MXPA96001906A - Reversible kitchen or micropastilla mounted in guiaondas coplana - Google Patents

Abstract

The present invention relates to a circuit structure based on coplanar waveguides, characterized in that it comprises: an electrically insulating substrate having a flat face with a connection region, a first coplanar waveguide mounted on the face of the substrate, and having a first and a second ground conductor, coplanar, separate, and a first signal conductor coplanar with the ground conductors, and placed between the first and second ground conductors, and separated from these, the signal conductor and the first and second conductors of ground extend to the connection region, the first and second ground conductors are coupled together in the connection region, and a reversibly mounted integrated circuit or flywheel over the substrate connection region, with a first terminal mounted reversibly to one of the ground conductors, and a second terminal reversibly mounted to the signal conductor, with which l The waveguide conducts the electric current relative to the integrated circuit

Description

REF: 22421 WHAT IS THE P OR I M I C RO PAST I A REVE RS I B L E MONTA DA IN GUIAONDAS COPLANARES TECHNICAL FIELD The present invention relates to the structures of waveguide circuits, high frequency coplanar, and in particular to the reversible mounting or flywheel of circuit components on a coplanar waveguide.

BACKGROUND OF THE INVENTION The assembly of reversible shrouds or micropads of integrated circuits on a motherboard has been found to be an effective way to connect together components of radio frequency circuits. The use of reversible mounting provides a substitute joining method that replaces the use of junction wires, metallization on the back side and vias, air bridges, and dielectric crossings on the mother substrate. The columns or driving protrusions that connect the nipple or micropad to the motherboard can be formed using solder, brazing material or conductive adhesives. However, the preferred method is by thermocompression bonding due to the resulting reduced impact on parasitic losses and signals and improved consistency. Also, in such high frequency applications, the use of coplanar transmission lines is well established. Typical examples include conventional coplanar waveguides (ground-signal-ground lines), slot lines, balanced earth-signal-signal-ground lines, and lines balanced by parallel tape. The coplanar waveguides are particularly useful due to the simplified structure provided, by having signal and ground conductors in a single plane, and the resulting access to the ground planes on both sides of the signal conductor. It is known that adjacent coplanar waveguides are used to connect different mounted circuits in a reversible manner or flywheel. The coplanar waveguides also provide improved isolation between signal conductors compared to some other transmission line structures. The reversible micro-blade or handwheel typically contains one or more transistors. In a power strip, a plurality of transistors are often excited by a simple control conductor, such as the base or gate depending on the type of transistor involved. Correspondingly, the associated group of collectors or sockets, for example, terminals carrying current, are joined to a simple output terminal. Equalization of impedances for the composite power transistor is achieved in the motherboard.

DESCRIPTION OF THE INVENTION It has been found, as has just been noted, that an effectively large power transistor can be provided by a group of smaller transistors connected in parallel.

However, this basic structure requires that the equalization of input and output impedances be provided for the complete transistor. It is desirable to take advantage of the reversible die technology to provide power amplifiers and even separately provide equalization for the individual transistors that constitute an associated power transistor. In the general sense, then, it is desirable to be able to provide equalization in the motherboard for the individual transistors in the chip. This is provided in the present invention by a circuit structure, based on coplanar waveguides, comprising an electrically insulating substrate having a flat face with a connection region, and a coplanar waveguide mounted on the face of the substrate. The coplanar waveguide has a first and second ground conductor, coplanar, spaced, and a signal conductor, coplanar with the ground conductors, placed between, and separated from, the first and second ground conductors, a signal conductor and at least one coplanar ground conductor extends to the connection region. An integrated circuit is reversibly mounted or flywheel over the substrate connection region, with a first terminal reversibly mounted to a ground conductor, and a second terminal reversibly mounted to the signal conductor. The integrated circuit, in the general sense, can have any functional circuit on it, such as a simple active or passive device, or a more complex circuit formed of various combinatiof such devices. The preferred embodiment of the invention provides a radiofrequency power amplifier in which the integrated circuit has a plurality of field effect transistors (FETs). Each transistor has associated gate, source and current terminals on the bushing. An input impedance equalization network is mounted on the substrate. The network includes a coplanar waveguide having an elongated waveguide signal driver for each gate terminal with a distal end, separate from the connection region and a proximal end in the connection region. The distal ends are connected to an input, base, simple conductor. The proximal ends are reversibly mounted to one of the respective gate terminals. The network further includes a capacitor that connects each of the distal ends of the input signal conductor to an adjacent ground conductor. The lengths of the signal conductors and the sizes of the capacitors are chosen to provide a selected impedance at a selected frequency. The capacitors can be on a separate mop or chip mounted reversibly or flywheel to the signal and ground waveguide conductors, in which case these are formed as coplanar waveguides with open-ended signal conductors. An output coplanar waveguide includes, for each outlet terminal, an output signal conductor having one end in the connection region, which is electrically connected to the FET reversible chip. This waveguide also has a length and other selected dimensito provide the desired impedance equalization. The invention thus provides the advantageous use of the reversible mounting or flywheel of the radiofrequency chips or microtablets directly on coplanar waveguides. In addition, such waveguides may have a signal conductor that is divided into a plurality of waveguide secti which provide equalization of distributed impedances. These other features and advantages of the present invention will be apparent from the preferred embodiments described in the following detailed description, and illustrated in the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic representation of a power amplifier adapted in impedance, which can be elaborated according to the invention.

Figure 2 is a plan view of a first preferred embodiment of the amplifier of Figure 1, made according to the present invention.

Figure 3 is a simplified, plan view of a second embodiment of the invention, which is an extension of the embodiment of Figure 2.

Figure 4 is a plan view, similar to Figure 3, showing a third embodiment of the invention.

Figure 5 is a plan view, to scale, of a fourth embodiment of the invention.

Figure 6 is a cross-sectional view, to scale, of a reversible capacitor chip, used in the embodiment of Figure 5.

MODES FOR CARRYING OUT THE INVENTION Referring initially to Figure 1, there is shown a power amplifier 10, for example, which illustrates an electrical circuit that can be developed according to the invention. The amplifier 10 includes a simple input signal line 12, which is received by an input impedance equalization network 14, for adapting the input impedance of a composite transistor 16 to an input circuit. Correspondingly, an output impedance matching network 18 adapts the output impedance of the composite transistor to an output circuit connected to a single output signal line. The amplifier is comprised of N sections. The input impedance matching circuit for each section I includes a bypass capacitance CÜ and a series inductance ^, which in radio frequency applications is typically in the form of a transmission line. Isolation for odd-mode oscillations can be provided by the insulation resistors R ^ in the input circuit between the sections, and can be provided in the output circuit as shown by the resistors Rio-Correspondingly, the equalization circuit of output impedances includes, for each section I, a series inductance LQ and a bypass capacitance CJL0. Each section I has a transistor Qi. These are shown in the preferred form as FET, although these may also be bipolar transistors. The group of transistors Q¿, 1 = 1, 2, ... N, together form the composite transistor 16. As will be observed with respect to the specific embodiments of the invention, the gates, the sources and the sockets They can be without fractures or uninterrupted. That is, these can be sections of corresponding composite elements. Figure 2 illustrates an embodiment of an amplifier 22 developed according to the invention. The amplifier 22 includes a first or input coplanar 24 waveguide, a reversible mounted FET 26 chip or flywheel, also referred to as a circuit component, shown in dashed lines, and a second or second coplanar waveguide. , all mounted relative to a substrate 30. The substrate includes a flat face 30a and has what is termed as a connection region 32 generally defined by the outline of the FET socket 26. Mounted on the substrate 30 is in ground plane 34 which includes the first, second and third ground conductors 36, 38 and 40. The third ground conductor 40 is elongated and has an enlarged inlet or far end 40a. These three ground conductors are all preferably integrally joined in the connection region, as shown. The electrically conductive reversible mounting lugs, 42, 44 and 46, connect the ground conductors to the corresponding source terminals of the FET lug 26 located in the connection region 32. Extending in a groove 34a in the ground plane, is a first or input signal conductor 48, which is separate from the ground conductors 36, 38 and 40 by a distance A in general uniform or average (per unit length of conductor 48). The ground conductor 40 may not be required, as represented by the edge 34c of the alternate ground plane, shown as a dashed line, such as when the conductor 48 is tightly coupled to the leads 36 and 38. The conductor of the input signals includes a simple, input base portion 48a, and first and second branch portions 48b and 48c, These bypass portions are connected to what is termed as distant 48d and 48e or input ends, in a coupler 48f to the base portion 48a. The proximal ends 48g and 48h or output are connected to the gate terminals of the FET 26 gimlet via the projections 49 and 50 of the reversible chip. The enlarged end 40a of the ground conductor 40 is connected to the adjacent sections of the ground conductors 36 and 38 by appropriate air bridges 52 and 53, or by an equivalent structure. The enlarged end of the ground conductor 40 is seen as spaced a distance B from the far ends 48d and 48e of the input signal conductor, which is smaller than the distance A. This reduced spacing results in increased capacitances 54 and 56 between the Associated sections of the ground conductor and the branches of the conductor of input signals. This reduced spacing could also be achieved by the enlargement of the signal conductor, such as an increment in steps or gradients. These capacitances correspond to the capacitances C ^ and C2i, shown in the amplifier 10 of Figure 1. Similarly, the length C of the bypass portions 48b and 48c, comprises the transmission lines 58 and 60 corresponding to the inductances L n and L2i of the amplifier 10. The capacitance / inductance combinations 54/58 and 56/60 thus form the individual impedance matching circuits 62 and 64, respectively, which together comprise an impedance equalization circuit 66, entry, compound. Other techniques, such as the placement of dielectric layers on the conductors or the addition of metallization to the back, can also be used for impedance equalization.

The TET 26 cellulose or icropas can be constructed according to conventional techniques. This includes a source 68, a gate 70 and a power outlet 72, which form a composite FET 74. The source 68 is connected in this mode to the projections of the reversible eyelet 42, 44 and 46. These projections form from this mode, a group 76 of terminals that serve to connect the source 68 to ground. The gate 70 is connected to the projections 49 and 50 on which an input signal is received from the signal conductor 48. The projections 49 and 50 can accordingly be considered a group 78 of control terminals for the individual FETs 80 and 50. 82. The power outlet 72 is connected to a group 84 of output current terminals, which consist of this mode of a simple output current terminal, represented by a projection 86 of the reversible chip. As seen, the projection 86 is connected to what can be considered the proximal end 88a of a signal conductor 88, second or output. The conductor 88 is placed in a slot 34b of the ground plane, and a distance A is separated on the opposite sides' from the fourth and fifth ground conductors 90 and 92. Which together form the output coplanar waveguide 28. Although not it is shown as being the same, the impedance matching can be provided on the output, using the techniques described with reference to the input. Figure 3 illustrates, in simplified form, an amplifier 100 that is similar to amplifier 22. Amplifier 100 includes an input coplanar waveguide 102, having four terminals 104, 106, 108 and 110 in a connection region 112 associated with a nose of transistors 114. The waveguide 102 is in the form of a binary division with a first coupler 116a that divides a signal conductor 116 into initial branch portions 116b and 116c. Each of the branch portions 116b and 116c are then divided into the respective branch portions, 116d, 116e, 116f and 116g. Similarly, an output coplanar waveguide 118 has an output signal conductor 120 that joins in a coupler 120a from two branch portions 120b and 120c within a simple output base portion 120. The bypass portions 120b and 120c are attached to the lug 114 at terminals 122 and 124. Figure 4 illustrates an amplifier 130 that is similar to Figure 3, except for the shape of a coplanar input waveguide 132. This waveguide has an input signal conductor 134 that divides directly into four parallel bypass portions 134a, 134b, 134c and 134d from directly opposite connecting arms, 134e and 134f, which extend from a base portion 134g. As is apparent, other coupler configurations for a coplanar waveguide having a division signal path are possible. Also, the divisions into multiple portions of derivation can be elaborated non-symmetrical, in order to divide the power unevenly. Figures 5 and 6 are plan views of a preferred design of an amplifier 140 which is yet another embodiment of the invention. For simplicity, the substrate on which the coplanar waveguides are mounted is not shown. The amplifier 140 includes a ground plane 142, integral, forming an input coplanar waveguide 144, of multiple division paths extending through a first connection region 146 of the reversible socket. The region 146 is for connecting a chip or capacitor chip 148. The waveguide 142 terminates in a second connection region 150 of the reversible chip, in which it is connected to a chip of FET 152. A coplanar waveguide of splitting channels 154 extends from the region 150. The waveguide coplanar input 144 is like the combination of three waveguides, similar to the waveguide 24 illustrated in Figure 2. This waveguide includes an input signal conductor 156 having an initial base section 156a. This section is immediately divided into a coupler 156b into three primary, derivation portions 156c, 156d and 156e, which have substantially equal lengths. These bypass portions are then each divided into respective links or couplers 156f, 156g and 156h, in the respective secondary, parallel, bypass portions 156i and 156j, 156k and 1561, and 156m and 156n. Each of these three last derivation portions forms a transmission line segment having inherent inductance, as described with respect to the embodiment of Figure 2. These division signal conductors divide the ground plane into intermediate portions. 142a and 142b, positioned between the adjacent, primary, derivation portions 156c, 156d and 156e. The air bridges 158 and 160 connect these land portions together at separate sites. Similarly, the air bridges 162 and 164 connect the land portion 142a with a first land portion 142c, base, and the air bridges 166 and 168 connect the land portion 142b with a second portion of land 142d, base . Alternatively, the nipper 148 could be extended over the primary bypass portions with proper metallization and reversible or flywheel connections, to provide the ground junction connections instead of the air bridges. The protrusions 170, 171 and 172 of the reversible lug for the lug or micro-chip 148 of capacitors are placed on the input signal conductor couplers 156f, 156g and 156h. Also, the projections 174, 175, 176, 177, 178, 179, 180, 181 and 182 of the reversible chip, connect the various ground plane portions with the reversible chipper 148. The chipper or chipper 148 shows in a simplified top view in Figure 6, as it could be observed on the fingerprint in dashed lines of the chip or mop shown in Figure 5, with crosshatch shading showing metallization. For simplicity, the projections of the reversible eyelet shown in Figure 6 are given with the same reference numbers as those shown in Figure 5. It is noted that the eyelet 148 has three coplanar waveguides 184, 185 and 186. The ground plane 142 is connected through the projections associated with a ground plane 188 of the tine having slots 188a, 188b and 188c having open-end signal conductors 190, 192 and 194. These conductors are connected at one end to the projections 170-172. The waveguides 184, 185 and 186 thus provide the capacitance between the secondary, branching portions of the signal conductor 156 and the three ground plane portions adjacent to each of the couplers 156f, 156g and 156h. As described with reference to amplifier 22 in Figure 2, the capacitances and inductances are selected to provide the impedance matching between an input circuit to which the amplifier is connected, and the impedances of the FETs on the chip 152. The FET chip 152 has a gate terminal at the end of each secondary branch portion of the signal conductor 156. The group of gate terminals is generally represented by the projections 196. The source terminals are represented by the projections. 198. Correspondingly, there is an outlet terminal for each gate terminal, as represented by the projections 200. Figure 5 shows the output waveguides 202, 203, 204, 205, 206 and 207 that extend from the region connection 150, there being a coplanar output waveguide for each outlet terminal. Again, these output waveguides are transmission lines that provide equalization of impedances for the FETs in the socket 152. The output signal paths can be coupled after sufficient inductance is realized, or may diverge for the subsequent processing of individual signals *, according to the requirements of the specific application in which the amplifier 140 is used. The present invention thus provides for the reversible mounting or steering wheel of an integrated circuit on a waveguide. coplanar The ground conductors can be wide or strip-shaped. A single signal path in the waveguide can be divided into plural signal paths using the transmission line structure of the coplanar waveguide, or conversely, the pathways of several signals can be combined into one. The fabrication of the circuit is facilitated by having ground and signal conductors on the same surface of a substrate, although the intermediate connections between the separated ground plane conductors are maintained through the use of non-coplanar techniques, such as air bridges , in order to make the crossing of signal drivers. Metallization on the opposite side of the substrate can also be used. In addition, the proper design of the split signal paths provides selected amounts of series inductance and shunt capacitance for the impedance matching.

The capacitance and the inductance are easily accommodated by coplanar design techniques, or they can be augmented by a reversible chip or mop mounted on the split coplanar waveguides. More generally, the equalization of the impedance can be provided by techniques such as decoration of the substrate, mesh coupling or micro-chip, addition of dielectric layers on the conductors, and metallization of the back side. Similarly, the reversible mounting or flywheel of a transistor chip to the end of a coplanar waveguide provides ease of manufacture, consistent quality and improved performance characteristics. A power amplifier can thus be achieved by using a plurality of small amplifiers connected in parallel and the impedance individually adapted. Similarly, a push-pull power amplifier could be constructed according to the invention through the use of multiple push-pull lines. It will be apparent to one of skill in the art that variations in form and detail could be made in the preferred embodiments, without departing from the spirit and scope of the invention, as defined in the claims, and any modification thereof as it is provided under the doctrine of equivalents. For example, the described modalities provide different configurations for reversibly mounting a flywheel on a coplanar waveguide, and for dividing the signal path of a coplanar waveguide and achieving equalization of impedances through circuit, coplanar and circuit components. lasquilla or reversible micro-tablet. The preferred embodiments are thus provided for purposes of explanation and illustration, but not of limitation.

It is noted that in relation to this date, the best method known by the applicant to carry out the aforementioned invention, is the conventional one for the manufacture of the objects to which it relates.

Having described the invention as above, property is claimed as contained in the following:

Claims (24)

1. A circuit structure based on coplanar waveguides, characterized in that it comprises: an electrically insulating substrate having a flat face with a connection region; a first coplanar waveguide mounted on the face of the substrate, and having a first and a second ground conductor, coplanar, separated, and a first signal conductor coplanar with the ground conductors, and placed between the first and second ground conductors , and separated from these, the signal conductor and at least one of the first and second ground conductors extend towards the connection region; and a reversibly mounted integrated circuit or flywheel over the substrate connection region, with a first terminal reversibly mounted to at least one ground conductor, and a second terminal reversibly mounted to the signal conductor, whereby the waveguide leads the electric current relative to the integrated circuit.

2. A circuit structure according to claim 1, characterized in that the first and the second ground conductors are integrally coupled in said connection region under the integrated circuit.

3. A circuit structure according to claim 1, characterized in that the signal conductor includes a base portion and at least first and second branch portions, separated, at least one of the branch portions extends towards the connection region for the connection to the second terminal of the integrated circuit.

4. A circuit structure according to claim 3, characterized in that the first and second branch portions are integrally coupled to the base portion, and the waveguide further comprises a third ground conductor coplanar with, and electrically connected, to the first and second conductors of earth, and extending between the first and second branching portions, spaced apart.

5. A circuit structure according to claim 4, characterized in that the bypass portions and the ground conductors are all elongated and have generally uniform and equal widths.

6. A circuit structure according to claim 3, characterized in that the signal conductor further comprises the third and fourth branch portions extending to the connection region from the base portion, and the integrated circuit further has the third and fourth terminals reversibly mounted, respectively, to the third and fourth branch portions.

7. A circuit structure according to claim 1, further characterized in that it comprises a plurality of the coplanar waveguides extending in parallel with a simple ground conductor, extending between adjacent signal conductors, and wherein the integrated circuit further comprises a terminal corresponding to and reversibly mounted to each of the conductors.

8. A circuit structure according to claim 7, characterized in that the ground conductors are elongated and have generally uniform widths along at least a portion of their lengths.

9. A circuit structure according to claim 7, characterized in that the signal conductors and the ground conductors are elongated and have generally uniform and equal widths along at least a portion of their lengths.

10. A circuit structure according to claim 1, characterized in that the ground and signal conductors are elongated and have generally uniform widths along at least a portion of their lengths.

11. A structure according to claim 1, further characterized in that they comprise the capacitance means which couples the adjacent sections of the signal conductor and at least one of the ground conductors.

12. A circuit structure according to claim 11, characterized in that at least one ground conductor has a first section having a generally uniform spacing from the signal conductor, and the capacitance means comprises a second section of at least one ground conductor that has a reduced spacing from the signal conductor, which is smaller than the overall uniform spacing.

13. A circuit structure according to claim 11, characterized in that the capacitance means comprises a second integrated circuit having at least one open-end waveguide reversibly mounted to the signal conductor and at least one ground conductor.

14. A circuit structure according to claim 1, further characterized in that it comprises a second coplanar waveguide, mounted on the face of the substrate, spaced from and coplanar with the first coplanar waveguide, the second waveguide has * a third and a fourth ground conductors , coplanar, spaced, and a second signal conductor coplanar with, placed between, and separated from the third and fourth ground conductors, the third and fourth ground conductors and the second signal conductor extend to the connection region, for driving the electric current relative to the integrated circuit, whereby the first, second, third and fourth ground conductors are integrally coupled in the region of connection between the first and second signal conductors.

15. A circuit structure based on waveguides, coplanar, characterized in that it comprises: an electrically insulating substrate having a flat face with a connection region; a first coplanar waveguide mounted on the face of the substrate, and having a first and second ground conductor, coplanar, spaced apart, and a first signal conductor coplanar with the ground conductors, and placed between, and separated from, the first and second ground conductors, the signal conductor includes a base portion and at least one first and • a second branch portions, spaced apart, at least one of the branch portions, extends toward the connection region from the base portion, minus one of the first and second ground conductors extends to the connection region; a second coplanar waveguide, mounted on the face of the substrate, spaced from and coplanar with the first coplanar waveguide, the second waveguide has a third and a fourth coplanar, spaced ground conductors, and a second signal conductor coplanar with, placed between , and separated from the third and fourth ground conductors, the third and fourth ground conductors and the second signal conductor extend to the connection region to conduct the electric current relative to the component, whereby the first, second, third and fourth earth conductors are integrally coupled in the region of connection between the branch portions and the second signal conductor; and an integrated circuit comprising first and second transistors mounted in a reversible manner or steering wheel to the first, second, third and fourth ground conductors, to the first and second branch portions of the first signal conductor, and to the second signal conductor to receive a signal input on the first signal conductor and to output an amplified signal by the transistors on the second signal conductor.

16. A circuit structure according to claim 15, further characterized in that it comprises at least a first capacitance means joining the first and second branch portions to at least one adjacent ground conductor, wherein the first and second branch portions form transmission lines having lengths that are appropriate, in combination with at least a first capacitance means, to adapt the input impedance of the waveguide to the input impedances of the first and second transistors.

17. A circuit structure according to claim 16, characterized in that there is a coupler where the base portion is coupled to the first and second branch portions, the first coplanar waveguide further comprises a third ground conductor, coplanar with and electrically connected to the first and second ground conductors and extending between the first and second branch portions, the third earth conductor has one end adjacent to the coupler, and at least one first capacitance means is reversibly mounted to the end of the third earth conductor and at coupler.

18. A radiofrequency circuit structure, characterized in that it comprises: an electrically insulating substrate having a flat face with a connection region; a ground, flat conductor, mounted on the flat face of the substrate, and extending through the connection region; an input signal conductor mounted on the flat face of the substrate and having an input end and a plurality of output ends extending electrically in parallel to the connection region, the input signal conductor and the ground conductor comprises, in combination, a first coplanar waveguide; an output signal conductor also mounted on the flat face of the substrate, electrically separate from the input signal conductor, having an input end in the connection region and an output end separate from the connection region, the conductor output signals and the ground conductor comprise, in combination, a second coplanar waveguide; and a chip or integrated circuit chip mounted reversibly on the substrate, and having a transistor associated with each output end of the input signal conductor, an input terminal for each transistor that is connected to a corresponding one of the output ends of the input signal driver, and at least one output terminal connected to the input end of the output signal conductor, to output the amplified signals from the transistors.

19. A circuit structure according to claim 18, further characterized in that it comprises one of the output signal conductors for each of the transistors, wherein each transistor has an output terminal connected to the associated one of the output signal conductors .

20. A high frequency power amplifier, characterized in that it comprises: an electrically insulating substrate having a flat face with a connection region; a chip or chip of integrated circuit, reversibly mounted or flywheel over the connection region of the substrate, having a plurality of transistors, and having a group of at least one control terminal connected to the transistors, at least one of the groups have a plurality of associated terminals; a . impedance equalization network, mounted on the substrate and associated with a group of terminals, and comprising a network coplanar waveguide having an elongated waveguide signal conductor for each terminal in a group with a distant end separated from the connection region, and a proximal end in the connection region, and reversibly mounted to a respective one of the terminals in a group, and a second ground conductor on each side of the waveguide signal conductor, the network further comprises a capacitor that coupling each of the distal ends of the waveguide signal conductor to an adjacent ground conductor, the length of the waveguide signal conductors and the capacitors, provide a selected impedance at a selected frequency; and at least one separate signal conductor, spaced from the waveguide signal conductors, mounted, on the substrate and reversibly mounted to the other of the terminal groups.

21. An amplifier according to claim 20, characterized in that all the remote ends of the waveguide signal conductors are connected to a simple, base signal conductor.

22. An amplifier according to claim 20, characterized in that the capacitors are mounted on a separate bushing mounted reversibly to the ground signal conductors of the waveguide.

23. An amplifier according to claim 22, characterized in that the capacitors comprise at least4 a coplanar waveguide with an open-ended signal conductor.

24. An amplifier according to claim 20, characterized in that the separate signal conductor is part of an associated coplanar waveguide, having associated ground leads connected to the ground conductors of the coplanar waveguide of the network. SUMMARY OF THE INVENTION A radiofrequency power amplifier is disclosed that includes a multiple FET chip or mop that is mounted in a reversible manner or flywheel over a connection region of a substrate. An input equalization network is also mounted on the substrate. The network includes a coplanar waveguide having an elongated waveguide signal conductor for each composite terminal on the FET chip, with a distal end, separated from the connection region and a proximal end, in the connection region. The distal ends are connected to an input, base, simple conductor. The proximal ends are reversibly mounted to the respective ones of the gate terminals of the FET chip. A capacitor couples each of the distal ends of the input signal conductor to an adjacent ground conductor. Signal conductors and capacitors provide a selected impedance at a selected frequency. The capacitors may be on a separate chip or mop, mounted reversibly to the signal and ground conductors, of the waveguide, and may be formed as coplanar waveguides with the open-ended signal conductors. An output coplanar waveguide includes, for each outlet terminal, a conductor of output signals having one end in the connection region, which is electrically connected to the reversibly mounted FET chip or chip. This waveguide also has a selected length to provide the desired impedance equalization, and may also have other means of impedance equalization.