MXPA06008369A - Electronic component cooling system for an air-cooled chiller - Google Patents

Abstract

A chiller system 10 includes a refrigerant loop 90, the refrigerant loop 90 further including a compressor 60, an air-cooled condenser arrangement 70 and an evaporator arrangement 80 connected in a first closed refrigerant loop 90. A motor 40 is connected to the compressor 60 to drive the compressor 60, a drive 30 is connected to the motor 40 to power the motor 40 and a power/control panel 50 controls the refrigerant loop 90. The power/control panel 50 and the condenser arrangement 70 are connected in a second closed coolant loop 100. The second closed coolant loop 100 provides cooling to the enclosure 120 and/or components 115 within the enclosure 120 disposed on a chill plate 110. Condensation is substantially prevented from forming inside the enclosure 120, despite the enclosure 120 lacking a humidity control device.

Description

ELECTRONIC COMPONENT COOLING SYSTEM FOR AN AIR COOLED REFRIGERATOR BACKGROUND OF THE INVENTION The present invention relates generally to an electronic component cooling system. More specifically, the present invention relates to a cooling system for electronic power components and / or control of an air-cooled refrigerator system. The electrical components associated with the electronic activation of a cooled system generate a large amount of heat in operation. Since these components are typically housed in a compact enclosure that is substantially sealed against exposure to the elements, the heat generated within the enclosure by the electronic energy components must be dissipated to avoid damage to the components. The electronic semiconductor energy components in the shell that generate spatially large amounts of heat during operation are typically cooled using a cold plate. The cold plate is composed of a material having high thermal conductivity and includes internal channels that constitute a portion of a thermal transfer fluid circuit circulating a working fluid or cooling fluid to cool the electrical components. The working fluid flowing through the thermal transfer fluid circuit is placed in a heat exchange relationship with the cold plate channels to remove the thermal energy from the cold plate. The thermal transfer fluid circuit may be part of a separate cooling system so that the envelope dissipates the thermal energy of the cold plate. The thermal transfer fluid circuit may also be incorporated into the cooling system as part of the cooling circuit or as part of the condenser fluid circuit. The electrical components are mounted on the outside of the cold plate, with the cold plate attracting thermal energy from the electrical components by thermal conduction. The thermal energy transferred to the cold plate is then transferred by convection to the working fluid flowing in the channels of the fluid circuit. Other electrical components housed in the enclosure generate a reduced amount of thermal energy in operation so that a cold plate is not required. For these components, an additional thermal transfer fluid circuit, similar to the one described above, extends into the substantially enclosed space of the enclosure in combination with a fan operating inside the enclosure to circulate air within the enclosure to achieve heat dissipation. Nevertheless. Condensation may form inside the enclosure when the temperature of the working fluid in the thermal transfer fluid circuit is less than the dew point temperature inside the enclosure. Condensation is undesirable, as it can damage electrical components. To prevent the formation of condensation, a separate system of monitoring and temperature control is then required which prevents the temperature inside the enclosure from reaching a level that is less than the dew point temperature. Therefore, what is needed is a cooling system for electrical components located in an electrical enclosure of a cooling system that can substantially prevent the formation of condensation in the enclosure without requiring a separate temperature monitoring and control system. SUMMARY OF THE INVENTION The present invention is directed to a cooling system including a refrigerant circuit, the refrigerant circuit including a compressor driven by a motor, an air-cooled condenser arrangement having at least one coil and an evaporator arrangement connected in a first closed refrigerant circuit. An electric / electronic power control panel provides electrical power to and / or controls the operation of the refrigerant circuit. The power / control panel encloses electrical / electronic power / control components and includes a cooling system to cool the components, the cooling system being in fluid communication with the at least one coil of the air-cooled condenser arrangement. The present invention is further directed to an energy / control panel for controlling the operation of a cooling system having a refrigerant circuit, the refrigerant circuit including a compressor driven by a motor, an air-cooled condenser arrangement that has minus one coil and an evaporator arrangement connected in a first closed refrigerant circuit. The power / control panel includes a substantially closed enclosure having a plurality of components therein. The envelope is in fluid communication with the at least one coil of the air-cooled condenser arrangement. An advantage of the present invention is a reduction in the number of components, since the cooling system for the power / control panel is incorporated into the cooling system.

Another advantage of the present invention is that it substantially prevents the formation of condensation in the energy / control panel. Yet another advantage of the present invention is that it does not require a separate temperature monitoring and control system. Other features and advantages of the present invention will be apparent from the following more detailed description of the preferred embodiment, taken in conjunction with the accompanying drawings which illustrate, by way of example, the principles of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 schematically illustrates one embodiment of a cooling system that can be used with the present invention. Figure 2 illustrates schematically one embodiment of a VSD usable with the present invention. Figure 3 illustrates schematically one embodiment of an energy / control panel construction used in the present invention. Figure 4 schematically illustrates another embodiment of an energy / control panel construction used in the present invention. Figures 5-6 illustrate one embodiment of a main condenser coil of an air-cooled refrigeration system employing the present invention. Whenever ible, the same reference numbers will be used throughout the drawings to refer to the same or similar parts. DETAILED DESCRIPTION OF THE INVENTION Figure 1 generally illustrates the system configuration of the present invention. A cooling system 10 includes an AC power source 20 which supplies a combination variable speed drive (VSD) 30 and power / control panel 50, which activates a motor 40 that drives a compressor 60, as controlled by the controls placed inside the power / control panel 50. In one embodiment of the invention, all components of the VSD 30 are contained within the power / control panel 50. The AC power source 20 provides a single phase or multiple phases (e.g., three phases), fixed voltage, and frequency AC power travels to the VSD 30 of an AC power grid or distribution system that It is present in one place. The compressor 60, the condenser 70 and the evaporator 80 define a first closed refrigerant circuit 90. The compressor 60 compresses a refrigerant vapor and delivers the steam to the condenser 70 to a discharge line. The compressor 60 can be any suitable type of compressor, e.g., centrifugal compressor, reciprocating compressor, screw compressor, spiral compressor, etc. The cooling vapor delivered by the compressor 60 to the condenser 70 enters a heat exchange relationship with the air surrounding the condenser 70 and circulated through the condenser 70, and is subjected to a phase change to a cooling liquid as a result of the relationship of thermal exchange with the surrounding ambient air. The condensed liquid refrigerant from the condenser 70 flows through an expansion device (not shown) to the evaporator 80. A fluid circulated in heat exchange relationship with the evaporator 80 in the first closed refrigerant circuit 90 can then provide cooling to a space inside. Similarly, a portion of the condenser 70 and the power / control panel 50 define a second closed cooler circuit 100 that provides cooling of the components housed in the power / control panel 50. It is noted that the cooling system 10 of the present invention can use a plurality of any combination of VSDs 30, engines 40. compressors 60, condensers 70, and evaporators 80. The power / control panel 50 can include a variety of different components such as an analog to digital converter (A / D), a microprocessor, a non-volatile memory, and an interface board, to control the operation of the cooler or cooling system. The power / control panel 50 can also be used to control the operation of the VSD 30, the motor 40 and the compressor 60. The cooling system 10 includes many other features that are not shown in Figure 1. These particulars have been omitted on purpose to simplify the drawing for ease of illustration. The VSD 30 receives AC power. having a particular fixed line voltage and fixed line frequency of the AC power source 20 and providing AC power to the motor 40 at a desired voltage and desired frequency, both of which can be varied to meet particular requirements. Preferably the VSD 30 can provide AC power to the motor 40 having higher voltages and frequencies and lower voltages and frequencies than the programmed voltage and frequency of the VSD 30. The VSD 30 can have three stages: a converter stage 32, a CD link stage 34 and an inverter stage 36. The converter 32 converts the fixed line frequency, the fixed line AC power from a source of AC power into CD energy. The CD link 34 filters the DC power of the converter 32 and provides energy storage components such as capacitors and / or inductors. Finally, the inverter 36 converts the DC power of the DC link 34 into variable frequency, variable voltage AC power for the motor 40. The particular configurations of the converter 32 / in the CD ce 34 and the inverter 36 are not critical to the present invention insofar as the VSD 30 can provide appropriate output voltages and frequencies to the motor 40. For example, the converter 32 can be a diode or thyristor rectifier coupled to a CD / CD boost converter to provide a voltage of DC increased to CD link 34 in order to obtain an output voltage of VSD 30 greater than the input voltage of VSD 30. In another example, converter 32 may be a thyristor diode or rectifier supplied by an autotransformer and inductor. In another example, the converter 32 can be a boost width modulated rectifier having bipolar gate-gate transistors (KGBRs) to provide an increased DC voltage to the CD link 34 to obtain an output voltage of the VSD. greater than the input voltage to the VSD 30. In a preferred embodiment of the present invention, the VSD.30 can provide output voltages and frequencies that are at least twice the programmed voltage and frequency of the motor 40. In addition, it must be understand that the VSD 30 may incorporate different components from those shown in Figure 2, while the VSD 30 may provide the engine 40 with appropriate voltages and output frequency. The VSD 30 can prevent a large drive current from reaching the motor 40 during the starting of the motor 40. The converter 32 of the VSD 30 can provide a source 20 of AC power with energy having approximately one unit energy factor. Finally, the ability of the VSD 30 to adjust both the output voltage and the output frequency to the motor 40 allows the VSD 30 to operate in a variety of foreign and local power grids without having to alter the motor 40 or the motor. 60 compressor for different energy sources. The motor 40 is preferably an induction motor that is capable of being operated at variable speeds. The induction motor can have any suitable pole arrangement that includes two poles, four poles or six poles. The induction motor is used to drive a compressor 60. The compressor 60 has a variable output capacity which depends on the output speed of the motor 40 which drives the rotors of the compressor 60. In other words, the motor output speed 40 can control the output capacity of the compressor 60. For example, a lower output speed of the motor results in a lower output capacity of the compressor, while a higher output speed of the motor results in a higher output capacity of the compressor. the compressor. Referring again to Figure 1, the compressor 60 receives refrigerant vapor in a suction inlet and compresses the refrigerant vapor in the compressor 60. The compressor 60 then discharges the compressed steam through a discharge line. As discussed above, the output capacity of the compressor 60 is based on the operating speed of the compressor 60, whose operating speed depends on the output speed of the motor 40 activated by the VSD 30. In the first circuit 90 of closed refrigerant, the refrigerant vapor delivered by the compressor 60 to the condenser 70 enters a heat exchange relationship with the ambient air, i.e., an air-cooled condenser, and is subjected to a phase change to a refrigerant liquid as a result of the relationship of heat exchange with air. The condensed liquid refrigerant of the condenser 70 flows through an expansion device (not shown) to an evaporator 80. The liquid refrigerant in the evaporator 80 enters a heat exchange relationship with a second fluid, e.g., air or water, to reduce the temperature of the second fluid, which is then typically used to provide cooling for an interior space. The refrigerant liquid in the evaporator 80 in the first closed refrigerant circuit 90 is subjected to a phase change to a refrigerant vapor as a result of the thermal exchange ratio with the second fluid. The vapor refrigerant in the evaporator 80 leaves the evaporator 80 and returns to the compressor 60 via a suction line to complete the cycle for the first closed refrigerant circuit 90. It should be understood that any suitable configuration of the evaporator 80 can be used in the cooling system 10, provided that the appropriate phase change of the refrigerant in the evaporator 80 is obtained. To ensure that the temperature of the working fluid circulating in the second closed coolant circuit 100 is not cooled to a temperature that is lower than the ambient temperature surrounding the power / control panel 50, a portion of the condenser 70 is used. to reject the heat generated within the power / control panel 50. That is, the working fluid of the second circuit. 100 of closed coolant flowing through a plurality of coils or tubes in the condenser 70 is cooled by passing ambient air, or air that is substantially at the same temperature as the air surrounding the condenser 70 so that the temperature of the fluid of work can not be less than the ambient air temperature. Therefore, as a practical matter, the temperature of the heated working fluid can not be reduced to a temperature that is lower than the ambient air temperature that passes, and as such, no monitoring equipment is required. Referring to Figure 3, the power / control panel 50 defines a substantially closed enclosure 120 to secure the electronic power and control components to control the operation of the cooling system. The envelope 120 houses a cold plate 110, which is composed of a material having high thermal conductivity and includes internal channels 112 which constitute a portion of the second closed coolant circuit 100. The components 115 in the power / control panel 50 that generate significant amounts of heat is a very small area (high energy density), such as Power Semiconductor devices are arranged in the cold plate 110. Examples of these high energy density components include, but are not limited to, Insulated Gate Bipolar Transistors (IGBT '"s) and Silicon Controlled Rectifiers (SCR's) and diode rectifiers.The thermal energy generated by the components 115 is adsorbed by the cold plate 110, due to the conduction between the cold plate 110 and the components 115. A working fluid such as a thermal transfer fluid or cooling fluid circulating in the channels 112 of the cold plate 110 is placed in a thermal exchange ratio with the cold plate channels 112 to remove the thermal energy from the cold plate 110. The working fluid heated in the second closed refrigerant circuit 100 then returns to the condenser 70 to complete the cycle and is placed in a thermal exchange ratio with the ambient air that is passed through the condenser 70. As previously discussed, the working fluid is cooled to a temperature that is slightly higher than the ambient temperature. In addition to the cold plate 112, the envelope 120 of the power / control panel 50 removes the thermal energy from the components 125 that are disposed in the shell 120. The components 125 are generally passive devices that are physically much larger than the devices Semiconductor active energy (lower energy density) and as such do not necessarily require the improved thermal energy reduction capability provided by the cold plate 112. Examples of these lower energy density components include, but are not limited to, inductors, resistors, transformers and pads of central processing unit (CPU). To help remove thermal energy from these low energy density components 125, a portion of the second closed coolant circuit 100 extends through the envelope 120. The portion of the second closed coolant circuit 100 through which the working fluid that is slightly higher than the ambient temperature, is in a heat exchange relationship with the air 170 within the envelope 120. To improve the heat exchange between the air 170 in the envelope 120 and the portion of the second circuit 100 of refrigerant closed, a fan or fans 130 are also disposed within the enclosure 120 to circulate air 170 within the enclosure 120. Maintaining an internal enclosure temperature substantially greater than the temperature of the surrounding ambient air through the working fluid circulating through the enclosure. second circuit 100 of closed coolant which is, in effect, slightly more As the ambient air temperature is hot, the condensation is effectively prevented from forming inside the envelope 120. Stated otherwise, even when the ambient temperature surrounding the envelope 120 is nearing condensation, that is, the temperature at which a steam (water) begins to condense, the temperature of the air 170 inside the envelope 120 will always be higher than the ambient temperature, since the electronic energy / control components are heating the air within the envelope 120. Therefore, the construction of The cooling of the present invention does not require a control device to monitor or control the humidity level or temperature of the air 170 within the enclosure 120. As shown in Figure 3, the second closed coolant circuit 100 includes a cooling connection. fluid in series between the outlet side of the condenser 70 and the cold plate 110 and a winding coil 160 of wind wrapper e placed on the power / control panel 50 before returning to the input side of the capacitor 70 to complete the circuit. In other words, the second closed coolant circuit 100 extends from the outlet side of the condenser 70, to the shell 120, to the inlet side of the channels 112 of the cold plate 110, and connects the outlet side of the channels 112 from the cold plate 110 to the inlet side of the envelope air cooling coil 160, through the coil 160 and again to the return side of the condenser 70.

Figure 4 shows the second closed coolant circuit 100 having a parallel connection between the outlet side of the condenser 70 and the two portions of the power / control panel 50 (cold plate 110 and envelope air cooling coil 160) returning to the input side of capacitor 70 to complete the circuit. The second closed coolant circuit 100 extends from the outlet side of the condenser 70 to an intake manifold 140 which connects the inlet sides of both the cold plate 110 and the envelope air cooling coil 160, connecting the outlet sides of the envelope air cooling coil 160 and the cold plate 110 to a discharge manifold 150, and connects the discharge manifold 150 to the return side of the condenser 70. It should be understood that in addition to the positions dispositions of With plumbing of the second closed coolant circuit 100 in Figures 3 and 4, it is also possible for each portion of the second closed coolant circuit 100 to define closed, separate subcircuits. That is, a subcircuit could connect the capacitor 70 and the input and output sides of the envelope air cooling coil 160, and another subcircuit could connect the capacitor 70 and the input and output sides of the cold plate 110.

Figure 5 illustrates one embodiment of a heat exchanger coil assembly 200, usable with the condenser 70 and the envelope air cooling coil 160. The heat exchanger coil assembly 200 includes a plurality of tubes 210 extending along the length of the coil assembly 200 and disposed in proximity to one another. A plurality of tube connectors 220 connect the ends of a pair of the plurality of tubes 210. Each tube connector 220 has a substantially U-shape and connects an adjacent pair of tubes 210 to provide a serpentine path for the flowing fluid. through the tubes 210 and tube connectors 220 of the coil assembly 200. A tube 210 of the plurality of tubes 210 is connected to a fluid inlet 230 and another tube 210 of the plurality of tubes 210 is connected to a fluid outlet 240. The fluid inlet 230 and the fluid outlet 240 may be placed, for example, in the lower portion of the coil assembly 200, in a side portion of the coil assembly 200 or any other appropriate location in the coil assembly 200. The number of tubes 210 and their arrangement and position in the coil assembly 200 may vary depending on the requirements of a specific application. In one embodiment, a row of up to 48 substantially parallel tubes may be provided in the coil assembly 200. More preferably, the coil assembly 200 has two or more substantially parallel rows of up to 12 substantially parallel tubes. The tubes 210 are preferably made of copper, however, other suitable materials may also be used. The tubes 210 have a preselected cross-sectional shape, preferably a round or oval cross-section. During the thermal transfer process, a first thermal transfer fluid flows through the serpentine path formed by the plurality of tubes 210, and a second thermal transfer fluid flows through the tubes 210. The plurality of tubes 210 provide an interface for heat transfer between the first and second heat transfer fluids. The first thermal transfer fluid flowing through the tubes 210 is water or a cooling fluid such as ammonia, ethyl chloride, FreonCR), chlorofluorocarbons (CFCs), hydrofluorocarbons (HFCs) and other natural refrigerants. However, it should be understood that any suitable thermal transfer fluid can be used for the first thermal transfer fluid. The second heat transfer fluid is preferably air, which is either heating or cooling during the thermal transfer process depending on the particular application. However, it should be understood that other suitable heat transfer fluids can be used for the second heat transfer fluid. The air flow is typically forced, such as by a fan, but can be static. Adjacent to the tubes 210 is a plurality of fins 250. The heat transfer between the first heat transfer fluid and the second heat transfer fluid occurs as the second heat transfer fluid, which is preferably air, flows on or through of the tubes 210 and fins 250 of the coil assembly 200, while the first heat transfer fluid flows through the plurality of tubes 210. The heat exchanger coil assembly 200 has a plurality of fins 250 to improve the capabilities of thermal transfer of the heat exchanger coil assembly 200. Each fin 250 is a thin metal plate, preferably made of a high conductivity material such as copper or aluminum, and may include a hydrophilic coating. The fins 250 include a plurality of openings 260 for receiving each of the tubes 210. The tubes 210 preferably pass through the openings 260 of the fins 250 and preferably a right angle to the fins 250. The tubes and fins 250 They make intimate contact with each other to allow thermal transfer between the two. While the fins 250 and tubes may be metallurgically bonded such as by brazing or welding, the preferred embodiment of the present invention frictionally or mechanically bonds the fins and tubes such as by rolling. The fins 250 are preferably arranged and arranged in a closely spaced, substantially parallel relationship having multiple trajectories for the second heat transfer fluid, which is preferably air, to flow between the fins 250 and through the tubes 210. The assembly The coil 200 also has end plates 270 which are positioned on either side of the fins 250 to provide some structural support to the coil assembly 200 and to protect the fins 250 from damage. Preferably, all fins 250 of a single heat exchanger coil assembly 200 have the same dimensions. The dimensions of the fins 250 of a coil assembly 200 can vary from less than 2.54 cm (1 inch) to 101.60 cm (40 inches) in width and up 182. 88 cm (72 inches) in height, depending on the intended use of the heat exchanger coil assembly 200 and the number of tubes 210. The fins preferably have a minimum thickness of approximately 0.051 mm (0.002 inches), to avoid possible problems of manufacturing. However, the fins can have a very large thickness if, for example, the complete coil assembly is raised to scale from inch dimensions to meter dimensions. In a preferred embodiment, the thicknesses of the fins are approximately 0.152 mm (0.006 inches), 0.203 mm (0.008 inches), and 0.254 mm (0.010 inches). With respect to the spacing of the fins, the distances between fins is preferably not less than about 0.846 mm (1/30 inch), otherwise there may be manufacturing difficulties. However, the fin pitch can be very large if the entire coil assembly is scaled as described above. In a preferred embodiment, the fin passage may have 3,175 mm (1/8 inch) to 1,814 mm (1/14 inch). Figure 6 illustrates one embodiment of an air-cooled chiller condenser coil using the present invention. A capacitor coil 300 comprises a plurality of cooling vapor inlets 320 and cooling liquid outlets 330. The refrigerant vapor inlets 320 are typically connected to a coolant inlet manifold, which is not shown in Figure 6. Similarly, the coolant outlets 330 are typically connected by a coolant outlet manifold, which is also not shown in Figure 6. The coil illustrated in Figure 6 is in circuit such that two refrigerant inlets 320 feed each refrigerant outlet 330, but it should be understood that the refrigerant can be passed through the condenser coils in numerous different circuit patterns. During the operation of the air-cooled chiller, the superheated refrigerant enters the coil through the refrigerant vapor inlets 320, transfers heat to the ambient air of the air-cooled chiller through the coil fins 350, is subjected to change of vapor phase to liquid due to this heat transfer and then leaves the coil as subcooled liquid through the coolant outlets 330. The capacitor coil 300 illustrated in FIG.

Figure 6 can also cool the refrigerant from the second closed coolant circuit 100 of the power / control panel 50 through the circuits connected to the secondary refrigerant inlet distributor 140 and the secondary refrigerant outlet distributor 150, as previously discussed. The secondary refrigerant circuits pass through and are in a heat exchange relationship with the fins 350 that the refrigerant circuits pass through and are in a thermal exchange relationship. However, the coil is in circuit so that the refrigerant flowing through the secondary refrigerant inlet distributor 140 and the secondary refrigerant outlet distributor 150 can not flow through either the refrigerant vapor inlets 320 or outputs 330 of refrigerant vapor. In other words, the secondary refrigerant circuits of the coil are insulated from the flow of the refrigerant condensing circuits of the coil. Even though the secondary refrigerant circuits illustrated in Figure 5 are placed on the bottom of the coil itself, it should be understood that the secondary refrigerant circuits can be placed anywhere in the condenser coil. The condenser 70 is preferably cooled by air, with the first closed coolant circuit 90 and the second closed coolant circuit 100 using separate and independent circuits within the condenser 70. Preferably, the second closed-loop refrigerant circuit 100 uses the lower or lower, that is, the lower or lower coil rows, of the condenser 70. The thermal interaction between the refrigerant in the first closed-coolant circuit 90 and the work in the second closed coolant circuit 100 is minimized in the preferred arrangement. Next, the preferred arrangement again distributes to the second closed coolant circuit 100 those condenser circuits that receive the lowest air flow, and it would be more likely that they would not be able to subcool the cooling fluid in the first closed coolant circuit 90. . Finally, this construction simplifies the monitoring and quantity of working fluid in the second closed coolant circuit 100, since a fill level position can be selected that is above any of the remaining portion of the second closed coolant circuit 100. Even though the refrigerant fluid in the first closed refrigerant circuit 90 is subjected to a two phase thermal transfer cycle, this is not necessarily the case for the second closed refrigerant circuit 100. The working fluid in the second closed coolant circuit 100 can use either a single phase thermal transfer cycle or a two phase thermal transfer cycle. The second closed coolant circuit 100 preferably uses a working coolant composition of a propylene glycol-water mixture to cool the power / control panel components 115, 125. While the propylene glycol-water mixture is preferred, it should be understood that any suitable brine or cooling liquid, such as RT22 and R134a, can be used in the second closed coolant circuit 100. Desirable properties for the working fluid include: superior thermal transfer properties, low cost to produce, low toxicity and flammability and non-corrosive. Even though the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes and equivalents can be made can be replaced by elements thereof without departing from the scope of the invention. In addition, many modifications can be made to adapt a particular situation or material to the teachings of the invention without abandoning the essential scope thereof. Therefore, it is intended that the invention is not limited to the particular embodiment described as the best mode contemplated for carrying out this invention, but that the invention will include all modalities that fall within the scope of the appended claims.

Claims (16)

1. CLAIMS 1.- A cooling system comprising: a refrigerant circuit, the refrigerant circuit comprising a compressor driven by a motor, an air-cooled condenser arrangement having at least one coil and an evaporator arrangement connected in a first refrigerant circuit closed; an energy / control panel for controlling the operation of the refrigerant circuit, the energy / control panel comprising a cooling system for cooling components of the power / control panel, the cooling system being in fluid communication with the at least one coil of the air-cooled condenser arrangement.
2. 2. The cooling system according to claim 1, wherein the power / control panel defines a substantially closed enclosure.
3. 3. The cooling system according to claim 1, wherein the cooling system has a cold plate that has at least one channel.
4. 4. The cooling system according to claim 3, wherein at least one component in the energy / control panel is arranged in the cold plate.
5. 5. The cooling system according to claim 2, wherein the power / control panel includes a fan arranged in the enclosure to circulate air in the enclosure.
6. 6. The cooling system according to claim 5, wherein a portion of the cooling system extends within the enclosure and is arranged in a heat exchange relationship with the air circulated by fan,
7. 7.- The cooling system of compliance with claim 6, wherein at least one component of the power / control panel is cooled by the portion of the cooling system within the enclosure.
8. 8. The cooling system according to claim 1, wherein the first closed cooling • circuit and the cooling system are separate and independent circuits.
9. 9. The cooling system according to claim 8, wherein at least one coil of the cooling system is disposed in a lower portion of the air-cooled condenser arrangement.
10. 10. The cooling system according to claim 8, wherein the at least one coil of the cooling system is disposed in a lower portion of the condenser arrangement.
11. 11. - The cooling system according to claim 1, wherein the cooling system comprises a mixture of ethylene glycol and water.
12. 12. The cooling system according to claim 1, wherein the cooling system comprises a mixture of propylene glycol and water.
13. 13. The cooling system according to claim 1, wherein the cooling system comprises a two-phase refrigerant.
14. 14. The cooling system according to claim 13, wherein the two-phase refrigerant is R22.
15. 15. The cooling system according to claim 13, wherein the two phase refrigerant is Rl34a.
16. 16. An energy / control panel for controlling the operation of a cooling system having a refrigerant circuit, the refrigerant circuit comprising a compressor driven by a motor, an air-cooled condenser arrangement having at least one coil and an evaporator arrangement in a closed first refrigerant circuit, the energy / control panel comprising: a substantially closed envelope having a plurality of components therein; the envelope being in fluid communication with the at least one coil of the air-cooled condenser arrangement. 10 ID 0 5