MXPA98005128A - Binder for building structures - Google Patents

Abstract

A binder for building structures comprising a principal agent and a curing agent, wherein the principal agent is an epoxy-acrylate resin diluted with a reactive monomer comprising a poly-functional ester made from a carboxylic acid and an alcohol, at least either of which has a reactive double bond, the curing agent is an organic peroxide, and the accelerator for the principal agent is a tertiary aromatic amine having a hydroxyl group in the N-substituent.

Description

AGGLUTINANT FOR PE CONSTRUCTION STRUCTURES TECHNICAL FIELD OF THE INVENTION The present invention relates to a binder for a building structure which is used to fix fastening parts such as a fixing bolt in a hole drilled in a base such as concrete and rock. Particularly, it relates to a binder of the monomer type other than styrene which shows high strength and excellent stability even under high or low temperature circumstances.

ANTECEDENTS OF THE TECHNIQUE Conventionally, the binders of the capsule or loading equipment have been used to fix fastening parts such as a fastening bolt to a base material. When the capsule-type binder is used, the fastening parts are fixed by inserting a capsule containing a binder into a piercing hole, breaking the capsule by rotary percussion of the fastening bolt or the like to mix the main binder element and an agent of curing in the capsule. As the binders applicable for this method, capsule-type binders containing an epoxy acrylate resin are known as the main component of the main ingredient as described in Japanese Patent Application Publication No. 37076/1987, an adhesive agent comprising a epoxy acrylate type resin disclosed in Japanese Patent Application Laid-open No. 243876/1986 and a binder comprising a mixture of a high fatty acid ester with an epoxy acrylate resin as described in the Japanese patent application open to the public number 254681/1986. There is also a binder containing an acrylic-type epoxy acrylate resin as the main ingredient and N, N-dihydroxypropyl-p-toluidine as an accelerator. This last binder of the loaded type includes one blended at the construction site and one contained in a cartridge. When the first binder-type binder is used, the binder parts are fixed by mixing the main ingredient and curing resin at the construction site and then loading them into a drilling hole. When the latter is used, the fastening parts are fixed by proper discharge of the main ingredient and the curing agent from the cartridge in a gradual manner using a hand gun, oil pressure and the like, and then a mixed binder is charged by means of a mixer such as a static mixer in a drilling hole. As the last binder, one disclosed in Japanese Patent Application Laid-Open No. 24714/1984 is known. This binder comprises an unsaturated polyester resin, a reactive diluent, a filler, a thixotropic agent and a radical curing agent. The main ingredient to be used for these binders contains a reactive monomer and is diluted to an appropriate viscosity. As the reactive monomer, a styrene monomer is widely used. However, styrene monomer is a hazardous material (second group of quaternary oil) and is also a substance that is classified as an organic solvent by the Industrial Safety Hygienic Rule. Therefore, a major ingredient of a different type of estr.reno, ie, a main ingredient free of a styrene monomer, has been largely demanded, and a "bolt-fixing capsule" described in the patent application is known. Japanese open to the public number 27528/1992 as a capsule type binder that uses this type of main ingredient, that is, a main ingredient of the different type of styrene. However, the main ingredients of different types of conventional styrene have the disadvantage that the ingredients can not be adjusted to a suitable hardness. In consecuense, it is very difficult to use them under circumstances in which the parts in subjection can not be fixed firmly if the binder is not cured within a certain period, for example, under high temperature circumstances (low latitudes and summer environment), and under circumstances of low temperature (high latitudes and winter time) and in water (rain, rivers and sea). In addition, the stability of the resin is also required until the use of the binders. The present invention attempts to solve the above problems and provide a binder for building structures which exhibits a stable adhesive strength in various circumstances and is excellent in resin stability.

DESCRIPTION OF THE INVENTION The present invention relates to a binder for building structures which comprises a main ingredient, a curing agent and an accelerator of the main ingredient; the main ingredient is an epoxy acrylate resin diluted with a reactive monomer comprising a multifunctional ester of a carboxylic acid and alcohol, at least one of which contains a reactive double bond; the curing agent is an organic peroxide; and the accelerator for the main ingredient is a tertiary aromatic amine containing a hydroxyl group in a nitrogen substituent. The epoxy acrylate resin usable in the present invention is a reaction product of the addition of an epoxy resin and an established monobasic acid. The product may contain an unsaturated polyester resin and an epoxy resin in an amount which does not impair its effect. The epoxy resin includes diglycidyl ether of bisphenol type A, bisphenol type AD, bisphenol type S, bisphenol type F, novolac type, biphenyl type, naphthalene type, phthalic acid type, hexahydroftal type and benzoic acid type, glycol diglycidyl ether and similar. In general, the diglycidyl ether type bisphenol A is used. The monobasic acid introduced includes acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, sorbinic acid, hydroxyethylmethacrylate maleate, hydroxyethyl acrylate maleate, hydroxypropylmethacrylate maleate, hydroxypropylacrylate maleate, and Similar. In general, the preferred one is a methacrylic type of epoxy acrylate resin containing methacrylic acid, hydroxymethacrylate maleate, hydroxypropylmethacrylate maleate and the like, which are excellent for alkali resistance. The reactive monomers usable in the present invention are multifunctional carboxylic acid and alcohol esters. One or both, carboxylic acid and alcohol, are a multifunctional component that contains a reactive double bond. Such esters include, for example, ethylene glycol methacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, 1,3-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, neopentyl glycol dimethacrylate, trimethylolpropane trimethacrylate, diallyl phthalate, triallyl trimellitate. and a diene-type compound of dicyclopentane represented by the following formula (1) or (2) wherein R represents a hydrogen atom and a methyl group; R2 and R, represent ethylene, butylene and the like; n and m are an integer from 0 to 5. Of these, esters comprising methacrylic acid and methacrylic alcohol are preferred because of their excellent alkali resistance. These reactive monomers can be used individually or in combination. In addition, monofunctional esters can be mixed as long as they are mixed in a small amount. The mixing ratio of the reactive monomer to the epoxy acrylate resin is not particularly limited, but is preferably 10 to 70%, more preferably 30 to 70% by weight, most preferably 40 to 60% by weight. In addition, it is preferable to mix them so that the viscosity of the resin is 0.1 to 200 poises (type E viscometer at 25 'C). The curing agents which can be used in the present invention are organic peroxides such as diacrylic peroxides, ketone peroxides, hydroperoxides , dialkyl peroxides, peroxyketals, alkyl peresters and peroxycarbonates. For example, benzoyl peroxides, methyl ethyl ketone peroxides, lauryl peroxide, dicumyl peroxide, eumeno hydroperoxide and the like are included. More generally, benzoyl peroxide is used. The curing agent is usually diluted with a diluent for use. As a diluent for the curing agent, an inorganic material such as calcium sulfate and calcium carbonate, dimethyl phthalate, dibutyl phthalate, dicyclohexyl phthalate can be used., dioctyl phthalate, aliphatic hydrocarbons, aromatic hydrocarbons, silicone oil, a monomer polymerizable in liquid paraffin, water and the like. The accelerator usable in the present invention can be a tertiary aromatic amine containing a hydroxyl group in a nitrogen substituent, for example, N, N-dihydroxypropyl-p-toluidine, N-phenyldiethanolamine, Np-tolyl-diethanolamine, N, N -bishydroxybutyl-p-toluidine and the like. N, N-bishydroxypropyl-p-toluidine is preferred since it shows an effect with a small amount. To the extent that the accelerator has no contact with the curing agent directly, it can be mixed either with the main ingredient when used or with the resin, preliminarily. The amount of accelerator addition is from about 0.5 to 5% by weight based on the amount of resin, preferably 0.5 to 1.5% by weight. These accelerators can be used individually or in combination. In addition, they can be used with conventional accelerators such as N, N-dimethylaniline and cobalt naphthenate, which have been commonly used. In addition, the main ingredient can be mixed with a polymerization inhibitor, a coloring agent, a pigment, a substance that absorbs ultraviolet light, a surfactant, an aggregate, a filler, a thixotropic agent and the like, if necessary. The curing agent can also be mixed with an aggregate, a filler, a thixotropic agent, a diluent, a plasticizer and the like, if necessary. The polymerization inhibitor to be used in the present invention includes quinones, hydroquinones, phenols and the like. More specifically it includes benzoquinone, p-benzoquinone, p-toluquinone, p-xyloquinone, naphthoquinone, 2,6-dichloroquinone, hydroquinone, pt-butylcatechol, 2,5-di-t-butylhydroquinone, monomethylhydroquinone, p-methoxyphenol, 2,6 -di-t-butyl-p-cresol, hydroquinone, monomethyl ether and the like. These polymerization inhibitors can be suitably added in a required amount. Hydroquinones and phenols are preferable since they do not deteriorate by coloration and the like when mixed with amines. The most effective substances as polymerization inhibitors are cresols. If necessary, coloring agent, pigment and substance that absorbs ultraviolet light is added as a light-resistant stabilizer which inhibits the gelation of resins by sunlight or the like. These additives include a lacquer pigment, an azo pigment, a phthalocyanine pigment, an elevated organic pigment, an inorganic pigment and a mixture thereof. For example, you can add "Toner Yellow", "Toner Brown" and "Toner Green" (manufactured by Takeda Chemical Industries, Ltd.), "Color Tex Brown". "Color Tex Orange" and "Color Tex Maroon" (manufactured by Sanyo Color Works, Ltd.) and "OPLAS YELLOW" (manufactured by Orient Chemical Industries Ltd.). The amount of addition can not be easily determined since the types of resin contained in the main ingredient, the type of monomer and the effect of the additives are different. The surfactant usable in the present invention includes anionic, cationic, nonionic and ampholytic surfactants. Of these, an anionic surfactant is preferable since it is effective to stabilize tenacity in water. The anionic surfactant includes alkyl ether carboxylate ("VIEW LIGHT EAC" manufactured by Sanyo Chemical Industries, Ltd.) and the like as carboxylate; dialkyl sulfosuccinate ("SANSEPARA 100" manufactured by Sanyo Chemical Industries, Ltd.), alkylaryl sulfosuccinate, alkyl sulfoacetate, α-olefin sulfonate and the like as a sulfonate; alkyl allyl sulfate and alkyl ether sulfate as a sulfate salt; alkyl ether phosphate and the like as a phosphoric ester salt. More preferably, dialkyl sulfosuccinate or alkylallyl sulfosuccinate are used since they do not accelerate the gelation of the resin when a surfactant is added to the resin. Preferably, the anionic surfactant is a monovalent or divalent metal salt, or an ammonium salt, more preferably a sodium salt. Although the surfactant can be mixed with any component contained in the binder or can be dissolved in a reactive monomer or a solvent, it is preferably mixed with a resin. The amount of the surfactant to be used is not particularly limited, but preferably is less than 30% by weight, in view of the binding strength. The aggregate usable in the present invention includes artificial aggregates such as magnesia clinker, glass spheres, ceramic and rigid plastics, and natural aggregates such as silica stone, marble, granite, silica sand and silica sand. In addition, fibers such as glass fibers, carbon fibers and steel fibers can also be used. The filler material usable in the present invention includes silica sand, silicon sand, silicon powder, calcium carbonate, gypsum, glass flake, mica, volcanic ash, SIRASU (white ash), silicon micro-spheres, concrete powder, powder of expanded concrete, glass micro spheres, hollow glass, fly ash, carbon black, alumina, iron, aluminum, silica and the like. The thixotropic agent used in the present invention includes fine powdered silica (trade name of AEROSIL), non-powdered alumina, talc, asbestos, colloidal wet aluminum silicate / organic compound (trade name of ORVEN), bentonite, castor oil derivatives and Similar. However, when the diluent, aggregate, filler, thiotropic agent and the like mentioned above are mixed with a binder, they need to be added considering that the organic oxide deteriorates the stability. The binder of the present invention can be used by placing it in a container. Such a container can be one which does not break while being transported or stored and can be sealed so that the binder does not leak. It is made of glass, ceramic, synthetic resin, paper, metal and the like and has the shape of a capsule, a cartridge, a can, a package and the like. In this case, the shape and material of the container can be suitably selected according to use, ie, capsule type or loaded type. The container for a curing agent is preferably selected according to the property of the curing agent to be used, considering the safety.

BEST WAY TO CARRY OUT THE INVENTION In the following, the present invention is illustrated in greater detail, with reference to the examples.

[Example 1] g of N, N-dihydroxypropyl-p-toluidine was added as an accelerator, 0.5 g of 2,6-di-t-butyl-p-cresol (BHT) as a polymerization inhibitor, and 5 g of sodium dioctyl sulfosuccinate. as a surfactant at 500 g of a resin constituted by 55% by weight of an epoxy acrylate resin prepared by adding methacrylic acid to an epoxy resin of bisphenol A type and 45% by weight of diethylene glycol dimethacrylate as a reactive monomer. The resin obtained in this way is subjected to a characteristic curing test and a heating test. In the same way as the measurement of the curing characteristic at room temperature according to JIS K 6901, the curing characteristics at 5 *, 15 * and 30 ° C were measured by adding a curing agent to the resin so that the weight ratio of the resin to the curing agent was from 100 to 5. The heating test was carried out *** - > Seal the resin in a glass container (having an outer diameter of 17 mm and a length of 120 mm) and by immersing the container in a constant temperature bath of 60 ° C, and count the days until the resin gels . Then, 50 g of silica sand number 8 and 1 g of AEROSIL are added to 50 g of the resin obtained in the above to prepare a main ingredient. In addition, 5 g of silica sand number 8 and 0.01 g of AEROSIL are added to 10 g of benzoyl paste peroxide (concentration of 40%) to prepare a curing agent. By using the main ingredient and the curing agent obtained in this way, the stress load is measured. A block of concrete is drilled that has a size of 500 x 500 x 1000 mm "and a compressive strength of 210 kg / cm2 with an electric hammer drill to make a hole that has a size of 18 mm x 100 mm (diameter x length) The residues are removed from the hole with a and the ones in the wall of the hole are removed with a nylon brush, again the residues are removed using a fan to clean the interior of the hole, then 3 g of curing agent are mixed with 30 g of the ingredient It is prepared preliminarily, with agitation and loaded into the hole, then an M16 bolt (SNB material 7) is inserted into the hole and cured for a day, the stress load is measured, Preliminarily, the concrete block The main ingredient, the curing agent and the bolt are adjusted to a temperature measurement shown in table 1 in a large constant temperature bath, then the bolt is immersed in a bath of constant temperature, cur a and undergoes a measurement. The measurement is carried out using a tension meter for an ANSER-5-III fixed bolt (manufactured by Asahi Chemical Industry Co., Ltd.). The results are shown in Table 1.

[Example 2] g of N, N-dihydroxypropyl-p-toluidine are added as an accelerator, 0.5 g of 2,6-di-t-butyl-p-cresol (BHT) as a polymerization inhibitor and 5 g of sodium dioctylsulfosuccinate as a surfactant, at 500 g of a resin constituted by 65% by weight of an epoxy acrylate resin prepared by adding methacrylic acid to bisphenol A type epoxy resin and 35% by weight of diethylene glycol dimethacrylate as a reactive monomer. When using the resin prepared in this way, the curing characteristic tests and the heating test at 60 * C are carried out and the stress load is measured according to example 1. The results are shown in table 1 .

Tension loading is not measured since the bolt can not be placed at high temperature and the resin does not cure at low temperature due to a minimum too short curing time (CT) and at a little of the maximum exothermic temperature (Tmax).

[Example 3] g of N-p-tolyldiethanolamine are added as an accelerator, 0.5 g of 2,6-di-t-butyl-p-cresol (BHT) as a polymerization inhibitor and 5 g of sodium dioctyl sulfosuccinate as a surfactant, to 500 g of a resin comprising 55% by weight of a epoxy acrylate resin prepared by adding methacrylic acid to an epoxy bisphenol A type resin and 45% by weight of diethylene glycol dimethacrylate as a reactive monomer. When using the resin prepared in this way, the curing characteristic tests and the heating test at 60 * C are carried out and the stress load is measured according to example 1. The results are shown in table 1 .

[Example 4] 1 g of Np-tolyliethanolamine was added as an accelerator and 0.05 g of 2,6-di-t-butyl-p-cresol (BHT) as a polymerization inhibitor to 100 g of a resin comprising 55% by weight of a epoxy acrylate resin prepared by adding methacrylic acid to epoxy resin bisphenol A type and 45% by weight of diethylene glycol dimethacrylate as a reactive monomer. When using the resin prepared in this way, the heating test is carried out at 60 ° C. The results are shown in table 2.

[Example 5] 1 g of Np-tolyliethanolamine was added as an accelerator and 0.05 g of hydroquinone as a polymerization inhibitor, to 100 g of a resin comprising 55% by weight of an epoxy acrylate resin prepared by adding methacrylic acid to an epoxide resin of type bisphenol A and 45% by weight of diethylene glycol dimethacrylate as a reactive monomer. When using the resin prepared in this way, the heating test is carried out at 60 * C. Results are shown in table 2.

[Example 6] 1 g of Np-tolyliethanolamine was added as an accelerator and 0.05 g of p-benzoquinone as a polymerization inhibitor, to 100 g of a resin comprising 55% by weight of an epoxy acrylate resin prepared by adding methacrylic acid to a resin. epoxide type bisphenol A and 45% by weight of diethylene glycol dimethacrylate as a reactive monomer. By using the resin prepared in this way, the heating test is carried out at 60 'c. The result is shown in table 2.

[Example 7] 1 g of N, N-dihydroxypropyl-p-toluidine was added as an accelerator and 0.05 g of 2,6-di-t-butyl-p-cresol as a polymerization inhibitor to 100 g of a resin comprising 55% by weight. weight of an epoxy acrylate resin prepared by adding methacrylic acid to an epoxy bisphenol A type resin and 45% by weight of diethylene glycol dimethacrylate as a reactive monomer. When using the resin prepared in this way, the heating test is carried out at 60 * C. The result is shown in table 2.

[Example 8] 1 g of N, N-dihydroxypropyl-p-toluidine was added as an accelerator and 0.05 g of hydroquinone as a polymerization inhibitor to 100 g of a resin comprising 55% by weight of an epoxy acrylate resin prepared by adding methacrylic acid. to an epoxy bisphenol A type resin and 45% by weight of diethylene glycol dimethacrylate as a reactive monomer. When using the resin prepared in this way, the heating test is carried out at 60 'C. The result is shown in table 2.

[Example 9] 1 g of N, N-dihydroxypropyl-p-toluidine is added as an accelerator and 0.05 ppm of p-benzoquinone as a polymerization inhibitor to 100 g of a resin comprising 55% by weight of an epoxy acrylate resin prepared by adding methacrylic acid to an epoxy bisphenol A type resin and 45% by weight of diethylene glycol dimethacrylate as a reactive monomer. When using the resin prepared in this way, the heating test is carried out at 60 * C. The result is shown in table 2.

[Example 10] 1 g of N, N-dihydroxypropyl-p-toluidine was added as an accelerator and 0.05 g of 2,6-di-t-butyl-p-cresol as a polymerization inhibitor to 100 g of a resin comprising 55% by weight. weight of an epoxy acrylate resin prepared by adding methacrylic acid to an epoxy bisphenol A type resin and 45% by weight of diethylene glycol dimethacrylate as a reactive monomer. When using the resin prepared in this way, the heating test is carried out at 60 * C. The result is shown in table 2.

[Example 11] 1 g of N, N-dihydroxypropyl-p-toluidine was added as an accelerator and 0.05 g of 2,6-di-t-butyl-p-cresol as a polymerization inhibitor to 100 g of a resin comprising 40% by weight. weight of an epoxy acrylate resin prepared by adding methacrylic acid to an epoxy bisphenol A type resin and 60% by weight of monomer A of the dicyclopentadiene type compound represented by the formula (1) (wherein R x is methyl, R 2 is ethyl and n is 1) as a reactive monomer. When using the resin pre-heated in this way, the heating test is carried out at 60 ° C. The result is shown in table 2.

[Example 12] 1 g of N, N-dihydroxypropyl-p-toluidine is added as an accelerator and 0.05 g of hydroquinone as a polymerization inhibitor to 100 g of a resin comprising 40% by weight of an epoxy acrylate resin prepared by adding methacrylic acid to an epoxy resin of bisphenol A type and 60% by weight of monomer A of the dicyclopentadiene type compound represented by the formula (1) (wherein Rt is methyl, R is ethyl and n is 1) as a reactive monomer. When using the resin prepared in this way, the heating test is carried out at 60 ° C. The result is shown in table 2.

[Example 13] 1 g of N, N-dihydroxypropyl-p-toluidine is added as an accelerator and 0.05 g of p-benzoquinone as a polymerization inhibitor to 100 g of a resin comprising 40% by weight of an epoxy acrylate resin prepared by adding methacrylic acid to an epoxy bisphenol A type resin and 60% by weight of monomer A of the dicyclopentadiene type compound represented by the formula (1) (wherein Ra is methyl, R is ethyl and n is 1) as a reactive monomer. When using the resin prepared in this way, the heating test is carried out at 70 * C. The result is shown in table 2.

[Example 14] 1 g of N, N-dihydroxypropyl-p-toluidine is added as an accelerator and 0.05 g of 2,6-di-t-butyl-p-cresol as a polymerization inhibitor to 100 g of a resin comprising 40% by weight. weight of an epoxy acrylate resin prepared by adding methacrylic acid to an epoxy bisphenol A type resin and 70% by weight of trimethylolpropane trimethacrylate as a reactive monomer. When using the resin prepared in this way, the heating test is carried out at 60 * C. The result is shown in table 2.

[Example 15] 1 g of N, N-dihydroxypropyl-p-toluidine is added as an accelerator and 0.05 g of hydroquinone as a polymerization inhibitor to 100 g of a resin comprising 40% by weight of an epoxy acrylate resin prepared by adding methacrylic acid to an epoxy bisphenol A type resin and 70% by weight of trimethylolpropane trimethacrylate as a reactive monomer. When using the resin prepared in this way, the heating test is carried out at 60 * C. The result is shown in table 2.

[Example 16] 1 g of N, N-dihydroxypropyl-p-toluidine is added as an accelerator and 0.05 g of p-benzoquinone as a polymerization inhibitor to 100 g of a resin comprising 40% by weight of an epoxy acrylate resin prepared by adding methacrylic acid to an epoxy bisphenol A type resin and 70% by weight of trimethylolpropane trimethylacrylate as a reactive monomer. When using the resin prepared in this way, the heating test is carried out at 60 ° C. The result is shown in table 2.

[Example 17] 1 g of N, N-dihydroxypropyl-p-toluidine is added as an accelerator and 0.05 g of 2,6-di-t-butyl-p-cresol as a polymerization inhibitor to 100 g of a resin comprising 40% by weight. weight of an epoxy acrylate resin prepared by adding methacrylic acid to an epoxy bisphenol A type resin and 60% by weight triallyltrimellitic as a reactive monomer. When using the resin prepared in this way, the heating test is carried out at 60 ° C. The result is shown in table 2.

[Example 18] 1 g of N, N-dihydroxypropyl-p-toluidine is added as an accelerator and 0.05 g of hydroquinone as a polymerization inhibitor to 100 g of a resin comprising 40% by weight of an epoxy acrylate resin prepared by adding methacrylic acid to an epoxy bisphenol A type resin and 60% by weight triallytrimellitic acid as a reactive monomer. When using the resin prepared in this way, the heating test is carried out at 60'C. The result is shown in table 2.

[Example 19] 1 g of N, N-dihydroxypropyl-p-toluidine is added as an accelerator and 0.05 g of p-benzoquinone as a polymerization inhibitor to 100 g of a resin comprising 40% by weight of an epoxy acrylate resin prepared by adding methacrylic acid to an epoxy bisphenol A type resin and 60% by weight triallytrimellitic acid as a reactive monomer. When using the resin prepared in this way, the heating test is carried out at 60 * C. The result is shown in table 2.

[Comparative Example 1] g of N, N-dimethylaniline, which does not contain a hydroxyl group in a nitrogen substituent, is added as an accelerator, 0.25 g of p-benzoquinone as a polymerization inhibitor and 5 g of sodium dioctyl sulfosuccinate as a surfactant, 500 g of a resin comprising 55% by weight of an epoxy acrylate resin prepared by adding methacrylic acid to the bisphenol A epoxy resin and 45% by weight of diethylene glycol dimethyl acrylate as a reactive monomer. When using the resin prepared in this way, the characteristic curing test and the heating test at 60 ° C are carried out, and the stress load is measured according to example 1. The results are shown in table 1 .

[Comparative Example 2] g of N, N-dimethylaniline, which does not contain a hydroxyl group in a nitrogen substituent, is added as an accelerator, 0.25 g of hydroquinone as a polymerization inhibitor and 5 g of sodium dioctyl sulfosuccinate as a surfactant, at 500 g of a resin comprising 55% by weight of an epoxy acrylate resin prepared by adding methacrylic acid to the bisphenol A epoxy resin and 45% by weight of diethylene glycol dimethacrylate as a reactive monomer. When using the resin prepared in this way, the characteristic curing test and the heating test at 60 ° C are carried out, according to example 1. The results are shown in table 1. The load of tension since a bolt can not be placed at elevated temperature and the resin does not cure at a low temperature due to the short minimum cure time (CT) and the low maximum exothermic temperature (Tmax).

[Comparative Example 3] 5 g of N, N-dimethylaniline, which does not contain a hydroxyl group in a nitrogen substituent, is added as an accelerator, 5 g of sodium dioctyl sulfosuccinate as a surfactant and 0.5 g of cresols, 2, 6 -di-t-butyl-p-cresol, as a polymerization inhibitor at 500 g of a resin comprising 55% by weight of an epoxy acrylate resin prepared by adding methacrylic acid to the bisphenol A epoxy resin and 45% by weight of diethylene glycol dimethacrylate as a reactive monomer. When using the resin prepared in this way, the characteristic curing test and the heating test at 60 ° C are carried out, according to example 1. The results are shown in table 1. The load of tension because the bolt can not be placed at elevated temperature and the resin does not cure at a low temperature due to the short minimum cure time (CT) and the low maximum exothermic temperature (Tmax).

[Comparative Example 4] 3 g of N, N-dimethyl-p-toluidine are added, which does not contain a hydroxyl group in a nitrogen substituent, such as an accelerator, 0.5 g of p-benzoquinone as a polymerization inhibitor and 5 g of sodium dioctylsulfosuccinate as a surfactant, at 500 g of a resin comprising 55% by weight of an epoxy acrylate resin prepared by adding methacrylic acid to the epoxy resin bisphenol A type and 45% by weight of diethylene glycol dimethacrylate as a reactive monomer. When using the resin prepared in this way, the characteristic curing test and the heating test at 60 * C are carried out, according to example 1. The results are shown in table 1. The load of tension since a bolt can not be placed at elevated temperature and the resin does not cure at a low temperature due to the short minimum cure time (CT) and the low maximum exothermic temperature (Tmax). Tables 1 and 2 show that the curing speed can not be controlled with polymerization inhibitors such as a tertiary amine or cresol type polymerization inhibitors which do not contain a hydroxyl group in a nitrogen substituent as in comparative examples 2 to 4 If the curing speed can not be controlled, the curing period of a binder becomes short under high temperature circumstances, for example in summer time. As a result, a bolt and the like can not be inserted because the binder heals while mixing or loading. Since the resins obtained in Comparative Examples 1 to 4 have a low exothermic temperature at the time of curing, the binder containing the resins is poor in curing properties under the circumstances of low temperature such as in winter time and does not show tenacity. On the other hand, the curing speed of the binders obtained in the examples is controllable so that the problems mentioned above do not arise. In addition, it is evident from the heating test at 60 ° C, that the resins used in the examples require 28 days or more to gel.This means that the resins have excellent stability and a prolonged shelf life.

INDUSTRIAL APPLICABILITY The binder of the present invention is advantageous for securing fasteners such as a fastening bolt in a hole drilled in a base such as concrete and stone. The binder of the present invention is less harmful since it does not contain a styrene monomer. In addition, when comparing conventional binders, it shows superior fixing strength and excellent stability under severe conditions.

N. * t-? * C c < x * Curing property: according to JIS K 6901 * Tenacity in comparative examples 2 to 4: does not cure at 5 * C and stratifies little at 30 * C * Heating test at # 60 * C: the days a resin requires in a sealed glass tube to gel at 60 * C. or * - c «Examples 11 to 13: dicyclopentadiene type compound (represented by formula (1) wherein Ri is methyl, R2 is ethyl and n is 1)« Heating test at 60 * C? The days require the resin in a sealed glass tube to gel at 60 * C.

Claims (6)

1. A binder for a building structure, comprising a main ingredient, a curing agent and an accelerator for the main ingredient; the main ingredient is an epoxy acrylate resin diluted with a reactive monomer, comprising a multifunctional ester of carboxylic acid and alcohol, at least one of which contains a reactive double bond; the curing agent is an organic peroxide; and the accelerator of the main ingredient are tertiary aromatic amines containing a hydroxyl group in a nitrogen substituent.

2. The binder for building structure, according to claim 1, wherein the epoxy acrylate resin is an epoxy acrylate resin of methacrylic type.

3. The binder for building structure according to claim 1 or 2, wherein the accelerator is N, N-dihydroxypropyl-p-toluidine.

4. The binder for building structure according to claim 1 or 2, wherein the reactive monomer is an ester comprising methacrylic acid and / or acrylic acid and a divalent and / or trivalent alcohol.

5. The binder for building structure according to claim 1 or 2, wherein the reactive monomer is an ester comprising allyl alcohol and / or methacrylic alcohol and a divalent and / or trivalent carboxylic acid.

6. The binder for building structure according to claim 1 or 2, wherein the reactive monomer is contained in an amount of 30 to 70% by weight, based on the epoxy acrylate resin.