MXPA06009917A - Midspan patch panel with compensation circuit for data terminal equipment, power insertion and data collection - Google Patents

Abstract

A compensating advanced feature patch panel (12) that can include removable modular (50) or fixed electronic components(46) located directly on the patch panel which are separately or in combination capable of providing advanced features such as device detection and power insertion. The patch panel provides communications between an insulation displacement connector (IDC) at a PD/User end (84), and any standard interface type using unshielded twisted pair cables, such as an RJ45 connector at a switch end (86) at performance levels of at least category 3, 5, 5e, 6 and/or higher (e.g. 6e or 7) and equivalent performance levels as required by compensating for the active electronics used in providing advanced features through the use of inductive, capacitive and reactive circuit elements to compensate for advanced feature electronics.

Description

SUSPENSION CONNECTION PANEL WITH CIRCUIT OF COMPENSATION FOR DATA TERMINAL EQUIPMENT. INSERTION OF ENERGY AND DATA COLLECTION REFERENCE TO RELATED REQUESTS Related content is described in a patent application of E.U.A. of AbuGhazaleh et al., entitled "Suspension Connection Panel with Compensating Circuit for Data Terminal Equipment, Energy Insertion and Data Collection", Serial No. 10/791, 291, the content of which is incorporated herein by reference.

FIELD OF THE INVENTION The present invention relates to a connection panel replacement device that includes advanced features for providing power and data collection in association with attached network devices at the same time providing at least performance levels of category 3, 5, 5e, 6 and / or higher (for example, 6e or 7). and equivalents, as required. More particularly, the present invention relates to a printed circuit board of the connection panel including modular or fixed electrical components for use with providing advanced features and further including compensating circuit elements to minimize the adverse effects of electronics required to provide such features. advanced.

BACKGROUND OF THE INVENTION The convergence of telecommunications and datacom technologies, as well as the blurred distinction between the system side and the network cabling system is driving a continuous evolution of structured cabling. Using expectations and dependence on local area network (LAN) performance is creating an expectation above operational speed and reliability to also include device tracking and systems management. Currently, limited progress has been made in these areas due to the impact of proposed improvements in operational speed. As for plugs and switches in logical addresses and network maps, the location of assets and connection routing is best handled through the cabling system. The development of advances must address various characteristics and requirements of the developed system such as the detection of connected devices, including the addition, elimination and / or movement of each of said devices having access to the system and the provision of power to connected devices. The movement of devices that have access to the system is one of several considerations during improvement developments. As described in the patent of E.U.A. No. 6,350, 148, issued on February 26, 2002, to Batolutti et al., The content of which is incorporated herein by reference, many businesses have devoted themselves to telecommunications systems that allow computers, telephones, machines, facsimile and the like to communicate with each other through a private network, and communicate with remote locations via a telecommunications service provider. In most constructions, the dedicated telecommunications system is wired using telecommunication cables that are coupled to individual service ports throughout the construction. Cables from dedicated service ports typically extend into the construction and terminate in a connection system that is used to interconnect the various telecommunication lines. The connection system is usually located within a telecommunications booth and is most often placed in a mounting frame that includes a number of shelves or connection panels to which each telecommunication line is terminated. The connection panels include a number of port assemblies, such as RJ-45 telecommunication connector ports, and each telecommunication line is terminated to the connection panel in an organized manner. An example of device movement considerations as described in the Batolutti patent includes assigning one or more employees their own exchange of access number to the computer network so that the employee can interact with a computer network or central computer principal of a company. Since the employees or the equipment are moved, the connection cords in a typical telecommunications booth are rearranged and new positions are manually documented using either paper or computer based records. However, technicians often disregard the update of the disposition record every time a change is made. To correct this, the manual trace of the connection cord must be done which can be time consuming and prone to more errors. Detecting connected devices is another consideration during the development of improvements that is commonly required for security purposes in many applications. Details of several examples of said detection subjects are described in the U.A. Patent. No. 5,406,260, issued April 11, 1995, to Cummings et al., The contents of which are incorporated herein by reference. A number of device detection methods have been developed to protect against the unauthorized removal of electronic equipment, including methods that require the actual physical binding to a security cord for each piece of protected equipment or the binding of labels that can not be protected. Remove the team. However, these methods require quite expensive sensor devices and are not very practical in all cases. In the device detection method described in the Cummings patent, an isolation power supply is used to provide a low current DC energy signal to each communication link and then monitor a circuit loop created through a DC resistive termination between the communication link and a remote device. Any interruption between the communication link and the remote device, such as the removal of the device from the communication link, interrupts the circuit loop and triggers an alarm. Additional circuit loop device detection methods also include detecting a current loop that. physically attaches to the protected equipment. A method as such is described in the U.S. Patent. No. 4,654,640, issued March 31, 1987, to Carll et al., The contents of which are incorporated herein by reference. The Carll patent describes a burglar alarm system for use with a digital signal PBX telephone system that includes a number of electronic ties attached to individual pieces of protected equipment, each tie including a pair of conductors that connect to form a closed current loop via a series resistor and conductive aluminum sheet attached adhesively to the equipment. Once assembled, the resulting circuit loop can be used for device removal detection, however, the conductive aluminum foil that is attached to the equipment can be removed carefully without any detection. The Batolutti patent also referenced above, still describes another detection method for connection panel connectors. A connection panel where multiple mechanical sensors are mounted, serves to detect the presence or absence of a connecting cord connector in a connector port on the panel and a computer controller connected to the multiple sensors can then be used to monitor changes in connection panel connections such as when a connector is removed from a connector port. However, the detection is limited to the pure absence or presence of a connector. Providing power to connected devices is still another consideration during the development of improvements that can often include aspects of device detection as described above. Energy applications, such as those found in energy technologies over Ethernet, allow IP telephones, wireless LAN access points and other devices to receive power while also receiving data over existing LAN cabling without a need to modify the ethernet infrastructure. These technologies are described in IEEE802.3af, also known as power over Ethernet, which outlines the designs of power supply equipment and propelled terminals. Various methods for providing power to remote devices are also described in the U.S. Patent. No. 6,218,930, issued April 17, 2001, to Katzenberg et al., The contents of which are incorporated herein by reference. In an example of an energy application technology, an initial detection step is used before an energy application step. Before applying external power to a device, the automatic detection of connected equipment is achieved by supplying a low level current to the network interface and measuring a voltage drop in the return path. The measurement can have three states, including no voltage drop, a fixed level voltage drop or a varying level voltage drop. As described in the Katzenberg patent, if no voltage drop is detected, then the remote equipment does not contain a DC resistive termination and this equipment is identified as being unable to support remote power feeding. If a fixed voltage level is detected, the remote equipment contains a DC resistive termination, such as a "bob smith" termination and this equipment is also identified as being unable to support remote power supply. If a varying voltage level is detected, this detection indicates the presence of a DC-DC switch-on supply in the remote equipment and this equipment is identified as being capable of supporting remote power supply which is then provided.

Attempts to address device movement and detection, as well as attempts to address the provision of power to connected devices, typically fail to consider the degradation of communication performance that such solutions can create. Where attempts have been made to correct performance degradation, solutions have typically been limited to the relocation and manipulation of signal traces. Examples of such solutions are described in the patent of E.U.A. No. 5,797,764, issued August 25, 1998, to Coulombe et al., And in the U.S. Patent. No. 5,673,009, issued September 30, 1997, to Klas et al., The contents of which are incorporated herein by reference. The Coülombe patent discloses a printed circuit board that electrically couples a connector block and base assembly within a connection panel. Each signal trace on the board is provided with a compensation trail aligned either above or below the respective signal trail for an electromagnetic connection between tracks sufficient to reduce overlapping sounds. Trace manipulation is also described in the Klas patent, which discusses a printed circuit board where the superposition of sounds through the relocation of adjacent traces is eliminated. The equal or opposite signal source traces are placed adjacent to each other so that the cumulative sound superposition is eliminated. Unfortunately, trace manipulation is not sufficient in each case to provide performance levels of category 3, 5, 5e, 6 and / or higher and equivalent. Still further examples of such solutions are described in the U.S. Patent. No. 6,443,777, issued September 3, 2002, to McCurdy et al., And in the U.A. Patent. No. 6,464,541, issued October 15, 2002, to Hashim et al., The contents of which are incorporated herein by reference. The McCurdy patent discloses an inductive and capacitive sound overlay compensation technique incorporated in a communication connector (i.e., modular base) which includes the relocation of contact wires and the addition of a printed wire board for capacitive coupling. The contact wires are separated by a set distance to obtain an adequate level of inductive compensation coupling, and a capacitive coupling is provided by one or more printed circuit boards located in the plug body as the contact legs move. . The use of such printed cable plates is also discussed in the Hashim patent, which also describes a two stage sound overlay compensation technique. In a first step, a printed cable plate is provided for capacitive coupling as the contact wires travel, and in a second step, a printed cable plate having a number of inductive loops and crest trails placed on the cable is provided. careful way. Although both McCurdy and Hashim patents address the reductions in sound overlap in the connector position, each fails to address performance degradation above the connector, including performance degradation that may be created due to additional active circuit elements involved. in providing advanced features: Therefore, an active asset connection panel is needed that can include advanced features for asset management and security, and can also provide compensation for active electronics used to obtain these and other advanced features.

BRIEF DESCRIPTION OF THE INVENTION An object of the present invention is to provide a system and method for an active input connection panel circuit that can include advanced feature components for use with asset management and security functions, including functions to provide power and detection for devices connected remotely. Another object of the present invention is to provide a system and method for an active input connection panel circuit that can provide advanced feature components either as removable modular electronic components or as fixed electronic components located directly on a printed circuit board of the connection panel. Another object of the present invention is to provide a system and method for an active input connection panel circuit that can provide communication between an insulation displacement connector (I DC) at one PD / User end and any type of interface standard using twisted pair cables, such as an RJ45 connector, at a switch end (i.e., end of telecommunication equipment). Another object of the present invention is to provide a system and method for an active input connection panel circuit that can minimize adverse communication performance effects created by modular or fixed electronic advanced feature components and provide at least levels ~ of category 3, 5, 5e, 6 and / or higher (for example, 6e or 7) and equivalents, as required. Still another object of the present invention is to provide a system and method for an active input connection panel circuit constructed as a 3U panel including space for cable laying and active circuit between telecommunications circuits arranged above and below the laying of Active circuit cable, including 1 to 120 ports so that density is maintained. These and other objects of the present invention are substantially achieved by providing an active input connection panel circuit which may include removable modular or fixed electronic components located directly on a printed circuit board of the connection panel, which are used separately or in combination to provide advanced features. Advanced features may include detecting the presence or absence of connection of a remote device and, where applicable, providing a power supply to connected remote devices that include VolP telephones, remote wireless Ethernet devices and other network devices. The patch panel circuit includes a printed circuit board of the multilayer patch panel having a plurality of layers, a communication circuit arranged in a first layer and electrically coupled between an insulation displacement connector (I DC) in a end of PD / l suario and an RJ45 connector on one end switch, and a removable modular or fixed electronic component electrically coupled with said communication circuit. The component may include an active circuit arranged in a second layer to be used in providing an advanced feature. The circuit further includes compensating circuit elements, which are arranged directly between signal traces in the first and / or second layers, and may also be arranged in a third layer, wherein each element is provided to establish a compensating capacitance and inductive storing with the active circuit to substantially minimize the adverse effects that result from the active circuit. The connection panel circuit and included fixed and / or detachable components can support devices that implement techniques similar to those of the IEEE802.3af and TIA-568B series, including updates such as TIA568B.1 -6. The circuit board and components included are also flexible enough to provide power to other configurations of proprietary devices, applications or development standards that require similar levels of power.

The connection panel circuit can also perform data collection functions on various system parameters including device connections, locations and power state conditions on various connection ports. In each case, the connection panel circuit provides at least three performance levels of category 3, 5, 5e, 6 and / or higher (6e or 7) and equivalent when minimizing the adverse effects of active fixed electronics and / or removable used to provide advanced features through the use of inductive, capacitive and reactive circuit elements placed to compensate for advanced electronic features. Other objects, advantages and salient features of the present invention will be apparent from the following detailed description, which, taken in conjunction with the accompanying drawings, discloses a preferred embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS Referring to the drawings forming a part of this description: Figure 1 is a block diagram illustrating a data terminal equipment power insert and data collection connection panel circuit in accordance with one embodiment of the present invention. invention; Figure 2 is a perspective view of a first angle illustrating a mounting panel in accordance with one embodiment of the present invention; Figure 3 is a perspective view of a second angle illustrating a mounting panel in accordance with an embodiment of the present invention; Figure 4 is a side elevation view illustrating a connection panel assembly that includes electronics with advanced features in accordance with one embodiment of the present invention; Figure 5 is a side elevational view illustrating a connection panel assembly that includes plug-in modules with advanced features such as an option plate with parallel mounted functionality in accordance with one embodiment of the present invention; Figure 6 is a side elevational view illustrating a connection panel assembly that includes plug-in modules with advanced features such as an option plate with perpendicular mounted functionality in accordance with one embodiment of the present invention; Figure 7 is a plan view of a printed circuit board of the layered connection panel in accordance with an embodiment of the present invention; Fig. 8 is a schematic illustrating an example of active circuit elements that can be arranged on the printed circuit board of the connection panel for use in providing energy detection and insertion in accordance with an embodiment of the present invention; Figure 9 is a trace distribution scheme illustrating the circuit of Figure 8 as provided on the printed circuit board of the connection panel in accordance with one embodiment of the present invention; Figure 10 is a trace distribution scheme illustrating a circuit that minimizes effects as provided on the printed circuit board of the connection panel for use with the circuit of Figure 8 in accordance with one embodiment of the present invention; and Figure 11 is a trace distribution scheme illustrating both the circuit that minimizes the effects of Figure 10 and the circuit of Figure 9 in an exemplary position on the printed circuit board of the connection panel in accordance with a embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION The present invention includes an electrical device that functions as a connection panel at the same time providing additional advanced features. Where such features are provided, the present invention also serves to reduce or eliminate the adverse effects created by electronics with advanced features through the placement and separation of circuit elements, and / or provide circuit elements that minimize the effects or of compensation to increase performance levels.

The present invention may include one or more components with advanced features separately or in combination as modular units or plug circuits arranged directly on the circuit board of the connection panel. As described in more detail below, the components with advanced features can be used to detect devices attached to the connection panel wiring, both for safety and to determine the types of device with respect to the power requirements, and also provide power DC to fixed devices where practical. Energy can be provided through techniques similar to those outlined in the IEEE802.3af and TIA-568B series, including updates such as TIA568B.1-6 and other standards in development. The modular feature of the present invention allows said components to be aggregated and eliminated in any number of combinations to provide a wide variety of advanced features desired to the connection panel, even above those profiled above. For example, there are several standards and applications that need different energy application than IEEE802.3af, such as construction automation systems, security systems, VolP and so on, and the reference to IEEE802.3af above is presented as a example of the application of the present invention. Also, the modular features of the present invention allow standards still in development, such as those described with TIA and IEEE.

However, components with advanced features are not restricted to modular units and may also include fixed circuits or circuit components that are arranged directly on the patch panel or printed circuit board. connection panel. In each case and specifically in cases where circuit components with additional features are placed directly on the circuit board of the connection panel, the components can create adverse effects that require compensation if the connection panel must obtain desired performance levels. Said compensation can be provided through techniques such as separation and selective positioning of components and circuits with advanced characteristics, and through the addition of active circuit components to the printed circuit board of the connection panel. Fig. 1 is a block diagram 10 illustrating a data terminal equipment power insert and data collection connection panel circuit 12 which may include an optional device detection feature 14, a power insertion characteristic 16 , a port assembly 18 and a data management feature 20 in accordance with one embodiment of the present invention. An example of a remote device network 22 is also shown, including a communication link 24 which serves to electrically couple a number of devices 22 (a) to 22 (d) remotely connected to the patch panel circuit 12. As is known to those skilled in the art, the connection panel circuit typically serves as a link or connection between said devices and a network file server or switch 26. Each device 22 (a) to 22 (d) located remotely is connected to the network 26 via the connection panel 12 to thereby provide generalized remote access to the user to a network. Devices 22 (a) to 22 (d) remotely located (eg, personal computers) are shown connected to port assembly 18 via a data communication link 24 which includes a plurality of transmitting and receiving communication lines for communicating information between each of the remotely located devices and a final destination, such as the network file server 26. In the embodiment of the present invention shown in Figure 1, the connection panel 12 can be used to monitor each electronic device located remotely 22 (a) to 22 (d) using, for example, a current loop continuity circuit provided by the device detection feature 14 as described in greater detail below. The device detection feature 14 can be provided as a modular, removable electronic component or as a fixed circuit arranged directly on a printed circuit board of the connection panel of the connection panel circuit 12. In any case, the detection characteristic device 14 can be used to monitor the data communication link 24 and detect the presence and elimination of any device in the network 22. However, the addition of this advanced feature can have harmful effects on the communication performance of the circuit. connection panel 12. The connection panel circuit 12 can also be used to provide power insertion for each remotely located electronic device 22 (a) to 22 (d) using, for example, the data communication link 24. The communication link 24 allows the power insertion characteristic 16 of the connection panel circuit 12 provide equipment power insertion as described in more detail below. Further details with respect to device detection and energy insertion are described in the U.S. Patent. No. 5,406,260, to Cummings et al., Previous reference. The connection panel circuit 12 of Figure 1 may further include a data management feature 20 provided for monitoring, controlling and collecting data from the remote device network 22, device detection feature 14, energy insertion characteristic 16 and any additional feature component that may be included. The information can be accessed remotely, probed periodically or provided to a network server for system management purposes. As with the device detection feature 14, the energy insertion feature 16 and data management feature 20 can also be provided as modular, detachable electronic components or fixed circuits arranged directly on a printed circuit board of the connection panel and it can also produce harmful effects on the communication performance of the connection panel circuit 12. The connection panel circuit 12 of figure 1 can be constructed as a telecommunications rack including an adapter panel, a number of port assembly assemblies, and panel and one or more printed circuit boards. Each printed circuit board of the connection panel can be mechanically mounted to an adapter panel thus providing a platform, or mounting surface for electronic components of connection panel and additional function components. Figures 2 and 3 are perspective views from a first and second angle illustrating a mounting panel in accordance with one embodiment of the present invention. Figure 2 shows a front surface of the panel 30 having a series of cable laying mechanisms 34 secured and extending from the surface of the panel between a series of port openings 32. Between the cable laying mechanisms and adjacent to each opening of port, a series of openings 38 is provided. Figure 3 shows a rear surface of the panel 30 having a series of mounting mechanisms 36 secured and extending from the surface of the panel. Each feature of the panel shown in Figures 2 and 3 is described in greater detail below in association with a printed circuit board of the connection panel and components.

As noted above, the panel 30 includes a series of cable laying mechanisms, port openings, openings and mounting mechanisms, over which a printed circuit board of the connection panel and associated components can be assembled and assembled as shown in FIG. shown in Figures 4, 5 and 6. Figures 4, 5 and 6 are side elevation views illustrating a telecommunication rack assembled from connection panel circuit 12 in accordance with the present invention. As shown in Figures 4 to 6, the front surface of the adapter panel 30 includes a series of mechanically fixed cable routing mechanisms 34 adjacent to the series of port openings 32 and can be used to provide support, control and protection for several cables associated with the connection panel circuit 12. In the example shown, the cable laying mechanisms can be constructed as rings having a circumference enclosed with at least one access opening provided for cable insertion. The cable laying mechanisms of Figures 4 to 6 are presented as an example, and may be constructed in different arrangements in still other versions of the present invention as required by the application. The adapter panel 30 also includes a series of openings 38 between the front and rear surface of the adapter panel 30, allowing access between the surfaces for use in cable routing and modular plug installations as described in greater detail below.

The rear surface of the adapter panel 30 may include one or more printed circuit boards 40 mechanically mounted via a series of mounting posts 36 extending from the rear surface to the adapter panel. The mounting posts can be constructed having an internal diameter threaded to receive a threaded connector via one or more mounting holes located on the printed circuit boards, or circuit modules. One or more mounting posts 36 can also be used as an electrical ground connection between a ground plane of an attached printed circuit board and the adapter panel. In yet another version of the present invention, the mounting posts 36 can be replaced by one or more plastic support members having a snap fastener or similar mechanism at each end as is known to those skilled in the art. Each mounting mechanism described above can be used to secure one or more printed circuit boards to the rear surface of the adapter panel 30 on which both signal routing and advanced feature components can be placed as shown in FIGS. 6. In Figure 4, a printed circuit board of the connection panel 40 is shown mounted parallel to the rear surface of the adapter panel 30, thus providing an exposed and accessible mounting surface for components with additional features and / or modules, such as the device detection feature 14, energy insertion feature 16 and data management feature 20. Additional feature components and / or modules can be arranged directly on the printed circuit board 40, or electrically coupled as modules , including parallel modular printed circuit boards as shown in Figure 5, or pl perpendicular modular printed circuit boards as in FIG. 6. In FIG. 5, an additional feature, or option plate of additional functionality 48 is shown mounted parallel to the surface of the printed circuit board of the connection panel 40, and in FIG. 6, an additional feature printed circuit board 50 is shown mounted perpendicular to the printed circuit board of the connection panel 40, each using direct modular or flexible connections 45 to electrically couple each printed circuit board 40, 48 and 50. A number of coupling devices, such as connection port assemblies 44, may also be placed on the surface of the printed circuit board 40 to interact with several assigned cables on the front surface of the adapter panel. The coupling devices, shown extending between the surface of the printed circuit board 40 and the front surface of the adapter panel 30 via port openings 32, can be used to terminate the allocated wiring through the cable laying mechanisms 34 without to require direct access to the printed circuit boards 40, 48 or 50, and provide the electrical circuit between an insulation displacement connector (IDC) and a modular RJ45 connector as described in greater detail below. Returning to Figure 4, the printed circuit board 40 can accommodate the required electronic circuitry46 for circuits with advanced features directly on the surface area of the printed circuit board of the connection panel 40, or as shown in the figures 5 and 6, the components with advanced features can be modular and coupled with the printed circuit board 40 in any number of combinations. These circuits with advanced features of Figures 4 to 6, components 46, 48 and 50, respectively, may include the device detection, power insertion and management features of Figure 1, in addition to any number of additional advanced features available . Each circuit with advanced feature can be added, updated, deleted or replaced in accordance with the desired level of desired functionality without replacing the entire connection panel 12 or printed circuit board of the connection panel 40 and incurring additional rewiring costs. Once assembled, the printed circuit board of the connection panel 40 can be used to provide a communication circuit between, for example, an insulation displacement connector on one PD / User end, and any type of standard interface using cables twisted pairs unshielded, like an RJ45 connector on one end switch. As constructed, the present invention may include a 3U panel having space for laying of cables and set of active circuits between telecommunication circuits that are arranged up and down the cable routing and active circuit set, and including 1 to 120 ports per unit so that density is maintained. As is known to those skilled in the art, the electronic circuitry required for circuits with advanced features 46, 48 and 50 typically includes a certain amount of active circuitry. Where these circuits are provided as plug-in modules or placed on the printed circuit board 40, a degree of connection panel performance degradation can be created due to the active circuit assembly elements involved. However, the printed circuit board 40 of the present invention is configured to compensate for this degradation and provide performance levels of category 3, 5, 5e, 6 and / or higher (e.g., 6e or 7) and equivalents as require Specifically, the present invention includes a connection panel circuit having a number of techniques to significantly minimize the impact of said performance degradation. A first compensation technique used in accordance with the present invention is achieved through the printed circuit board design of the connection and layer separation panel. As shown in Figure 7, the present invention constructs the printed circuit board 40 as a multi-layered panel arranged to separate the signal layers, such as traditional telecommunication signals and the like (eg, Ethernet signals), from the active circuits. Figure 7 is a plan view of a printed circuit board assembly of the layered connection panel illustrating layer views of the printed circuit board of the connection panel 40 in accordance with the present invention. The active circuitry of the connection panel circuit 12 typically includes any set of detection circuits, operational amplifiers and other necessary components for logic operations and insertion of power in the connection panel network. Further details with respect to said circuitry are described in the U.A. Patent. No. 5,406,260 to Cummings et al., With prior reference. In the present invention, this active circuitry is placed in one or more layers of printed circuit board 40, which are then separated from remaining layers as described below. In the example shown in Figure 7, the printed circuit board panel 40 of connection panel 12 is constructed of at least 8 layers, and includes layers 52 to 66 on which the components, characteristics and signal traces can be separate but still providing an electrical circuit between an IDC and an RJ45 connector. according to one embodiment of the present invention. In the multilayer connection panel of Figure 7, the signal layers occupy the first two or more layers, below which there are layers of earth and energy that provide insulation. The one or more remaining layers contain the components and route assignment for the active circuits that are separated from the signal, or set of telecommunication circuits when placing in layers that are isolated, by the ground and / or energy planes. An example of the layers of printed circuit board 40 are defined later in Table 1. TABLE 1 When combined, the layers of the printed circuit board 40 provide an electrical circuit to interact the field wiring with the system wiring and advanced features. By doing this, the circuit participation of each layer of the printed circuit board 40 can be described as follows. In layer 52, telecommunication circuits 53, each with signal carrying traces and compensating circuits are used to provide communications between an end user and switch end. Also, as discussed in more detail below with respect to a second compensation technique, a series of compensating circuit elements 68 are placed in the path of the signal layer. Between the layers 52 and 54, there is a first of several layers of prepreg. Below the first prepreg layer, a route assignment layer 54 (e.g., an Ethernet signal trail layer) is included, followed by a first of several conventional insulating core layers or sheets, and provides a telecommunication circuit with a limited number of trails carrying a signal. Beneath the first core layer are layers 56 and 58, which are electrical ground planes separated by a second prepreg layer and followed by a second core layer. Beneath the second core layer is a layer of voltage plane 60 and 62, which are separated by a third prepreg layer and followed by a third core layer. Beneath the third core layer is layer 64, including the active path secondary route assignment 65, which is followed by a fourth prepreg layer. Below layer 4 of prepreg is layer 66, including active components 67, primary route assignment for active circuit set, and IDC connections. The active circuitry of advanced features located in, or coupled with, layers 64 and 66 may result in degradation of connection panel performance in the communication layer that should be corrected to provide desired levels of performance. As noted, this active circuitry 65 and 67 typically includes the set of detection circuits, operational amplifiers and other components necessary for logic operations, and additional features such as visual connection indicator lights and energy insertion circuitry. as described in the US Patent No. 5,406,260 to Cummings et al., With prior reference. The separation of layers as shown in Figure 7 provides for performance improvements in both of the communication circuits of layers 52 and 54, and in active circuit layers 64 and 66 by eliminating the noise interaction and protecting the layers of communication of the circuit elements operating in the active circuit layers. In the present invention, the active circuit layers are separated from the communication circuit layers by multiple electric ground layers, core layers and prepreg layers. The voltage planes, layers 60 and 62, are placed adjacent to the active circuit layers while the electrical ground planes 56 and 58 are placed adjacent to the communication circuit layers, since typically there is less noise from said circuits. ground plans. The combined layers 56, 58, 60 and 62 also contribute to performance improvements by providing a greater separation distance between the communication and active circuit layers than are typically encountered. In addition, as described in more detail below in association with the second compensation technique, a number of compensating circuit elements 68 are placed in layers 52 and 54 to further increase the performance level of the circuit board of the control panel. Connection 40 when adding or removing electronics with advanced features. A second compensation technique used in accordance with the present invention is achieved by providing compensating circuit elements on the printed circuit board of the connection panel. The compensating circuit elements of printed circuit board 40 of the present invention are shown more clearly in Figures 10 and 11, and operate in relation to the additional circuit elements as shown in Figs. 8, 9 and 1 1. Fig. 8 is a schematic 80 illustrating an example of components with additional features such as those provided for dividing the communication circuit in separate input and output circuits in the signal layer for the insertion of device and energy detection characteristic. Fig. 9 is a distribution diagram illustrating the circuit of Fig. 8 on the printed circuit board of the connection panel, and Fig. 10 is a distribution diagram illustrating the compensating circuit elements for use with the circuit of the Figure 8 in accordance with one embodiment of the present invention. Fig. 11 is a distribution diagram illustrating both the compensating circuit elements of Fig. 10 and the circuit of Fig. 9 in an exemplary position on the printed circuit board of the connection panel 40 in accordance with the second technique of compensation. In Figure 8, a schematic illustrating a partial electrical schematic of the printed circuit board of the connection panel 40 is shown including several components for use with providing additional features. In addition, coupling points for electronics with advanced features are also shown. As shown in Figure 8, scheme 80 of the printed circuit board of the connection panel 40 includes a number of fixed active components, signal paths, and bridge circuits 72 that can be used for signal path assignment and coupling points for any number of components with advanced features that provide device detection and power insertion in a connection panel via the multi-conductor link between devices and the network system. An example of a multi-conductor link between devices and the network system provided by circuit board of the connection panel 40 includes a plurality of transmitting and receiving communication lines or signal traces, such as lines 82-1 to 82-8. , for communicating information between devices, such as devices 22 (a) to 22 (d) of Figure 1 and a server or switch via the printed circuit board of the connection panel 40. In the example shown in Figure 8, to the communication lines 82-1 to 82-2 can be assigned route through the connection panel over the first and second layers 52 and 54 of the printed circuit board of the connection panel 40 and terminate in an I DC in one end of PD / User 84, and any type of standard interface using twisted pair cables, such as an RJ45 connector at one end switch 86. Twisted pair cables commonly consist of unshielded twisted pair (UTP), shielded (STP) ), and variations of STP known as protected twisted pair (ScTP) and aluminum foil twisted pair (FTP). The RJ45 connector is made independent of the IDC contacts due to a series of DC blocking capacitors described in more detail below. The loop RJ45 represents one side of the active switch / server / network equipment, while the loop DC I represents the terminal equipment side / power device side. Where the components that provide advanced features are located on the printed circuit board 40, the components would comprise part of the active circuitry located in the layers 64 and 66 of the printed circuit board in multiple layers 40. As shown in FIG. Figure 8, components with advanced features can be coupled with the signal traces, therefore several circuit components bridge the communication layers and active circuit group. In Figure 8, the energy insertion module or electronics (not shown) can be coupled via guides 87 of scheme 80 and by doing so, energy can be inserted into the differential transmission link pairs 82-4 and 82-5 , and pairs .82-7 and 82-8. The remote energy can be inserted using transformers with bypasses in the center 91 and 92 respectively, connected between two pins of each conductor pair and provide DC power to the remote devices coupled to the transmission link. However, the signal flow in each pair is not interrupted by said energy insertion that allows the operation of applications that require all four conductor pairs, such as gigabit Ethernet. A detection module or electronics (not shown) can also be coupled with the circuit guides 88 and the multi-conductor link. Both the detection in the conductive pairs and the energy insertion are implemented through techniques such as those defined in IEEE802.3af and TIA-568B, including updates, such as TIA-568B.1-6. In this way, detection can be achieved by the detection module or electronics, such as when the presence and elimination of any device in the network is detected via a continuity circuit of current loop through conductive pairs. Using conductors 82-1, 82-1, 82-3 and 82-4, the detection module can establish the existence of a device at the end of the wiring plant and the use of these conductor pairs allows the detection of devices that they use only these pairs, which are typically referred to as the "signal pairs" in 10 Base-T and 100 Base-T applications. As shown in Figure 8, a number of fixed active components, signal paths, and bridge circuits 72 are used to allocate route and coupling points for the components with advanced features described above. Where such modules or electronics with advanced features are coupled with circuit, the electrical characteristics and performance of the communication circuitry will typically be reduced. Performance degradation can be minimized through design and layered using the first compensation technique described above, however, performance degradation can also be minimized by compensating circuit elements using the second compensation technique described in more detail later. Therefore, the second compensation technique used in accordance with one embodiment of the present invention includes providing a series of compensating circuit elements, and placing each one on the printed circuit board 40 relative to the active circuit electronics with advanced features. described before. As shown in Fig. 8, the active circuit 72 includes transformers with branches to the center 91 and 92, and a series of blocking capacitors DC 101 to 108 placed on the printed circuit board of the connection panel in the path of the conductor layer. signal to divide the circuit into separate input and output segments. Blocking capacitors are used to block the DC signal and separate the terminal, or side of the device from the server side. The use of blocking capacitors allows the assortment of DC power only next to the terminal without supplying power to the server side. In doing so, the circuit provides several separate DC loops for the cable termination section of the panel and the modular plug connections. As a result, DC continuity can not be obtained between the I DC and RJ45 terminations, however, continuity of AC and RF is still maintained. The selection of the appropriate blocking capacitor size is important to ensure minimal impact on the performance of the communication circuitry. An example of capacitor values found in circuit is defined in Table 2.

TABLE 2 82-8 0.1 μF 0.02 0.5 The active circuit elements 72 of the printed circuit board 40 also include transformers with center leads 91 and 92 that form a DC insertion path in the communication circuitry. These transformers bridge the active and communication circuits and allow DC current to pass, but they do not affect the higher frequency performance of the differential signals, which are typically operating on the same conductor pairs. -As with the capacitors 101 to 108, the transformers 91 and 92 are also selected and placed on the printed circuit board of the connection panel to ensure a minimum impact on the performance level of the circuit board of the connection panel 40. However, regardless of the selection, the active circuitry 72 of the advanced features located in layers 64 and 66 may still result in degradation of connection panel performance in the communication layer. To minimize these effects, a series of compensating circuit elements is placed in the path of the signal layer and a degree of inductive coupling is also provided in the signal layer. As shown more clearly in Figures 8 and 9, the active circuitry 72 is disposed in layers 64 and 66 of the printed circuit board of the connection panel 40 and is composed in part of capacitors 101 to 108 placed in marked points 74. Figure 9 illustrates at least one layer of a portion of a layer surface of the printed circuit board of the connection panel, over which the capacitors 101 to 108 are provided in series with the circuit traces extending in layers 64 and 66 and shown marked 76. The placements shown in Figure 9 are presented as an example. In Figure 10, a series of compensating circuit elements placed in the path of the signal layers 52 and 54 of the printed circuit board of the connection panel 40 are shown. Figure 10 illustrates at least one other layer of a portion of a layer surface of the printed circuit board of the connection panel, on which compensating circuit elements are provided, shown at the points marked 78. These compensating circuit elements include inductive, capacitive and reactive elements that serve to compensate for the adverse effects of the active circuit elements arranged in layers 64 and 66. As is known to those skilled in the art, the traces of the printed circuit board are typically constructed of hello aluminum or aluminum foil coated materials. copper and establish capacitance and inductive coupling with adjacent traces in the same or different layers. Typically, such traces are provided with gaps of approximately three times the width of the trace to minimize this capacitance and inductive coupling, however, the beneficial use of such parasitic effects can be achieved through alternate placements. In the example shown in Figure 10, the compensating circuit elements are constructed as interdigital ridge trails in at least one layer of the printed circuit board 40, however, each (e.g., inductive, capacitive and reactive elements). ) can be supplied in any layer as required. For example, inductive coupling is provided in layers that include signal traces. As shown in Fig. 10, a series of said traces is provided in the compensating circuit elements shown at the marked points 78. In the example shown in Fig. 10, the series of traces is provided in the signal layers 52 and 54 and are placed relative to the capacitors and capacitor traces shown at the points marked 74 and 76 in layers 64 and 66 of the printed circuit board of the connection panel. In the examples shown in Figure 10, the placement of the elements 68 is provided only as an example, and can be reconfigured as required given the different capacitor placement in the active circuit layer. In Fig. 11, an example of a completed assembly according to an embodiment of the present invention is shown, wherein the positioning between condensers and capacitor traces in layers 64 and 66 of Fig. 9, and the elements are illustrated. of compensating circuit in the signal layers 52 and 54 of Figure 10. Specifically, the compensating circuit elements in the signal layers (i.e., capacitors, or any inductive coupling or other compensation method), are placed to couple, or compensate, between the traces of the communication circuit. This coupling / compensation restores the balance (ie return loss and impedance) to the circuit and reduces or cancels any noise resulting from non-equilibrium, including local sound overlay (NEXT), remote sound overlay (FEXT), and Similar. In such a configuration, the beneficial parasitic effects of the compensating circuit elements can be used to increase the performance level of the circuit board of the connection panel 40 when adding electronics with advanced features. Therefore, in addition to the layer separation of the printed circuit board described above, the present invention can also include inductive, capacitive and reactive elements of the compensating circuits 68 in the printed circuit board of the connection panel 40 to compensate for the effect of the electronics with added advanced features placed on the plate 40 and minimize the effects thereof in the signal steps. The remaining effects are minimized through the use of high impedance connection and blocking techniques. Specifically, the active circuitry with advanced features coupled with the interfaces of the present invention with the wiring that connects the hardware signal patch in two methods. First, through the high impedance connections that "hit" the set of communication circuits, or through "blocking", or serial devices that are located within the path of the network. The high impedance connections also minimize the effect of the electronics with advanced features in the performance of the signal step. In addition, the selection of blocking capacitor values as shown in table 2 minimizes the effect on return loss and attenuation that the components can create.

The present invention can be configured as a single unit with full or partial bias, or a multiple unit including option plates of additional functionality and connectors as shown in figures 4 to 6. The present invention can be a device of a single port or multiple ports, including 1 to 120 ports per unit, exceeding currently available levels of 24 to 48 ports per unit, and providing a connector point for modular connectors. The printed circuit board of the connection panel is formed to occupy approximately three rack units (3U, or approximately 3 x 1.75") and maintain the density of the ports in the end panel as cable runs can now be part of the same panel As constructed, the present invention may include a 3U panel having space for cable laying and active circuitry between telecommunication circuits that are arranged above and below the cable run and active circuit set, including 1 to 120 ports per unit, so that density is maintained The present invention also provides at least one modular connector as an output, typically an RJ45 connector, which interacts with a modular plug The above combinations allow for the construction of a panel connection that includes cable routing, active circuitry within a 3U panel size, and specifically, the ability to obtain r at least 48 ports and associated cable routing in a 3U panel size. The present invention described above provides communication hardware that is capable of at least performance levels of category 3, 5, 5e, 6 and / or higher (e.g., 6e or 7) and equivalents as required, and also maintains performance. category transmission as defined in the transmission requirements IEEE802.3 and TIA-568B. The present invention can be wired to the wiring plant and thus, it can also be used to collect and provide information about the location of attached devices via a data management feature. This can be particularly important for services such as 911 emergency requests where it is critical to determine the location of the caller, especially when in a VolP network. Although an embodiment has been chosen to illustrate the invention, those skilled in the art will understand that various changes and modifications may be made thereto without departing from the scope of the invention as defined in the appended claims.

Claims (25)

REVIVALS

1. - A connection panel with advanced compensation features that can include removable or fixed modular electronic components, wherein the connection panel provides improved performance levels, said connection panel comprising: a printed circuit board of the connection panel in multiple layers comprising a plurality of layers; a communication circuit arranged in at least one layer of said plurality and electrically coupled between an insulation displacement connector (IDC) at one end of PD / User and an RJ45 connector at one end of the telecommunication equipment; at least one of a removable or fixed modular electronic component electrically coupled to said communication circuit, said component composed of at least one active circuit arranged in at least a second layer of said plurality to provide an advanced feature; and a plurality of compensating circuit elements arranged in at least one layer of said plurality to establish an inductive compensation and coupling capacitance with said active circuit to substantially minimize at least one adverse effect resulting from said active circuit and thus providing levels of improved performance.

2. - A connection panel with advanced compensation feature that can include detachable or fixed modular electronic components according to claim 1, wherein said communication circuit includes at least one of a trail carrying signal or a route assignment circuit of telecommunication.

3. A connection panel with advanced compensation feature that can include detachable or fixed modular electronic components according to claim 1, wherein said advanced feature includes at least one of a device detection feature, logical operation characteristic and energy insertion characteristic.

4. A connection panel with advanced compensation feature that can include detachable or fixed modular electronic components according to claim 1, wherein said active circuit includes at least one of an active circuit secondary route assignment layer, active circuit component, IDC component, plug-in connector and primary path assignment for active circuit set.

5. A connection panel with advanced compensation feature that can include detachable or fixed modular electronic components according to claim 4, wherein said active circuit component includes at least one DC blocking capacitor.

6. - A connection panel with advanced compensation feature that can include detachable or fixed modular electronic components according to claim 4, wherein said active circuit component includes at least one transformer with taps in the center.

7. A connection panel with advanced compensation feature that can include detachable or fixed modular electronic components according to claim 4, wherein said active circuit component includes at least one operational amplifier.

8. A connection panel with advanced compensation feature that can include removable or fixed modular electronic components according to claim 1, wherein said plurality of compensating circuit elements arranged on said at least one layer includes at least one of an inductive, capacitive and reactive element to establish said compensating coupling with said active circuit.

9. A connection panel with advanced compensation feature that can include removable or fixed modular electronic components according to claim 8, wherein said inductive, capacitive and reactive element is composed of a signal-carrying trace.

10. A connection panel with advanced compensation feature that can include removable or fixed modular electronic components in accordance with claim 8, wherein said inductive, capacitive and reactive element is composed of a capacitor circuit of conductive aluminum foil. 1.

A connection panel with advanced compensation feature that can include removable or fixed modular electronic components according to claim 1, wherein said adverse effect includes at least one of an increased noise level, reflection, inductive coupling Adverse and adverse capacitive coupling.

12. A connection panel with advanced compensation feature that can include removable or fixed modular electronic components according to claim 1, wherein said improved performance levels include at least one of category 3, 5 performance levels, 5e, 6, 6e and 7 and above.

13. A connection panel with advanced compensation feature that can include removable or fixed modular electronic components according to claim 1, wherein said printed circuit board of the multilayer connection panel further comprises a panel size 3U having at least 48 ports:

14. A connection panel with advanced compensation feature that can include removable or fixed modular electronic components according to claim 1, wherein said printed circuit board of the multilayer connection panel further consists of a panel that has at least 48 ports and at least one that has a height dimension of 1 U, 2U, and 3U.

15. A connection panel with advanced compensation feature that can include removable or fixed modular electronic components according to claim 1, wherein said printed circuit board of the multilayer connection panel further comprises a cable laying mechanism .

16. A connection panel with advanced compensation feature that can include removable or fixed modular electronic components according to claim 1, wherein said printed circuit board of the multilayer connection panel further comprises said active circuit and mechanism of laying of cables arranged adjacent to and between said communication circuit on a surface of said printed circuit board of the connection panel.

17. A method for making a connection panel with advanced feature that can include detachable or fixed modular electronic components that separately or in combination are capable of providing advanced features such as device detection and power insertion, wherein the panel connection provides improved performance levels, said method comprising the steps of: assembling a printed circuit board of the connection panel in multiple layers having a plurality of layers; dispose over at least one first layer of said plurality a communication circuit, said communication circuit electrically coupled between an insulation displacement connector (IDC) at one end of PD / User and an RJ45 connector at one end of the telecommunication equipment; disposing on at least one second layer of said plurality at least one of a removable and fixed modular electronic component electrically coupled to said communication circuit, said component composed of at least one active circuit for use in providing an advanced feature; and arranging on at least one layer of said plurality a compensating circuit element for establishing a compensating capacitance and inductive coupling with said active circuit to substantially minimize at least one adverse effect resulting from said active circuit and thus provide improved performance levels.

18. A method for making a connection panel with advanced feature according to claim 17, further comprising the step of disposing on said first layer of said plurality a communication circuit that includes at least one of a trace that carries signal or a telecommunication route assignment circuit.

19. A method for making a connection panel with advanced feature according to claim 17, further comprising the step of disposing on said second layer of said plurality at least one of a removable or fixed modular electronic component that includes at least one of an active circuit secondary path allocation layer, active circuit component, IDC component, modular plug connector and primary route assignment for active circuit set.

20. A method for making a connection panel with advanced feature according to claim 19, wherein said active circuit component includes at least one DC blocking capacitor.

21. A method for making a connection panel with advanced feature according to claim 19, wherein said active circuit component includes at least one transformer with deviations in the center.

22. A method for making a connection panel with advanced feature according to claim 19, wherein said active circuit component includes at least one operational amplifier.

23. A method for making a connection panel with advanced feature according to claim 17, wherein said compensating circuit element disposed on said at least one layer includes at least one of an inductive, capacitive and reactive element for establish said compensating coupling with said active circuit.

24. - A method for making a connection panel with advanced feature according to claim 17, wherein said adverse effect includes at least one of an increased noise level, reflection, adverse inductive storing and adverse capacitive coupling.

25. A method for making a connection panel with advanced feature according to claim 17, wherein said improved performance levels include at least one of a performance level of category 3, 5, 5e, 6, 6e and 7 and above.