesive properties. The e.j-jter of rosin can often be used to improve the adhesive properties, however, as seen in sample B, the addition of rosin ester to sample A, does not result in improved adhesive performance, but it reduces not only the strength of the adhesive but also the resistance to heat. In contrast it has been found according to the present invention, that all the components claimed in the indicated quantities are critical to obtain desirable properties. For example, it is found that a sample prepared according to Sample II, however not comprising rosin ester is incompatible and has poor clarity, indicating that the only combination of the components of the adhesives of the present invention provide unexpected results and superiors. Sample II, which includes a partial replacement of a more crystalline, less flexible VAE in an adhesive prepared according to sample III, can be expected to have reduced adhesion, however as shown in Table I, this adjustment improves significantly adhesion, while maintaining the desired clarity at the application temperature. When this polymer substitution is made without the presence of a compatible tackifier according to Douglas et al., The cloud point is increased to an unacceptable temperature. Sample I comprising a hydrocarbon tackifier shows results similar to those observed in Sample III.

Claims (1)

  1. CLAIMS 1. An adhesive composition characterized in that it comprises: (a) 5 to 45 weight percent of ethyl ene with more than 30 wt% vinylacetate and having a melt index of at least 700; (b) 10 to 60 weight percent of a thermoplastic hydrocarbon resin derived from styrene, alpha methylstyrene and / or vinyltoluene, and polymers, copolymers and terpolymers thereof; (c) 5 to 25 weight percent of a tackifier that promotes adhesion of the adhesive; (d) 10 to 40 weight percent of wax with a melting point of about 130 to 180 ° F (54.4 to 82.2 ° C). - An adhesive according to claim 1 --- characterized in that it additionally comprises 5 to 25 weight percent of ethylene vinyl acetate comprising less than about 30 weight percent of vinyl acetate with a melt index of minus 4000. 3, An adhesive in accordance with the claim 1 characterized in that the ethylene vinyl acetate copolymer comprises about 40 weight percent vinyl acetate. 4. An adhesive according to claim 2 characterized in that the additional ethylene vinyl acetate comprises 28% vinyl acetate. 5. A carton, box or bucket formed using a hot melt adhesive composition the adhesive characterized in that it comprises: (a) 5 to 45 weight percent of ethylene vinyl acetate with more than 30% by weight vinyl acetate weight and having a melt index of at least 700; (b) 10 to 60 weight percent of a thermoplastic-aromatic hydrocarbon resin derived from styrene, alpha methylstyrene and / or vinyltoluene, and polymers, copolymers and terpolymers thereof; (c) 5 to 25 weight percent of a tackifier that promotes adhesion of the compatible adhesive; Y (d) 10 to 40 weight percent of wax with a melting point of about 130 to 170 ° F (54.4 to 76.6 ° C). 6. The cardboard box, box or cuvette according to claim 5, characterized in that the ethylene vinyl acetate copolymer in the adhesive comprises approximately 40 weight percent vinyl acetate. An adhesive composition characterized in that it comprises (a) 5 to 45 weight percent of ethylene vinyl acetate with more than 30% by weight of vinyl acetate and having a melt index of at least 700; (b) 10 to 60 weight percent of a thermoplastic hydrocarbon resin derived from styrene, alpha methylstyrene and / or vinyltoluene, and polymers, copolymers and terpolymers thereof; (c) 5 to 25 weight percent of a tackifier that promotes adhesion of the compatible adhesive selected from the group consisting of terpene, phenolic terpene, modified terpenes, and combinations thereof; and (d) 10 to 40 weight percent of wax with a melting point of about 130 to 180 ° F (54.4 to 82.2 ° C); 9. An adhesive according to claim 7 characterized in that the ethylene vinyl acetate copolymer comprises about 40 weight percent vinyl acetate. 9- An adhesive in accordance with the claim 7 characterized in that the thermoplastic hydrocarbon resin is KRYSTALEX ® 3100. .10. An adhesive according to claim 7 characterized in that the wax is paraffin wax or a synthetic wax of low melting point. Jll ,. An adhesive according to claim 7 characterized in that it additionally comprises up to about 15 weight percent by weight of a polymeric additive selected from the group consisting of polymers of ethylene methylacrylate containing up to 10 to 28 weight percent by weight of the acrylate methyl acrylic acid copolymers and ethylene having an acid number of 25 to 150, polyethylene polymers, polypropylene, poly (butene-l-co-ethylene), and copolymers of n-butylacrylate ethylene low melt index and / o low molecular weight. 12. A carton, box or basin formed using a hot melt adhesive composition the adhesive characterized in that it comprises: (a) 5 to 45 weight percent of ethylene vinyl acetate with more than 30% by weight of vinyl acetate and it has a melt index of at least 700; (b) 10 to 6-0 weight percent of a thermoplastic hydrocarbon resin derived from styrene, alpha methylstyrene and / or vinyltoluene, and polymers, copolymers and terpolymers thereof; (c) 5 to 25 weight percent of a tackifier that promotes adhesion of the compatible adhesive selected from the group consisting of terpene, phenolic terpene, modified terpenes and combinations thereof; and (d) 10 to 40 weight percent of wax with a melting point of about 130 to 170 ° F (54.4 to 76.6 ° C). .13. The cardboard box, box or cuvette according to claim 12 characterized in that the ethylene vinyl acetate copolymer in the adhesive contains 40 weight percent vinyl acetate. 14 The cardboard box, box or cuvette according to claim 12, characterized in that the thermoplastic hydrocarbon resin is KRYSTALEX ® 3100. 15. The cardboard box, box or cuvette according to claim 12, characterized in that they additionally comprise up to 15 weight percent of a polyhydric additive selected from the group consisting of ethylene methylacrylate polymers containing up to 10 to 28 weight percent by weight of methyl acrylate, copolymers of acrylic acid and ethylene having an acid number of 25 a, 150, polymers of polyethylene, polypropylene, poly (buten-1-co-ethylene) and ethylene n-butyl acrylate copolymers of low melt index and / or low molecular weight. 16. An adhesive composition characterized in that it comprises (a) 5 to 45 weight percent of ethylene vinyl acetate with more than 30% by weight of vinyl acetate and having a melt index of at least 700; (b) 5 to 25 weight percent ethylene vinyl acetate comprising less than about 30 weight percent vinyl acetate with a melt index of at least about 400; (c) 10 to 60 weight percent of a thermoplastic hydrocarbon resin derived from styrene, alpha-methylstyrene and / or vinyltoluene and polymers, copolymers and terpolymers thereof; (d) 5 to 25 weight percent of a tackifier that promotes adhesion of the compatible adhesive selected from the group consisting of rosin, rosin derivatives, rosin ester, aliphatic hydrocarbons, aromatic hydrocarbons, aromatically modified aliphatic hydrocarbons, rosin gum, wood rosin, oil-tallow rosin, distilled rosin, hydrogenated rosin, dimerized rosin, polymerized rosin, glycerol ether of polymerized rosin, hydrogenated rosin pentaerythritol ester, phenol modified pentaerythritol ester of rosin, and combinations thereof; and (e) 10 to 40 weight percent dewax with a melting point of about 130 to 180 ° F (54.4 to 82.2 ° C); JL7. An adhesive according to claim 16 characterized in that the ethylene vinyl acetate copolymer of (a) comprises about 40 weight percent vinyl acetate. -18 .. An adhesive according to claim 16 characterized in that the ethylene vinyl acetate copolymer of (b) comprises about 29 weight percent vinyl acetate. J9. An adhesive according to claim 16 characterized in that the thermoplastic hydrocarbon resin is KRYSTALEX ® 3100. -2Q-. An adhesive according to claim 16 characterized in that the wax is paraffin wax or a synthetic wax of low melting point. 2.1. A cardboard box, box or tray formed using a hot melt adhesive composition the adhesive characterized in that it comprises (a) 5 to 45 weight percent of ethylene vinyl acetate with more than 30% by weight of vinyl acetate and that has a melt index of at least 700; (b) 5 to 25 weight percent ethylene vinyl acetate comprising less than about 30 weight percent vinyl acetate with a melt index of at least about 400; (c) 10 to 60 weight percent of a thermoplastic hydrocarbon resin derived from styrene, alphamethylstyrene and / or vinyltoluene and polymers, copolymers and terpolymers thereof; (d) 5 to 25 weight percent of a peg-dropping agent that promotes adhesion of the compatible adhesive selected from the group consisting of rosin, rosin derivatives, rosin ester, aliphatic hydrocarbons, aromatic hydrocarbons, modified aliphatic hydrocarbons aromatically, rosin gum, rosin wood, oil-tallow rosin, distilled rosin, hydrogenated rosin, rosin di bristle, polymerized rosin, glycerol ether of polymerized rosin, pentaerythritol ester of hydrogenated rosin, phenolic modified pentaerythritol ester of rosin, and combinations thereof; and (e) 10 to 40 weight percent of wax with a melting point of about 130 to 180 ° F (54.4 to 82.2 ° C); 22. The cardboard box, box or cuvette according to claim 21, characterized in that the ethylene vinyl acetate copolymer of (a) in the adhesive comprises approximately 40 weight percent vinyl acetate. 23, The cardboard box, box or cuvette according to claim 21, characterized in that the ethylene vinyl acetate copolymer of (b) in the adhesive comprises approximately 29 weight percent vinyl acetate. 2-4. The cardboard box, box or cuvette according to claim 21 characterized in that the thermoplastic hydrocarbon resin is KRYSTALEX ® 3100. The cardboard box, box or cuvette according to claim 21 characterized in that they additionally comprise up to 15 weight percent of a polymeric additive selected from the group consisting of ethylene methylacrylate polymers containing 10 to 28 weight percent by weight of methyl acrylate, copolymers of acrylic acid and ethylene having an acid number of from 25 to 150 polymers of polyethylene, polypropylene, poly (buten-1-co-ethylene) and ethylene n-butyl acrylate copolymers of low melting index and low molecular weight. 26. A cardboard box, box or bucket according to claim 21, characterized in that they comprise: (a) 20 to 25 weight percent of ethylene vinyl acetate comprising 40 weight percent vinyl acetate, melting index 1000 dg / min; (b) 10 to 15 weight percent ethylene vinyl acetate comprising 28 weight percent vinyl acetate, melt index 800 dg / min; (c) 20 to 30 weight percent of KRYSTALEX ® 3100, Ball and Ring softening point 100 ° C. (d) 1 to 10 weight percent of a rosin ester tackifier, softening point 100 ° F (37.8 ° C). (e) 5 to 25 weight percent of a paraffin wax with a melting point of 150 ° F (65.5 ° C). 27. A carton, box or bucket according to claim 12 characterized in that they comprise: (a) 30 to 40 weight percent of ethylene vinyl acetate comprising 40 weight percent vinyl acetate, melting index 1000 dg / min; (b) 20 to 30 weight percent of KRYSTALEX ® 3100, Ball and Ring softening point 100 ° C. (c) 1 to 15 weight percent phenolic terpene; Y (d) 20 to 35 weight percent of a paraffin wax with a melting point of 150 ° F (65.5 ° C). 28-. A cardboard box, box or bucket according to claim 21, characterized in that they comprise: (a) 20 to 25 weight percent of ethylene vinyl acetate comprising 40 weight percent vinyl acetate, melting index 1000 dg / min; (b) 10 to 15 weight percent ethylene vinyl acetate comprising 28 weight percent vinyl acetate, melt index 800 dg / min; (c) 20 to 30 weight percent of KRYSTALEX ® 3100, Ball and Ring softening point 10O ° C. (d) 1 to 10 weight percent of a rosin ester tackifier, softening point 100 ° F (37.8 ° C). (e) 1 to 10 weight percent of a hydrocarbon tackifier, softening point 110 ° F (43.3 ° C). (f) 20 to 35 weight percent of a paraffin wax with a melting point of 150 ° F (65.5 ° C).
MXPA/A/1999/001234A 1998-02-04 1999-02-03 Hot flown mass adhesive application temperature b MXPA99001234A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09018634 1998-02-04

Publications (1)

Publication Number Publication Date
MXPA99001234A true MXPA99001234A (en) 2000-08-01

Family

ID=

Similar Documents

Publication Publication Date Title
CA2260675C (en) Low application temperature hot melt adhesive
US5670566A (en) Cool-applied hot melt adhesive composition
CA2169575C (en) Low application temperature hot melt adhesive
US4816306A (en) Hot melt adhesives based on ethylene-n-butyl acrylate
AU655382B2 (en) Improved hot melt adhesives
KR20120039052A (en) Low application temperature hot melt adhesive
US4874804A (en) Hot melt adhesives based on ethylene-n-butyl acrylate
US6593407B2 (en) Hot melt adhesive composition
US20060116459A1 (en) Low application temperature hot melt adhesive
KR20050010797A (en) A phenolic-modifie rosin terpene resin
WO2004016705A2 (en) Hot melt adhesive composition
MXPA99001234A (en) Hot flown mass adhesive application temperature b
KR20230017803A (en) Use of Hydrotreated Synthetic Fischer-Tropsch-Waxes in Polyolefinic Hot Melt Adhesives