MXPA05012002A - Method of controlling thermal waves in reactive multilayer joining and resulting product - Google Patents

Abstract

An embodiment of the invention includes a method of simulating a behavior of an energy distribution within a soldered or brazed assembly to predict various physical parameters of the assembly. The assembly typically includes a reactive multilayer material. The method comprises the steps of providing an energy evolution equation having an energy source term associated with a self-propagating reaction that originates within the reactive multilayer material. The method also includes the steps of discretizing the energy evolution equation, and determining the behavior of the energy distribution in the assembly by integrating the discretized energy evolution equation using other parameters associated with the assembly.

Description

METHOD FOR CONTROLLING THERMAL WAVES IN A REAGENT MULTICAPA CONNECTION AND RESULTING PRODUCT DESCRIPTION OF THE INVENTION Field of the Invention The invention is directed to methods for selecting components for a reactive connection process and their respective configurations based on simulated data to produce a connection with desired properties. The invention also addresses connections produced when implementing such methods.

BACKGROUND OF THE INVENTION Reactive multilayer connection is a particularly advantageous process for soldering or welding, brazing or welding materials. A typical multi-layer reactive connection process is illustrated schematically in Figure 1. This bonding process at room temperature is based on the interleaving under pressure of a reactive multilayer sheet 1000 between two layers of a meltable material 1001 and the two components 1002 to join, and then turn on sheet 1000, for example, using a spark 1003. A self-propagating reaction in this way starts which results in a rapid rise in the temperature of the reactive sheet 1000. The heat generated by the reaction fuses the layers 1001 of meltable material, and with cooling, joins the two components 1002. This method of tin or brazing is much faster than conventional techniques using ovens or torches. In this way, important advances in productivity can be achieved. In addition, with very localized heating, temperature sensitive components, as well as dissimilar materials such as metals and ceramics, can be bonded without thermal damage. Tin soldering or brazing using reactive sheets is fast and the heat generated by the nano-laminate is located in the connection area. Reactive sheets are particularly advantageous in applications involving temperature sensitive components or metal / ceramic bonding. Specifically, when welding or brazing is used, temperature-sensitive components can be destroyed or damaged during the process, and thermal damage to the materials can be time-consuming, costly, and expensive operations, such as subsequent annealing or heat treatments. In contrast, when the connection of the temperature-sensitive components is carried out with reactive multilayers, the bonded components are subjected to little heating and increases of short duration limited in temperature. Only the brazing layers and the surfaces of the components are heated substantially, and little thermal damage occurs, if any. In addition, the reactive connection process is fast, and results in cost-effective, strong and thermally conductive connections. Substantial commercial advantages can be achieved in this way, for example, in the assembly of fiber optic components, hermetic sealing applications, and assembly of heat sinks. Brazing is preferred for joining the maximum metal-ceramic terminal, and brazing is achieved by placing a brazing between the metal and the ceramic and inserting the entire assembly in an oven. However, with cooling, substantial differences in the coefficients of thermal expansion (CTE) of the metal and ceramic cause large thermal stresses between the metal and the ceramic. For example, when a metal-ceramic joint is cooled from brazing temperatures of ~ 700 ° C, the metallic components contract more than the ceramic components. This disparity causes thermal stresses between the metallic and ceramic components, and in this way causes disunion or delamination of these components. Consequently, the size of conventionally tin-welded or brazed metal / ceramic connections is limited to areas as small as 6.45 square centimeters (1.0 square inches). When using reactive sheets to join the metallic and ceramic components, the metallic and ceramic components do not heat up substantially. As a result, little imbalance and delamination of thermal contraction occur. In this way, the reactive connection offers advantageous techniques for obtaining strong metal / ceramic connections of large area. The reactive multilayers used in the reactive connection process are nanostructured materials that are typically manufactured by vapor deposition of hundreds of nano-graduation layers alternating between elements with large negative warming of mixtures such as Ni and Al. Several implementations of these methods are described in the following publications, all of which are incorporated herein by reference: US Patent No. 5,381,944 to Makowiecki et al., ("Makowiecki"); U.S. Patent No. 5,538,795; U.S. Patent No. 5,547,715; an article by Besnoin et al, entitled "Effect of Reagent and Product Fusion on Self-Propagation Reactions in Multilayer Sheets" published in the Journal of Applied Physics, Vol. 92 (9), pages 5474-5481 on November 1 of 2002 ("Besnoin"); an article entitled "Deposition and Characterization of a Termite CuOx / Al Reaction of Auto-Propagation in a Multilayer Sheet Geometry" published in Journal of Applied Physics, Vol. 94 (5) on September 1, 2003; U.S. Patent No. 5,381,944; US Patent Application No. 09 / 846,486 filed May 1, 2001 and entitled "Multilayer Films of Placement at Will Anywhere"; US Provisional Patent Application No. 60 / 201,292 filed on May 2, 2000 and entitled "Multilayer Films of Placement at Will Anywhere"; a chapter entitled "Self-Propagation Reactions in Multilayer Materials" published in the 1998 edition of the Thin Film Process Technology Pocket Book edited by D.A. Glocker and S.I. Shah ("Glocker"); and an article entitled "Exothermic Reactions of Self-Propagation Multilayer Nano-Graduation Materials" that was present in the Mineral, Metals and Materials Society (TMS) Procedure on Nanostructures in February 1997. Makowiecki describes that reactive multilayers will be deposited directly on one of the surfaces of the components, and the selection of alternative materials was based mainly on the heat of the corresponding reaction. The design methodology established at Makowiecki is based on the assumption that, after ignition, the reactive multilayer sheet and meltable material quickly entered thermal equilibrium. This assumption allowed the development of a simplified mythology that explains the heat of the reaction, the density and thermal capacity of the sheet, as well as the density and thermal capacity of the meltable material. This procedure, however, is generally inadequate to properly determine the proper configurations of the reactive connection, and to control the thermal transport during the reactive connection process. Subsequent developments, however, have shown that it is possible to carefully control the heat of the reaction as well as the reaction rate, and has also provided alternative means for manufacturing nanostructured multilayers. For example, it has been shown that the speeds, heating and temperatures of the reactions can be controlled by varying the thicknesses of the alternative layers. Examples of such demonstrations are described in the following publications, all of which are incorporated herein by reference: U.S. Patent No. 5,538,795; an article entitled "Synthesis of Combustion of Multilayer NiAl Systems" published in Scripta Metallurgica et Materialia, Vol. 30 (10), pages 1281-1286 in 1994; an article by Gavens et al., entitled "Effects of Intermixing on Exothermic Reactions of Self-Propagation in Nanollaminated Nanolamines of Al / Ni" published in Journal of Applied Physics, Vol. 87 (3), pages 1255-1263 on February 1 of 2000 ("Gavens"); US Patent Application No. 09 / 846,486 filed May 1, 2001; and US Provisional Patent Application No. 60 / 201,292 filed May 2, 2000 and entitled "Multilayer Films of Placement at Will Anywhere". . It has also been shown that reaction heats can be controlled by modifying the composition of the sheet, or by annealing the reactive multilayers at low temperature after their manufacture, as described in an article entitled "Effects of Intermixing on Auto Exothermic Reactions -Propagation in Nano-laminated sheets of Al / Ni "published in the Journal of Applied Physics, Vol. 87 (3), pages 1255-1263 on February 1, 2000, the entirety of which is incorporated herein by reference. Alternative methods for making nanostructured reactive multilayers include: (i) mechanical processing, which is described in US Patent No. 6,534,194 and (ii) electrochemical deposition. Although techniques for control for reaction heating, speeds and temperatures and alternative manufacturing methods are known, new design methodologies that are suitable for known and new reactive connection configurations are needed. For example, various variables that can be controlled are not explained in Makowiecki (for example, the speed and reaction temperature, the thermal conductivities of the reaction sheet, the meltable material and the components and / or the density and thermal capacity of the components ). In addition, a design methodology is needed to direct the connection using sheets obtained with new manufacturing methods, such as asylated reactive multilayers, and to improve adhesion between the sheet and the layers of meltable material or components. Accordingly, as will be described in the following, one of the main objects of the present invention is to provide means for controlling thermal transport during reactive connection, and to identify preferred configurations resulting from the application of the new methodology.

COMPENDIUM OF THE INVENTION One embodiment of the invention includes a method for simulating a behavior of an energy distribution within an assembly containing a reactive multilayer material. The method comprises the steps of, providing an energy evolution equation, the energy evolution equation includes an energy source term associated with a self-propagating reaction that originates within the reactive multilayer material, the reaction of Auto -Propagation that has a known speed and reaction heating, discretize the energy evolution equation, and determine the behavior of the energy distribution in the assembly by integrating the discretized energy evolution equation using parameters associated with the assembly. Another embodiment of the invention includes a program storage device that can be read by a machine, tangibly represents a program of instructions that can be executed by the machine to perform method steps to simulate a behavior of an energy distribution within a assembly containing a reactive multilayer material. The method comprises the steps of providing the energy evolution equation, the energy evolution equation includes a term of energy sources associated with a self-propagating reaction that originates within the reactive multilayer material, the auto reaction propagation has a known speed and reaction heating, discretize the energy evolution equation, and determine the behavior of the energy distribution in the assembly by integrating the discretized energy evolution equation using parameters associated with the assembly. A further embodiment of the invention includes a method comprising selecting a reactive multilayer material, selecting the first component and a second component for the connection using the reactive multilayer material, providing an energy evolution equation, the energy evolution equation includes an energy source term associated with a self-propagating reaction that originates within the reactive multi-layer material, the self-propagating reaction has a known speed and a reaction heating, discretize the energy evolution equation, determine a behavior of an energy distribution in the first component, the second component and the reactive multilayer material by integrating the discretized energy evolution equation using the parameters associated with at least one of the first component, the second component and the material of multilayer reactive, provide the prim The component, the second component and the multilayer reactive material having the parameters, placing the reactive multilayer material between the first component and the second component, and chemically transforming the reactive multi-layer material to connect the first component to the second component. Still another embodiment of the invention includes a method. The method comprises providing parameters associated with a first component, a second component and a reactive multilayer material. The parameters have been determined by a method comprising the steps of providing an energy evolution equation, the energy evolution equation includes a term energy source associated with a self-propagating reaction that originates within the multilayer material reactive, the self-propagating reaction has a known speed and a reaction heating, discretize the energy evolution equation, and determine a behavior of an energy distribution in the first component, the second component and the multilayer material reactive to the integrate the discretized energy evolution equation using the parameters associated with at least one of the first component, the second component and the reactive multilayer material. The method further comprises providing the first component, the second component and the reactive multi-layer material having the parameters, placing the reactive multilayer material between the first component and the second component and chemically transforming the reactive multilayer material to connect the first component to the second component. Still another embodiment of the invention includes a connection. The connection comprises a first component connected to a second component and remnant of a chemical transformation of a reactive multilayer material associated with the first component and the second component. The parameters of at least one of the first component, the second component and the reactive multi-layer material are predetermined based on a simulated behavior of an energy distribution within the first component, the second component and the reactive multilayer material. The behavior is determined by integrating a discretization of an energy evolution equation using the parameters. The energy evolution equation includes an energy source term associated with a self-propagating front that originates within the reactive multilayer material. The self-propagation front has a known speed and reaction heating. Still another embodiment of the invention includes a connection. The connection comprises a first component connected to a second component and remnants of a chemical transformation of a reactive multilayer material. The first component has a chemical composition different from the second component. Various embodiments of the invention (e.g., any of the embodiments of the invention set forth in the foregoing) may include one or more of the following aspects: the discretization of the energy evolution equation may be based on a finite difference method, a finite element method, a spectral element method, or a placement method; the multilayer reactive material can be a multilayer reactive sheet and at least part of the parameters can be associated with the reactive multilayer material; the assembly may be a reactive connection configuration comprising a first component and a second component and at least part of the parameters may be associated with the first component and the second component; the reactive multilayer material may be disposed between the first component and the second component; the reactive connection configuration may further comprise a first connection layer and a second connection layer and at least part of the parameters may be associated with the first connection layer and the second connection layer; the reactive multilayer material may be disposed between the first connection layer and the second connection layer; the first connection layer and the second connection layer can be arranged between the first component and the second component; the first component and the second component can have substantially the same chemical composition; the first component and the second component may have different chemical compositions; the first component may comprise a metal, metal alloy, bulky metallic glass, ceramic, composite or polymer and the second component comprises a metal, metal alloy, bulky metallic glass, ceramic, composite or polymer; The metal or metal alloy may include one or more of aluminum, stainless steel, titanium, copper, cobar, copper-molybdenum, molybdenum, iron and nickel; the ceramic may include one or more of silicon carbide, aluminum nitride, silicon-nitride, silicon, carbon, boron, nitride, carbide, and alumina; the first connection layer and the second connection layer can have substantially the same chemical composition; the first connection layer and the second connection layer may have different chemical compositions; the first connection layer may be one or more of solder and brazing solder and the second connection layer may be one or more of solder and brazing solder; the tin solder may be one or more of lead-tin, silver-tin, tin-bismuth, gold-tin, indium, indium-silver, indium-lead, lead, tin, zinc, gold, indium, silver and antimony; the brazing can be one or more of Incusil, Gapasil, TiCuNi, silver, titanium, copper, indium, nickel and gold; The energy evolution equation that includes the term energy source can be p- = V • q + _, where h is enthalpy, r is density, t is time, q is the thermal flow vector and Q is the velocity of energy release in the reactive multilayer material; the parameters may include at least one of length, width, thickness, density, thermal capacity, thermal conductivity, melting heating, melting temperature, reaction heating, propagation velocity, atomic weight and ignition location; determining the behavior of the energy distribution may include determining at least one of: a melting amount of at least one of the first component and the second component; a melting duration of at least one of the first component and the second component; if critical interconnections have been dampened; an amount of thermal exposure of at least one of the first component and the second component; and a temperature, a peak temperature, a temperature profile, or temperature distribution of at least one of the first component, the second component, and a reactive multilayer material; determining the behavior of the energy distribution may include determining at least one of: a fusion amount of at least one of the first connection layer and the second connection layer; a fusion duration of at least one of the first connection layer and the second connection layer; if critical interconnections have been dampened; an amount of thermal exposure of at least one of the first component and the second component; and a temperature, a peak temperature, a temperature profile, or temperature distribution of at least one of the first component, the second component, the first connection layer, the second connection layer and the reactive multi-layer material; the reactive connection configuration may further comprise a third connection layer and a fourth connection layer; each of the third connection layer and the fourth connection layer can be pre-deposited on one of the reactive multilayer material, the first component, and the second component, and at least part of the parameters can be associated with the third layer of connection and the fourth connection layer; the third connection layer and the fourth connection layer can have substantially the same chemical composition; the third connection layer and the fourth connection layer may have different chemical compositions; the third connection layer may be at least one of Incusil and Gapasil, and the fourth connection layer may be at least one of Incusil and Gapasil; selecting a first connection layer and a second connection layer for connecting the first component to the second component using the reactive multilayer material; determining may include determining the behavior of the energy distribution in the first component, the second component, the first connection layer, the second connection layer, and the reactive multilayer material by integrating the discretized energy evolution equation using associated parameters with at least one of the first connection layer and the second connection layer; provide the first connection layer and the second connection layer that has the parameters; placing the first connection layer and the second connection layer between the first component and the second component; chemically transforming can cause a transformation of the first connection layer and the second connection layer; placing the first connection layer and the second connection layer may include depositing one of the connection layers into one of the first component, the second component and the reactive multi-layer material; one of the connection layers can be a placement sheet at any place; placing may include placing the placement sheet at will anywhere between the reactive multilayer material and one of the first component and the second component; selecting a third connection layer and a fourth connection layer for connecting the first component to the second component using the reactive multilayer material; determining may include determining the behavior of the energy distribution in the first component, the second component, the first connection layer, the second connection layer, the third connection layer, the fourth connection layer, and the reactive multilayer material by integrating the discretized energy evolution equation using the parameters associated with at least one of the third connection layer and the fourth connection layer; provide a third connection layer and the fourth connection layer that has the parameters; pre-depositing each of the third connecting layer and the fourth connecting layer at least one of the first component, the second component, and the reactive multi-layer material; chemically transform can cause a transformation of the third connection layer and the fourth connection layer; provide the parameters associated with a first connection layer and a second connection layer; determining may include determining the behavior of the energy distribution in the first component, the second component, the first connection layer, the second connection layer, and the reactive multilayer material by integrating the discretized energy evolution equation using the parameters associated with at least one of the first connection layer and the second connection layer; provide the first connection layer and the second connection layer that has the parameters; placing the first connection layer and the second connection layer between the first component and the second component; chemically transforming can cause a transformation of the first connection layer and the second connection layer; a first connection layer and a second connection layer connecting the first component to the second component; the parameters of at least one of the first component, the second component, the first connection layer, the second connection layer, and the reactive multi-layer material can be predetermined based on the simulated behavior of the energy distribution within the first component, the second component, the first connection layer, the second connection layer and the reactive multi-layer material; the chemical transformation may be an ignition, a third connection layer and a fourth connection layer connecting the first component to the second component; the parameters of at least one of the first component, the second component, the first connection layer, the second connection layer, the third connection layer, the fourth connection layer, and the reactive multilayer material is predetermined based on the simulated behavior of the energy distribution within the first component, the second component, the first connection layer, the second connection layer, the third connection layer, the fourth connection layer and the reactive multilayer material. Additional objects and advantages of the invention will be set forth in part in the description that follows, and in part will be obvious from the description, or may be learned by practicing the invention. The objects and advantages of the invention will be realized and obtained by means of the elements and combinations particularly indicated in the appended claims. It will be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various embodiments of the invention and together with the description, serve to explain the principles of the invention. Figure 1 represents a schematic view of a reactive multilayer connection configuration; Figure 2 (a) represents a schematic view of a multi-layer reactive connection configuration according to one embodiment of the invention; Figure 2 (b) represents a schematic view of a multi-layer reactive connection configuration according to another embodiment of the invention; Figure 3 (a) represents a schematic view of a multi-layer reactive connection configuration according to a further embodiment of the invention; Figure 3 (b) represents a schematic view of a reactive multilayer connection configuration according to still another embodiment of the invention; Figure 4 (a) represents exemplary measured temperature profiles of the multi-layer reactive connection configuration of Figure 3 (a); Figure 4 (b) represents exemplary predicted temperature profiles of the reactive multilayer connection configuration of Figure 3 (a); Figure 5 (a) represents the predicted temperature profiles for an example of the reactive multilayer connection configuration of Figure 3 (b); Figure 5 (b) represents measured and predicted temperature profiles for an example of the reactive multilayer connection configuration of Figure 3 (b); Figure 6 represents a schematic view of a reactive multilayer connection configuration according to yet another embodiment of the invention; Figure 7 (a) represents an exemplary graphic display of a relationship between the thickness of the sheet and the reaction heating according to still another embodiment of the present invention; Figure 7 (b) represents an exemplary graphic display of a relationship between the thickness of the sheet and the front speed according to still another embodiment of the present invention; Figure 8 depicts exemplary graphics results for the multilayer reactive connection configurations of Figure 3 (b) and Figure 6; Figure 9 depicts exemplary graphics results for the multilayer reactive connection configurations of Figure 3 (b) and Figure 6; Figure 10 represents a schematic view of a reactive multilayer connection configuration according to another embodiment of the invention; Figure 11 (a) represents exemplary predicted temperature profiles of the reactive multilayer connection configuration of Figure 10; Figure 11 (b) represents an exemplary infrared-measured temperature distribution of the reactive multilayer connection configuration of Figure 10; Figure 11 (c) represents an exemplary infrared-measured temperature distribution of the reactive multilayer connection configuration of Figure 10; Figure 12 depicts exemplary graphics results for the multilayer reactive connection configuration of Figure 10; Figure 13 depicts exemplary graphics results for the multilayer reactive connection configuration of Figure 10; Figure 14 depicts exemplary graphics results for the multi-layer reactive connection configuration of Figure 10; Figure 15 represents a schematic view of a multi-layer reactive connection configuration according to a further embodiment of the invention; Figure 16 represents exemplary graphical predictions for the multi-layer reactive connection configuration of Figure 15; Figure 17 represents a schematic view of a reactive multilayer connection configuration according to still another embodiment of the invention; Figure 18 represents exemplary predicted temperature profiles of the reactive multilayer connection configuration of Figure 15; Figure 19 (a) represents exemplary predicted results of the multi-layer reactive connection configuration of Figure 15; Figure 19 (b) represents exemplary predicted results of the reactive multilayer connection configuration of Figure 15; and Figure 20 represents a schematic view of a reactive multilayer connection configuration according to yet another embodiment of the invention.

DESCRIPTION OF THE MODALITIES Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numbers will be used throughout the drawings to refer to the same or similar parts.

The embodiments of the invention include a method for simulating a behavior of an energy distribution within an assembly containing a reactive multi-layer material (eg, sheet or nano-sheet), and / or applying this method to reactive connection arrangements. In one embodiment of this invention, a computational model formulation according to one aspect of the present invention is applied to discretize, (ie, make mathematically discrete, define a set of finite or countable values, not continuous) an energy equation not stable in a computational domain (eg, including computational inputs and / or limits) that includes one or more properties of the reactive multi-layer sheet (eg, nano-sheet), the surrounding connection layers (eg, tin solder) and / or brazing) and the components. In one example, this discretization is implemented by integrating the model equation set forth herein using as input various physical dimensions and properties of one or more of the multilayer reactive sheet, the surrounding connecting layers and the components, as well as their boundary conditions of the computational domain. An example includes a two-dimensional discretization in which the domains representing the sheet, the connecting layers and the components are rectangular domains, each specified in terms of its length and thickness.

The following embodiments provide examples of such configurations, where a thermal release rate Q corresponds to a substantially flat self-propagating front that travels along the length of the reactive multilayer sheet (e.g., energy or thermal wave front produced through one or more of the multilayer reactive sheet, the surrounding connecting layers and the components when the multilayer reactive sheet is ignited). For such implementation, the entries in the computational model include: (a) the dimensions (length and thickness) of the components, the solder and / or brazing layers, and the reactive sheet, (b) the density, the thermal capacity, the atomic weight and the thermal conductivity of the components, (c) the density, thermal capacity, thermal conductivity, fusion heating, atomic weight and melting temperature of the solder and / or brazing layers, (d) the reaction heating and the propagation velocity, (e) the ignition location, (f) the density, thermal capacity, thermal conductivity, melting heating, and melting temperature of the reaction product in the multilayer reactant, and (g) thermal flow conditions and of mass in the domain boundaries. The computational solutions of the discretized model equations then provide the transient evolution of the thermal waves within the sheet, the connecting layers and the components. Known methods of descretization, numerical integration schemes and methodologies for considering various two-dimensional and three-dimensional configurations, methods of discretization and integration, sources of ignition, as well as multidimensional frontal propagation can be implemented together with the present invention. For example, the application of the model may include providing the length, width and thickness of each of a multi-layer reactive sheet (eg, nano-sheet), a first component, a second component, a first connecting layer, and a second layer of connection. Using these respective lengths, widths and thicknesses as inputs, as well as thermal and mass flow conditions over the domain boundaries, the equation set forth in the following is integrated for each of the reactive multilayer sheet, the first component, the second component, the first connection layer and the second connection layer. When they are integrated, the result is the prediction of how an energy or thermal wave front will agate in each of the reactive multilayer sheet, the first component, the second component, the first connection layer, and the second connection layer when the multilayer reactive sheet is ignited (for example, chemically transformed). When the reaction is complete and the first component is connected to the second component, the remnants (e.g., residues) of the multilayer reactive sheet may be present in one or more of the first component, the second component, the first connection layer and the second connection layer. In another aspect of this invention, any of the aforementioned predictions of the computational model formulation (e.g., the prediction of how the energy or thermal wave front behaves in each of the reactive multilayer sheet, the first component, the second component, the first connection layer, and the second connection layer) can be used to assess the magnitude and duration of various connection parameters such as the melting of the solder and / or brazing layers with the wetting of the critical interconnections , and the thermal exposure of the components. The model in this way can predict insufficient fusion (eg, transformation, tin-welding and / or brazing, lack of wetting at critical interconnections, excessively short fusion duration, or excessive thermal exposure of the components, in in which case the parameters of the reactive connection configuration can be systematically altered The model can be reapplied to the altered configuration to verify if the parameters are suitable Examples include systematic variation of the thickness of the sheet and the thicknesses of the solder layers and / or brazing, reaction heating (for example, by altering the composition or microstructure), and / or the solder-brazing material Such systematic variation of the parameters can be applied interactively until a suitable configuration is determined. someone with experience in the technique how it generates This interactive edure should be used to include other configuration parameters and iteration methods. For example, the entries in the model can be any combination of any of the physical erties of any of the materials set forth herein. The embodiments of the invention include a multidimensional computer code to simulate the reactive connection ess. The code can be executed and / or stored on a computer or any other means that can be read by apriate computer. The code can be an implementation of a transient multidimensional formulation of an energy equation that explains the erties of the self-agating reaction as well as the physical erties of the reactive sheet, the meltable materials and / or the components. The computational model formulation consistent with the present invention will be described later. The multidimensional model can be based on a specially designed mathematical formulation that combines a non-stable energy equation with a simplified description of the self-agating reaction (for example, reaction front) represented by Ó (for example, energy source term). ): p-.V.q + ß.

Equation (1) h indicates the enthalpy, p is the density, t is time, q is the thermal flow vector and Q is the rate of thermal release. The enthalpy, h refers to the temperature (eg, as described in Besnoin) T, through a detailed relationship involving the thermal capacity of the material, cp, and the latent heating, hf. In particular, the term Q represents the velocity of heat released by the self-propagating front as it travels on the reactive sheet. The latter is described in terms of a thin front that propagates in a direction normal to its surface. The propagation velocity is described using any of the measured values (for example, as described in Gavens) or calculated (for example, as described in Besnoin). Examples of measured and calculated propagation velocities are shown in Figure 7 (b) discussed in greater detail in the following. The resistance of Q in this way is obtained by combining the known reaction rate and the reaction heating for a given reactive sheet. Note that Q. is located within the front that crosses the sheet, and fades into one or more fusible materials and / or components. The propagation of the energy or heat wave (for example, the evolution of temperature) within the configuration, as well as the evolution of the melting and / or solidification of one or more fusible materials, can be determined by integrating the equation (1 ) over all the configuration. A computational model of transient finite difference of the previous formulation has been developed for this purpose. The discretization of finite difference is based on dividing the domain into computational cells of fixed grid size. The enthalpy is defined in the cell centers, while the flows are defined at the edges of the cells. The second order centered difference approximations are used to approximate the spatial derivatives. This scheme of spatial discretization results in a finite set of coupled ordinary differential equations (the ODEs) that governs the evolution of the enthalpy in the centers of the cells. The set of ODEs is integrated in time using an algorithm known as an explicit Adams Bach Ford third-order scheme. Based on the resulting solution, one can easily determine various properties of the reactive connection process, including the amount of solder solder that fuses (for example, transforms) into a specific cross section or spatial location, the corresponding melting duration, as well as the evolution of temperature inside the sheet, the layers of soldering or brazing, and the components. Several alternative spatial discretizations of arbitrary order, which includes as a spectral element, finite element, or placement approximations, as well as several integration schemes of semi-implicit, implicit or explicit time can be implemented. In the case of a one-dimensional reaction front (or plane), an equivalent stable formulation of the Equation (1) can be derived by reformulating - the equations of motion in a motion reference system that travels at the same speed as the reaction front. This alterative formulation, however, can have various disadvantages, including difficulties in specifying the variation of thermal interconnection resistance with temperature (eg, pre-reaction and / or post-reaction), in post-processing and analysis of data (for example, duration of fusion), and in comparison with experimental measures. Also note that when the interconnections between the adjacent layers do not initially join, the formulation can accommodate a thermal interconnection resistor, and a variation of the thermal interconnection resistance can be observed as the fusion occurs along these interconnections. In another example, embodiments of the invention may include using simulation results to be able to determine the degree of fusion (e.g., transformation) of meltable materials (e.g., connection materials) that occurs within the reactive connection process, as well as the duration of time over which the wetting occurs in critical interconnections. As used in this application, a critical interconnection is an interconnection that requires wetting in order to form a suitable junction in the interconnection. In most cases, a critical interconnection is one that does not join initially. The critical interconnections in arrangements can vary depending on the parts (for example, reactive sheets, fusible materials and / or components) and the configuration of the parts in the particular arrangement. Figures 2 (a) and 2 (b) represent results of the implementation of variations of the models established in the above and experiments. As shown in Figure 2 (a) one or more meltable materials 20a, 20b can be pre-deposited on one or more components 21a, 21b so that a suitable bond can be provided, prior to the chemical transformation (eg, ignition) of the sheet 22, between one or more fusible materials 20a, 20b and one or more components 21a, 21b. In this way, the critical interconnections in Figure 2 (a) are in the interconnections 23a, 23b between the sheet 22 and the fusible materials 20a, 20b, and not in the interconnections 24a, 24b between the fusible materials 20a, 20b and the components 21, 21b. For this arrangement, suitable parts (e.g., reactive foils, meltable materials, and / or components) can be selected (e.g., taking into consideration the size, shape and / or composition) and / or particularly placed so that, when the When the film 22 is reactivated, chemically transformed (eg, ignited), the heat of the reactive sheet 22 turned on may cause only a portion of the layers of meltable material 20a, 20b to melt. In other words, the heat of the activated reactive sheet 22 may not affect a complete melting of the meltable material 20a, 20b and / or may not affect a melting of the portion of the fusible material 20a, 20b that is bonded to its component 21a, 21b respective. In this arrangement, the melting of all meltable material 20a, 20b and / or the melting of meltable material 20a, 20b which binds to component 21a, 21b may be undesirable for several reasons. First, to generate sufficient heat to completely melt the meltable material 20a, 20b, a thicker and / or more energetic sheet 22 (eg, having a more powerful chemical composition) may be necessary, which may unnecessarily increase the cost of the process. Secondly, melting the fusible material 20a, 20b that can be attached to the component 21a, 21b can weaken the pre-existing strong bond at the interconnections 24a, 24b between the fusible materials 20a, 20b and the components 21a, 21b. In Figure 2 (b), the placement sheets at any location of the meltable material 25a, 25b are disposed between the components 26a, 26b and the reactive sheet 27. In this case, both interconnections of the fusible material 25a, 25b are initially disengaged, and thus both interconnections 28a, 28b, 29a, 29b of the meltable material 25a, 25b (for example, the interconnection 28a, 28b adjacent to the sheet 27). reactive and / or interconnection 29a, 29b adjacent to component 26a, 26b) can be considered critical interconnections 28a, 28b, 29a, 29b. Accordingly, for this arrangement, suitable parts (e.g., one or more reactive sheets 27, meltable materials 25a, 25b and / or components 26a, 26b) may be selected (e.g., taking into consideration the size, shape and / or composition ) and / or placed particularly so that, when the reactive sheet 27 is turned on, the heat of the reactive sheet 27 on can cause a substantially complete melting of one or more materials 25a, 25b meltable. It is understood that the provisions set forth in Figures 2 (a) and 2 (b) are not limiting, and that some of the aspects set forth herein may be combined, eliminated, altered and / or used to implement any number of suitable provisions and / or to manufacture any number of suitable products. Based on the provisions, what constitutes a critical interconnection that needs to be moistened can also vary. For example, one or more component surfaces may be untreated, or may have a treatment layer (e.g., a Ni adhesion sublayer and / or Au coating, a solder or brazing layer, or both, e.g. , so that the solder or brazing layer is deposited on the adhesion layer). In another example, a placement sheet at any place in a meltable material can be disposed between the sheet and each of the components, however, the placement sheet at will anywhere can or can not be used. In a further example, the multilayer reactive sheet may have one or more fusible layers on one or more sides of the multilayer reactive sheet. In yet another example, one or more layers of a meltable material may be provided between one or more reactive multilayers and one or more components. In yet another example, one or more reactive multilayers may be disposed between one or more components. In such a configuration, one or more reactive multilayers may be in direct contact with one or more components (for example, a particular reactive sheet may provide sufficient energy to effect fusion of one or more components). Such a process can be called reactive welding, as opposed to tin welding or reactive brazing. An example of reactive welding is described in US Patent Application No. 09 / 846,486 filed May 1, 2001 and entitled "Multilayer Films of Placement at Will Anywhere", the entirety of which is incorporated into the present for reference. In a further example, embodiments of the invention may include combining simulation results with experimental observations to determine an adequate range of conditions that can be implemented in a reactive connection method in order to produce a reactive connection with suitable connection properties. The embodiments of the invention may include any configuration and combination of any of the aspects set forth herein with respect to implementing and / or fabricating suitable reactive connections using suitable reactive connection methods. A set of embodiments may include configurations where the parts (e.g., one or more reactive sheets, meltable materials and / or components) are disposed substantially and symmetrically on a central line of reactive sheet. Another set of modalities may include configurations where the parts are arranged asymmetrically around a central line of reactive sheet. These and other modalities are described in the following. For modalities with symmetrical configurations, the thermophysical properties of any part at corresponding symmetrical locations on either side of the centerline of the sheet may be substantially identical. An example may be the reactive connection of components made of substantially the same material and / or using substantially identical layers of the meltable material. For modalities with asymmetric configurations, material properties may differ in corresponding symmetric locations on either side of the sheet. An example may include the connection of components made of dissimilar materials and / or reactive connection configurations using different layers of brazing or soldering on each side of the reactive sheet. As reflected in the results of the model and the experimental observations described in this, one of the distinguishing characteristics of the two establishments can be that for symmetrical configurations the heat can be transported symmetrically with respect to the center line of the sheet; A symmetric temperature distribution can prevail accordingly. In asymmetric configurations, the reaction heating may be transported unequally with respect to the center line of the sheet, and an asymmetric temperature field may be established accordingly. As further described herein, these features can have an impact on thermal transport during the reactive connection, and suggest new arrangements and connection configurations. The invention described herein has been applied to analyze a wide variety of symmetrical configurations, in particular, for the reactive connection of Cu components, stainless steel components, plated with Au (SS), Ti components, as well as Al plated with gold. Exemplary results obtained for Cu-Cu connections and for the connection of plated stainless steel with Au for itself and for Al plating with Au for itself are provided herein. The methods and results for Cu-Cu connections and SS-SS connections can also be applied to other materials (for example, one or more of metal, metal alloy, bulky metallic glass, ceramic, composite, polymer, aluminum, stainless steel, titanium, copper, Kovar, copper-molybdenum, molybdenum, iron, nickel, silicon carbide, aluminum nitride, silicon-nitride, silicon, carbon, boron, nitride, carbide and alumina). In one embodiment of the invention, the design model is validated by comparing predictions calculated with temperature measurements made during the reaction using infrared (IR) thermometry. The results are provided for the two configurations shown in Figures 3 (a) and 3 (b), which show the reactive connection of two Cu components 30a, 30b in Figure 3 (a) and two steel components 30c, 30d. stainless steel veneered with Au in Figure 3 (b). As shown in Figure 3 (a), the surfaces 31a, 31b of the components 30a, 30b can be pre-wetted with a layer 32a, 32b of sol-Ag weld that has a thickness of about 75 μm. The Ni-Al sheet 33 for placement at will anywhere can have a thickness of approximately 55 μm, and each side of the sheet 33 can have approximately 1 μm of Incusil 34a, 34b deposited thereon. As shown in Figure 3 (b), the placement sheets at any place of the sol-tin 32c, 32d Au-Sn can have a thickness of about 25 μm and can be disposed between the reactive sheet 33c and the components 30c , 30d of stainless steel veneered with respective Au. The Ni-Al lamina 33c for placement at will anywhere can have a thickness of approximately 70 μm, and each side of the lamina 33c can have approximately 1 μm of Incusil 34c, 34d deposited thereon. The materials and / or values described herein are exemplary only. The present invention can be applied to other materials and / or dimensions (e.g., each connecting layer and / or laying sheet at any place may be one or more of lead-tin, silver-tin, tin-bismuth, gold-tin, indium, indium-silver, indium-lead, lead, tin, zinc, gold, indium, silver, antimony, incusil, Gapasil, TiCuNi, titanium, copper and nickel). Figures 4 (a) and 4 (b) contrast the measured and predicted temperature profiles for the Cu-Cu connection configuration shown in Figure 3 (a). Figure 4 (a) illustrates the instantaneous temperature profiles measured at various times after the ignition (eg, chemical transformation) of the reactive multi-layer sheet and at substantially constant positions in the Cu-Cu connection configuration during the connection reactive of Cu components. Figure 4 (b) describes the predicted temperature profile (e.g., power distribution) at substantially the same constant positions on the Cu-Cu connection configuration during the reactive connection of the Cu components., taken here in 0 seconds, 200 milliseconds, 400 milliseconds, 630 milliseconds, 830 milliseconds, and 1030 milliseconds after the ignition of the reagent multilayer sheet. Note the close agreement between the measured and calculated peak temperatures. Also note the short duration of the reactive connection process. As can be seen in Figures 4 (a) and 4 (b) the reactive connection process is essentially complete within hundreds of milliseconds of the front pass (eg, the passage of heat or energy, usually at its peak magnitude, through several positions in one or more of the multilayer reactive sheets, the connecting layers and the components). Figure 5 (a) shows the predicted temperature profiles (eg, energy distributions) through the stainless steel connection configuration shown in Figure 3 (b). The curves are generated at the selected moments, corresponding to the moment of passage of the self-propagation front, and in 0.1 ms, 0.5 ms, 1 ms, 10 ras, 50 ms and 400 ms later. The results show that the temperature across the connection decreases very rapidly to 48 ° C in 400 ms after the passage of the front, which is comparable with the experimental temperature measurement of 47 ° C. Figure 5 (b) shows the evolution of the temperature in the stainless steel configuration shown in Figure 3 (b) at 100 microns from the interconnection between the solder layer and the stainless steel. The results (for example, energy distributions) obtained from the numerical simulations are shown(predictions) and infrared (real) measurements. The Figures (a) and 5 (b) demonstrate the substantial agreement between the model predictions and the experimental measurements, and show the rapid drop in temperature, and the limited thermal exposure of the components. The model can be applied to systematically investigate the effect of the thickness of the sheet on the wetting of the critical interconnections, on the melting of the meltable material, and / or on the thermal exposure of the components. For example, Figure 6 depicts an embodiment for the reactive connection of the components 60a, 60b of A1-6061T6 which may be first coated with a thin sub-layer 61a, 61b and then a layer 62a, 62b of Au. As shown in Figure 6, the sheets of placement at will at any Au-Sn solder tin can have a thickness of about 25 μm and can be used as the meltable material 63a, 63b. Each side of the sheet 64 may have approximately 1 μm of Incusil 65a, 65b deposited thereon. The effect of the thickness of the sheet 64 on the wetting of the critical interconnect 66a, 66b between the solder 63a, 63b and the component 60a, 60b (may or may not include one or more of the layers 61a, 61b, 62a, 62b) it can be analyzed by quantifying the length of time during which the solder 63a, 63b is locally in a molten state. For this purpose, the thickness of the sheet 64 can be varied systematically, while other parameters (for example, of the sheet 64, the layers 61a, 61b, 62a, 62b, 65a, 65b, and / or the meltable material 63a, 63b ) can be fixed. As described herein, the model inputs in the computer model formulation may include the thermophysical properties of the sheet and the components. For example, the following table describes the possible inputs such as thermal conductivity, thermal capacity and / or sheet density of A1-6061-T6, Au-Sn, Incusil-ABA, Al-NiV, and / or the stainless steel.

Other possible inputs may include the solid temperature of the Incusil (Ts = 878K), the liquid temperature of the Incusil (T_ = 988K), the heating of the Incusil fusion (H_ = 10972 J / mol), the solid temperature of the sol weld -Sn (TS = 553K), the liquid temperature of the sol-Sn solder (T? = 553K), and / or the melting heating of the Sol-Sn solder tin (H_ = 6188 J / mol). Both predicted and measured values based on the thickness of the sheet bilayer are shown in Figures 7 (a) and 7 (b). Figure 7 (a) shows how the heat of reaction can be affected by the thickness of the Al-Ni sheet for the "thick" sheets (eg RF16 having approximately 2000 bilayers) and the "thin" sheets (e.g. , RF18 which has approximately 640 bilayers). The lines represent the predicted heat of reaction given a particular bilayer thickness of the Al-Ni sheet while the circles represent the measured reaction heat of the bilayers having a particular thickness. Note that the predicted heat of reactions is substantially correlated with the measured heat of the reactions. In a further example, Figure 7 (b) represents how the front speed (speed) is dependent on the thickness of the bilayer. The line shown in Figure 7 (b) represents the forecasted frontal velocity given a particular bilayer thickness of the Al-Ni sheet while the circles represent the measured front velocity of the bilayers having a particular thickness (e.g. describes in Gavens and Besnoin). Note that the predicted speeds substantially correlate with the measured frontal velocities. Figure 8 represents predictions calculated for the melt amount of the solder layer as well as the melt duration at the critical interconnection of the solder-component solder as a function of the thickness of the sheet (e.g., Energy Distribution) . Shaded lines 810, 820 represent results that can be obtained for the reactive connection of the Al-Al components, for example, as shown in the configuration shown in Figure 3 (b), while the thick lines 830, 840 represent results that can be obtained for the reactive connection of the Au-plated stainless steel components for example, as shown in the configuration shown in Figure 6. For the Al-Al connections, the model predictions in Figure 8 indicate that when the The thickness of the sheet is smaller than about 35 μm, only the partial melting of the thick layers of about 25 μm of the tin-welding of Au-Sn can occur. Accordingly, the melting duration at the critical interconnection between the solder and the component can be about 0 ms. On the other hand, when a sheet having a thickness substantially equal to or greater than about 35 μm is used, the whole solder layer can be melted and the wetting duration of the critical interconnection (e.g. tin welding Au-Sn locally in the interconnection) can be positive. In particular, • the duration of fusion can increase as the thickness of the sheet increases. The model prediction also indicates that the minimum sheet thickness necessary to melt the thick layer of approximately 25 μm of the Au-Sn solder tinplate may be greater for the Al-Al connections than for the SS-SS connections. Furthermore, for the corresponding sheet thicknesses (for example, greater than about 20 μm), the model predicts that the melting duration of the solder layer may be longer (and that as the thickness of the sheet increases, substantially larger) for SS-SS connections than for Al-Al connections. This may be due to the fact that the thermal conductivity of stainless steel can be much smaller than that of A1-6061-T6. Consequently, the heat can be conducted at a much slower speed of the SS than the Al. These predicted results underscore the need for careful optimization of the design, configuration and / or dimensions of the reactive connection configurations (for example, the thickness of the foil), based on the properties of the self-propagating reaction and the thermophysical properties of the multilayer reactant, the meltable materials, and / or the components. In another embodiment of the invention, further numerical predictions of the model (e.g., associated with fusion of meltable material and / or wetting of critical interconnections) can be contrasted with additional experimental measurements, e.g. the reactive connections. For example, Figure 9 shows that the measured cizay resistance of the Al-Al connections and / or the SS-SS conditions may be associated with and / or be dependent on the thickness of the sheet. In particular, the sheets that are thicker than about 55 μm correspond to the RF16 family (for example, having approximately 2000 bilayers), while the sheets that are thinner of about 55 μm correspond to the RF18 family (for example which have approximately 640 bilayers). The resistance of the connection was measured using laboratory tests of tensile zisayamiento. Consistent with the predictions set forth in Figure 8, the measurements in Figure 9 indicate that successful connections can be obtained when the thickness of the reactive sheet for an Al-Al connection is approximately 35 μm, and when the thickness of the reactive sheet for an SS-SS connection it is approximately 20 μm. Specifically, Figure 9 shows that the Al-Al connections can fail when the reactive sheet is thinner of about 35 μm and / or that the SS-SS connections can fail when the thickness of the sheet is less than about 20 μm. . The measurements set forth in Figure 9 also show that the resistances of the respective connection can increase steadily with increases in the thicknesses of the respective sheets until a limit and / or peak resistance is reached. Once the peak and / or the limit is reached, the connection resistance can remain constant and / or no additional resistance can be imparted to the connection even with successive increases in the thickness of the sheet. For SS-SS connections, the limit can be reached when the sheet is thicker than approximately 42 μm, and for Al-Al connections, the peak resistance can be reached when the sheet is approximately 80 μm thick. Therefore, by using the model predictions of Figure 8 and the measured results of Figure 9, one may be able to correlate the optimum and / or maximum resistance of a particular connection with the length of time during which the solder remains in a molten state in critical interconnection. For example, for the present configurations, one may be able to conclude that the Au-Sn solder must wet the critical interconnection for approximately 0.5 ms in order to achieve an optimum and / or maximum resistance bond. The bond strength can also be affected by other parameters of the present configurations, for example, the peak temperature at the interconnection between the meltable material and the component. The predictions and / or corresponding measurements set forth herein are maintained for the Al-Al and SS-SS connections. It should be apparent to one skilled in the art how to generalize the present embodiment in a variety of other material systems. In another embodiment of this invention, the design method set forth herein may be applied to analyze asymmetric configurations (i.e., configurations where the properties of materials, such as thermal properties, may differ on different sides of the sheet). An example of such asymmetric configuration is shown in Figure 10, which illustrates the reactive connection of SiC to Ti-6-4, in which the thicknesses of the Incunsil layers that are pre-deposited on the SiC and Ti can be maintained fixed. When SiC can have a thermal conductivity much larger than Ti-6-4, the thermal profile during the reactive connection can be asymmetric with respect to the centerline of the sheet. Such asymmetry in the thermal profile through the SiC and Ti-6-4 assembly is shown in Figure 11 (a), which graphically shows that the thermal wave can diffuse faster on the SiC side than on the Ti side. . In addition, peak temperatures may be generally higher on the Ti side than on the SiC side. Similar effects (eg, faster diffusion on the SiC side than on the Ti side and / or higher peak temperature on the Ti side than on the SiC side) can be observed by IR thermometry image analysis of the SiC-Ti assembly during the reactive connection, exemplary samples are shown in Figures 11 (b) and 11 (c). Figure 11 (b) shows an IR image of the configuration in the emission of the multilayer reactive sheet, while Figure 11 (c) shows an IR image of the configuration in approximately 240 ms after the ignition. As discussed further herein, this understanding of the thermal properties of an asymmetric connection configuration can be used to design new reactive connection configurations. Returning to Figure 10, the thickness of an Incusil layer 101 that can be pre-deposited on Ti 102 can be approximately 62 μm in thickness, while the Incusil layer 103 that is pre-deposited on the SiC 104 can be approximately 100 μm in thickness . In this particular design analysis, as set forth in the following, a parametric study can first be carried out on the effect of the thicknesses of the brazing layers 105, 106 predeposited on both sides of the reactive sheet 107. For this purpose, the thicknesses of the brazing layers 105, 106 facing the SiC (ti in Figure 10) and Ti (t2 in Figure 10) can be varied independently. In the meantime, the general thickness (180 μm), the heat of reaction (1189 J / g) and the reaction speed (2.9 m / s) of the sheet 107 and the thicknesses of the adjacent layers 105, 106 can be kept fixed. The sheets used in the analysis of the SiC / Ti-6-4 connections can correspond to the RF16 family, whose properties are shown in Figures 7 (a) and 7 (b). Other entries for the design model are provided in the following table.

Other possible inputs may include the solid temperature in Incusil (Ts = 878K), and the liquid temperature of Incusil (T? = 988K), and the fusion heating of the Incusil (Hf = 10.792 J / mol). The model calculations for Figure 10 focus on the wetting of the critical interconnections, which in the present case correspond to the interconnections 108, 109 between the Incusil layers 105, 106 predeposited on the sheet 107, and the layers 101, 103 of Precused incusil on their respective components 102, 104. Specifically, for the arrangement shown in Figure 10, the reaction may be required to produce sufficient heat to melt the brazing layers 105, 106 that are predeposited onto the sheet 107, as well as to partially melt the brazing layers 101, 103 which are predeposited on Ti 102 and SiC 104. In the calculations, this phenomenon (for example, the melting of one or more brazing layers) is quantified by monitoring the peak thicknesses of the brazing layers 101, 103 fused at SiC 104 and Ti 102, respectively ts_c and tt_. The following table shows the various thicknesses ts_c, t_ ?, of the brazed melt layers 103, 101 (i.e., the brazing melt amount) for various combinations of the thicknesses ti, t2 of one or more layers 105, 106 of brazing predeposited on the sheet 107.

Figure 12 graphically shows the thickness of the brazed weld layer 101, 103 as a function of one or more brazing layers 105, 106 deposited on either side of the reactive sheet 107 for the combinations where an equal thickness of brazing 105, 106 it is deposited on either side of the reactive sheet 107 (ie, ti = t2). The shaded curve shows the amount of brazing fusion on the Ti component and the thick curve shows the melting amount of the brazing of the SiC component. Examination of the results in the foregoing table reveals that the quantity or thickness ts_c of brazing 103 which is fused to the SiC component 104 may depend on the thickness ti of the brazing layer 105 on the SiC side of the sheet 107. Specifically, ts_c may decrease as tx increases. Similarly, the amount or thickness of tt? of brazing 101 that is fused to the Ti component 102 may depend on the thickness t2 of the brazing layer 106 on the Ti side of the sheet 107, and decrease as the latter increases. This effect is represented graphically in Figure 12; where both curves (tSic and tt_) decrease as one increases the thickness of the brazing layer 105, 106 (for example, having the thickness of ti and t2) that can be predeposited on the sheet 107. This figure also shows that more brazing can be merged into the Ti component than the SiC component (tt? > tSic) -This prediction can be attributed to the fact that SiC has a much higher thermal conductivity than Ti-6-4. Combined, the present results indicate that it may be desirable to maintain the thickness of the brazing 105,106 predeposited on the sheet 107 as small as possible. The results also indicate that, for a sheet 107 having a total thickness (including layers 105, 106) of approximately 180 μm having Incusil layers 105, 106 with a thickness of about 1 μm predeposited on both sides of the sheet 107 , substantial melting of braze layers 101, 103 deposited on both components 102, 104 may occur. In this way, this configuration provides a suitable design for the connection process. Based on these results, one may be able to design the thickness of the predepositive meltable material on the reactive nanoleate, to design the connection process as well as to achieve other effects such as limiting the thermal exposure of the components. The asymmetric arrangement of Figure 10 can also be used to examine the effect of the entire thickness of the sheet tF, in tt_ and (the thickness of the brazing layer 101 melted in the titanium 102) and ts_c (the thickness of the brazing layer 103 melted in the silicon carbide 104). In view of the above results, the thicknesses ti (the thickness of the brazing layer 105 on the SiC side of the sheet 107) and t2 (the thickness of the brazing layer 106 on the Ti side of the sheet 107) it can be kept fixed, ti = t2, where for example, both ti and t2 can be equal to approximately 1 μm. As shown in Figure 13, the thickness of the sheet tF was varied between about 60 μm and about 270 μm, and the calculated values of t_? and tSic are schematized against tF. The results show that each of tt_ and tSic can increase as the thickness of the sheet tF increases. For sheet thicknesses tF less than about 100 μm, the melting amount of the brazing layers 101, 103 that are pre-deposited on the components 102, 104 can be quite small, since t__ and tSic can both fall for less than about 10. μm. on the other hand, for a sheet thickness tF greater than about 200 μm, the entire layer of Incusil 101 predeposited on Ti 103 can be melted. The present results in this way indicate that, for the configuration of Figure 10, a suitable and / or desirable film thickness to achieve the appropriate and / or desired effects may be in the range of about 150 μm to about 200 μm. A sheet thickness between about 150 μm and about 200 μm may be suitable and / or desirable because a sheet thickness can ensure sufficient wetting of the critical interconnections 108, 109 and / or prevent complete melting of the layers 101, 103 of brazing that are predeposited on the components 102, 104. Using this methodology, the thickness of the sheet can be designed to induce melting at critical interconnections 108, 109 while avoiding this effect and interconnected initially bonded. The asymmetric arrangement of Figure 10 can also be used to examine the effect of reaction heating on melting of fusible material 101, 103, 105, 106 and on wetting of critical interconnections 108, 109. As mentioned herein, the reaction heating of the reactive multilayer sheets can be controlled using a variety of means, such as by varying one or more of the stoichiometry, the rate of deposition (which affects the premix width) , and / or the thickness of the bilayer, and / or when annealing the sheet at a moderate temperature in an inert environment, as discussed in Gavens and Glocker. To illustrate the impact varying the heat of reaction may have on melting the fusible materials 101, 103, 105, 106 and / or on moistening the critical interconnections 108, 109, computer simulations were carried out with a sheet 107 having a fixed thickness tF of approximately 180 μm, and layers 105, 106 of Incusil, which were pre-deposited on sheet 107, each having a fixed thickness ti and t2 of approximately 1 μm. The frontal velocity remained fixed at approximately 2.9 m / s. With these fixed values, the reaction heating was varied in the range between about 800 J / g and about 1600 J / g. Using these inputs, the predicted values for t_i and tsic were calculated from the simulations that are schematized against the reaction heating, as shown in Figure 14. The results indicate that tt_ and / or ts_c can show a strong dependence and / or correlation by reaction heating. For example, as shown in Figure 14, when the reaction heating falls below about 900 J / g, the results predict that unimportant melting of the brazing layers 101, 103 may occur. When the reaction heating increases beyond approximately 900 J / g, the results predict that the curves for tt_ and / or ts_c can rise rapidly. In particular, when the reaction heating exceeds about 1300 J / g, the results predict that substantially all of the Incusil 101 layer predeposited on Ti 102 may be melted during the reactive connection process. These results underscore the need and / or benefits of carefully controlling or characterizing reaction heating. For example, in the present asymmetric configuration set forth in Figure 10, the reaction heating used may preferably fall in the range of about 1100 J / g to about 1300 J / g. The reaction heating can be controlled in a known manner to control the amount of ejection of the brazing material to thereby limit the thermal exposure of the components, and / or to control other related results and / or effects. In another embodiment of this invention, one or more sheets, 150, 151 for placement at any location of one or more fusible materials and / or connection (eg, solder or brazing) can be used in an asymmetric configuration. For example, Figure 15 illustrates an alternative configuration for the connection of SiC 152 and Ti 153. As illustrated in Figure 15, the sheets 150, 151 for placement anywhere on the Au-Sn solder as the material meltable The sheets 150, 151 can each have a thickness of approximately 25 μm. SiC 152 and Ti 153 can be treated in substantially the same way as any of the configurations set forth herein. For example, an Incusil layer 155 having a thickness of approximately 62 μm can be pre-deposited on the Ti 153 and / or an Incusil layer 154 having a thickness of approximately 100 μm can be pre-deposited on the SiC 152. The reactive sheets 160 can be have Incusil layers 156, 157 predeposited on either side. The Incusil layers 156, 157 predeposited on the reactive sheets 160 may have a thickness of about 1 μm. In the configuration shown in Figure 15, the sheet 160 may preferably distribute sufficient amounts of heat to completely melt the Au-Sn layers 150, 151 of placement at will anywhere. However, fusion of one or more of the Incusil brazing layers 154, 155, 156, 157 may not be necessary, since each layer 150, 151 of Au-Sn solder tin may adhere sufficiently to its layers 154, 155, 156, 157 of respective Incusil brazing irrespective of whether the brazing fuses on its own. As discussed in the following, a parametric study was carried out to determine the effect that the thickness of the sheet 160 has on the melting of the solder layers 150, 151 and / or the melting of one or more layers 154, 155 of Incusil brazing which are pre-deposited on Ti 153 and SiC 154. The thickness of the reactive sheet layer 160 was varied between about 30 μm and about 270 μm. Since the present configuration may substantially require complete melting of the sol-Sn solder 150, 151, the predicting analysis was carried out by monitoring the temperature of the weld solder at the interconnection 158, 159 of each layer 150, 151 of tin Au-Sn solder and its respective Incusil brazing layers 154, 155 that are pre-deposited on Ti 153 and SiC 152 component. For each of the configurations (e.g., where the thickness of reactive sheet layer 160 is varied) ), the time intervals were recorded during which the solder layers 150, 151 remained above their melting temperature locally at each of the interconnections 158, 159. The predicted results are shown in Figure 16, where the time interval during which the solder layers 150, 151 remained above their melting temperature locally at each of the interconnections 158, 159 is schematized against the thickness of the sheet. The predicted results demonstrate that a minimum sheet thickness of approximately 30 μm may be necessary in order to melt both layers 150, 151 of tin-Au-Sn solder (eg, the tin-solder layer of Au-Sn on the Ti side and / or the SiC side). For the sheets 160 having a thickness of less than about 30 μm, the model predicts that there can only be partial melting of one or more layers 150, 151 of tin-Au-Sn welding and therefore a lack of bonding between one or more of the layers 150, 151 of tin Au-Sn welding and one or more of the brazing layers 154, 155 of Incusil. The resistance of the reactive connections formed using the sol-Sn solder was determined experimentally, examples of which are set forth herein, and cizaya resistance measurements were compared with computational predictions. The analyzes established in the following reveal that the connection resistance can increase initially when the duration of the melting of the sol-Sn solder increases, and that the peak resistance of the connections can be obtained when the sol-Sn solder in the interconnections Critical is above its melting temperature for a duration of time that exceeds approximately 0.5 ms. Based on this work, a sheet thickness of approximately 70 μm may be needed to achieve adequate connection strength. The calculations were also used, examples of which are set forth herein, to examine possible fusion of Incusil that is predeposite on the components. The results indicate that when the thickness of the sheet is less than about 200 μm, that the brazing layers predeposited on Ti and SiC can remain below the melting temperature of the Incusil. For thicker sheets the partial melting of the Incusil in one or both of these layers 154, 155 may occur. In another embodiment of this invention, the effect of the melting duration of brazing or soldering on the strength of the resultant reactive connections has been experimentally analyzed and modeled. Experimental research that has been applied to configurations that have different lengths and widths for one or more of the sheet, solder layers and components, but with fixed thicknesses for one or more of the sheets, the solder layers, and the components. Specifically, the reactive connections between SiC and Ti-6-4 have been formed using Incusil (brazing) as the meltable material, and using AgSnSb (tin solder) as the meltable material. Both, the small area (1.27 cm x 1.27 cm) (0.5 in x 0.5 in) and the large area (10.16 cm x 10.16 cm) (4 in x 4 in) have been considered, and the resulting resistance of connections determined experimentally . In both cases, a 90 μm reactive sheet was used. The measured resistance of the connections is shown in the following table as the function of the connection area: In this case, the predictions of the model indicate that, regardless of the connection area, the melting duration of the Incusil brazing is approximately 0.28 ms, while the melting duration of the solsolb welding of AgSnSb is approximately 5.49 ms. The longest melting duration of the solder is in fact expected, since the latter has much lower melting temperature. The comparison of the prediction of the melting duration with the measured cizay resistance reveals that the larger the length and width of the configuration (ie the connection area), the longer the fusion duration necessary to achieve the strength adequate reactive connection. This is evident from the fact that with Incusil as the meltable material, the melting duration was short, and strong bonds were obtained for the small area connection but the connections failed when the same protocol was applied to a large area connection . On the other hand, with AgSnSb as the soldering material, the melting duration was longer and similar resistances were obtained for both small area and large area connections. It may be evident to someone skilled in the art how to generalize these findings in other material systems and connection areas. In an alternative embodiment of this invention, another asymmetric configuration corresponding to the reactive connection of A1-6101-T6 to A1203 is considered in Figure 17.

In particular, the configuration in Figure 17 can be used to analyze the effect of the thickness of the sheet 180 on the wetting of the critical interconnection between the sheet 180 and the solder 181, 182, particularly when quantifying the length of time during which the tin solder 181, 182 is located in a molten state. For this purpose, the thickness of the sheet 180 can be varied systematically, while the remaining parameters can be kept fixed. The model inputs include the thermophysical properties of the sheet 180, the connecting layers 181, 182, 183, 184 and the components 185, 186, as shown in the following table and in Figure 7.

Other possible inputs may include the solid temperature in Incusil (Ts = 878K), the liquid temperature of the Incusil (Ti = 988K), the heating of the Incusil melt (Hf = 10.792 J / mol), the solid temperature of the sol -Sn (TS = 494K), the liquid temperature of the sol-sol soldering (T_ = 494K), the melting heating of the sol-Ag soldering (H_ = 14200 J / mol).

In the configuration shown in Figure 17, the solder layer 181 on the component 185 of A1203 may have a thickness of approximately 100 μm, while the solder layer 182 on the component 186 of Al-6101-T6 may have a thickness of approximately 75 μm. The reactive multilayer sheet 180 may have layers 183, 184 about 1 μm thick of Incusil deposited on both sides of the sheet 180. The details of the temperature distribution during the reactive connection process are shown in Figure 18, which represents the instantaneous profiles through the connection due to the chemical transformation of a sheet 180 having a thickness of approximately 148 μm at different times. As seen in Figure 18, thermal transport can occur in an asymmetric manner on either side of the sheet 180, and thermal gradients in the solder layers 181, - 182 may be weaker on the side with the 185 component. of A1203 than on the side with component 186 of A1-6101-T6. These phenomena can be traced directly towards the disparity between the thermal diffusivity of the components 185, 186, which can be much higher for the component 186 of A1-6101-T6 than for the component 185 of A1203. The effect of the thickness of the sheet 180 is analyzed in Figures 19 (a) and 19 (b). Figure 19 (a) shows the amount of fusion in layers 181, 182 of tin solder and Figure 19 (b) illustrates the melt duration at the critical interconnections 187, 188 of the tin-solder sheet and the interconnections 189, 190 of the tin solder-component. The predictions indicate that the connection can occur for all sheet thicknesses considered, ranging from approximately 20 μm to approximately 148 μm. Note that when the thickness of the sheet 180 is less than about 60 μm, the partial melting may occur in both stages 181, 182 of soldering. For sheet thicknesses between about 60 μm and about 100 μm, complete melting of the solder layer 181 lying on the side of the component 185 of A1203 may occur, while the solder layer 182 on the side of the 186 component of Al -6101-T6 can be partially merged. For sheet 180 having a thickness greater than about 100 μm, both solder layers 181, 182 can be completely fused. In the latter regime, the results indicate that the local melting duration of the solder layers 181, 182 can increase substantially and linearly with the thickness and increase of the sheet 180. Consistent with the results in Figure 18, Figures 19 ( a) and 19 (b) also indicate that more complete and uniform fusion may exist on the side of component 185 of A1203 than on the side of component 186 of A1-6101-T6. In particular, the melting duration at the interconnection 187 of the tin-solder-sheet on the A1203 side may be approximately equal to the melting duration at the interconnection 189 of the solder-component solder also on the A1203 side, as shown in FIG. Figure 19 (b). On the other hand, these melting durations can differ substantially on the Al side, as shown in interconnections 188, 190 in Figure 19a. Combined, the results in Figures 18, 19 (a) and 19 (b) show that the thermal diffusibility of the solder and components can be critical to the duration and uniformity of the melt, and therefore to the strength of the Connection. Consequently, the design of the reactive connection applications must carefully explain these parameters. In another embodiment of this invention, a reactive connection configuration can be used that involves multiple layers of fusible material that are chemically distinct. A particular configuration is set forth in Figure 20. Figure 20 shows an asymmetric configuration in which two fusible materials 172, 173 are employed, where the meltable material 172 with higher melting temperatures Ti can be used on the side with the component 170 what. it has a lower thermal conductivity kl, while the meltable material 173 with lower melting temperature can be used on the side with the more conductive component 171 having a higher relative thermal conductivity k2. Examples of such an arrangement include the SiC and Ti connection, where a lower melting temperature brazing such as Incusil is predeposited on the more conductive SiC, while a higher melting temperature brazing such as Gapasil or TiCuNi is used in the Less conductive Ti component. Such arrangements offer the possibility of designing the thermal transport during the reaction, the chemical compatibility between the individual brazing or solder layers for the adjacent components, as well as the thermophysical properties of the reactive connection. The present embodiments can be generalized in a variety of other configurations. In various embodiments, some aspects of the invention set forth herein may be multiplied, combined and eliminated from other aspects set forth herein without departing from the true scope of the invention. In some embodiments, it is to be understood that the terms brazing, tin welding, incusing, meltable material or other similar terms may be used interchangeably. Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention described herein. It is intended that the specification and examples be considered as exemplary only, with a true scope of the invention being indicated by the following claims.

Claims (135)

1. CLAIMS 1. A method for simulating a behavior of an energy distribution within an assembly containing a reactive multilayer material, the method comprises the steps of: providing an energy evolution equation, the energy evolution equation includes a term of energy source associated with a self-propagating reaction and originating within the reactive multi-layer material, the self-propagating reaction has a known speed and reaction heating; discretize the energy evolution equation; and determine the behavior of the energy distribution in the assembly by integrating the discretized energy evolution equation using the parameters associated with the assembly. The method of claim 1, wherein the discretization of the energy evolution equation is based on a finite difference method, a finite element method, a spectral element method or a placement method. The method of claim 1, wherein the multilayer reactive material is a multilayer reactive sheet and at least some of the parameters are associated with the reactive multilayer material. 4. The method of claim 1, wherein the assembly is a reactive connection configuration comprising a first component and a second component and at least some of the parameters are associated with the first component and the second component. The method of claim 4, wherein the reactive multilayer material is disposed between the first component and the second component. The method of claim 4, wherein the reactive connection configuration further comprises a first connection layer and a second connection layer and at least some of the parameters are associated with the first connection layer and the second connection layer. . The method of claim 6, wherein the reactive multilayer material is disposed between the first connection layer and the second connection layer. The method of claim 6, wherein the first connection layer and the second connection layer are arranged between the first component and the second component. The method of claim 4, wherein the first component and the second component have substantially the same chemical composition. The method of claim 4, wherein the first component and the second component have different chemical compositions. 11. The method of claim 4, wherein the first component comprises a metal, metal alloy, bulky metallic glass, ceramic, composite, or polymer and the second component comprises a metal, metal alloy, bulky metallic glass, ceramic, composite or polymer . The method of claim 11, wherein the metal or metal alloy includes one or more of aluminum, titanium, copper, iron and nickel. The method of claim 11, wherein the ceramic includes one or more of silicon, carbon, boron, nitride, carbide and alumina. 14. The method of claim 6, wherein the first connection layer and the second connection layer have substantially the same chemical composition. 15. The method of claim 6, wherein the first connection layer and the second connection layer have different chemical compositions. The method of claim 6, wherein the first connecting layer is one or more of soldering and brazing and the second connection layer is one or more of soldering and brazing. 17. The method of claim 16, wherein the solder is one or more of lead, tin, zinc, gold, indium, silver and antimony. 18. The method of claim 16, wherein the brazing is one or more of silver, titanium, copper, indium, nickel and gold. 19. The method of claim 1, wherein the energy evolution equation that includes the energy source term is dh p- ^ V.q + ß, where h is enthalpy, p is density, t is time, q is the thermal flow vector, and Q is the energy release rate in the reactive multilayer material. 20. The method of claim 1, wherein the parameters include at least one of length, width, thickness, density, thermal capacity, thermal conductivity, melting heating, melting temperature, reaction heating, propagation velocity, atomic weight and ignition location. The method of claim 4, wherein determining the behavior of the energy distribution includes determining at least one of: a melting amount of at least one of the first component and the second component; a melting duration of at least one of the first component and the second component; if the critical interconnections have become wet; an amount of thermal exposure of at least one of the first component and the second component; and a temperature, a peak temperature, a temperature profile, or temperature distribution of at least one of the first component, the second component and the reactive multilayer material. The method of claim 6, wherein determining the behavior of the energy distribution includes determining at least one of: a melting amount of at least one of the first connecting layer and the second connecting layer; a fusion duration of at least one of the first connection layer and the second connection layer; if the critical interconnections have become wet; an amount of thermal exposure of at least one of the first component and the second component; and a temperature, a peak temperature, a temperature profile, or temperature distribution of at least one of the first component, the second component, the first connection layer, the second connection layer and the reactive multi-layer material. The method of claim 6, wherein the reactive connection configuration further comprises a third connection layer and a fourth connection layer; wherein each of the third connecting layer and the fourth connecting layer are pre-deposited on one of the reactive multilayer material, the first component, and the second component, and at least some of the parameters are associated with the third connection layer and the fourth connection layer. The method of claim 23, wherein the third connection layer and the fourth connection layer have substantially the same chemical composition. 25. The method of claim 23, wherein the third connection layer and the fourth connection layer have different chemical compositions. 26. The method of claim 23, wherein the third connection layer is at least one of Incusil, Gapasil, and the fourth connection layer is at least one of Incusil and Gapasil. 27. A program storage device that can be read by a machine, which tangibly presents a program of instructions that can be executed by the machine to perform method steps to simulate a behavior of an energy distribution within an assembly containing a reactive multilayer material, the method comprises the steps of: providing an energy evolution equation, the energy evolution equation includes an energy source term associated with a self-propagating reaction that originates within the multilayer material reactive, the self-propagating reaction has a known speed and reaction heating; discretize the energy evolution equation; and determine the behavior of the energy distribution in the assembly by integrating the discretized energy evolution equation using parameters associated with the assembly. The method of claim 27, wherein the discretization of the energy evolution equation is based on a finite difference method, a finite element method, a spectral element method or a placement method. The method of claim 27, wherein the multilayer reactive material is a multilayer reactive sheet and at least some of the parameters are associated with the reactive multilayer material. The method of claim 27, wherein the assembly is a reactive connection configuration comprising a first component and a second component and at least some of the parameters associated with the first component and the second component. 31. The method of claim 30, wherein the reactive multilayer material is disposed between the first component and the second component. The method of claim 30, wherein the reactive connection configuration 'further comprises a first connection layer and a second connection layer and at least some of the parameters are associated with the first connection layer and the second connection layer. Connection. 33. The method of claim 32, wherein the reactive multilayer material is disposed between the first connection layer and the second connection layer. 34. The method of claim 32, wherein the first connection layer and the second connection layer are arranged between the first component and the second component. 35. The method of claim 30, wherein the first component and the second component have substantially the same chemical composition. 36. The method of claim 30, wherein the first component and the second component have different chemical compositions. 37. The method of claim 30, wherein the first component comprises a metal, metal alloy, bulky metallic glass, ceramic, composite, or polymer and the second component comprises a metal, metal alloy, bulky metallic glass, ceramic, composite or polymer. 38. The method of claim 37,. where the metal or metal alloy includes one or more of aluminum, titanium, copper, iron and nickel. 39. The method of claim 37, wherein the ceramic includes one or more of silicon, carbon, boron, nitride, carbide and alumina. 40. The method of claim 32, wherein the first connection layer and the second connection layer have substantially the same chemical composition. 41. The method of claim 32, wherein the first connection layer and the second connection layer have different chemical compositions. 42. The method of claim 32, wherein the first connection layer is one or more of solder and brazing solder and the second connection layer is one or more of solder and brazing solder. 43. The method of claim 42, wherein the solder is one or more of lead, tin, zinc, gold, indium, silver and antimony. 44. The method of claim 42, wherein the brazing is one or more of silver, titanium, copper, indium, nickel and gold. 45. The method of claim 27, wherein the energy evolution equation that includes the term energy source is where h is enthalpy, p is density, t is time, q is the thermal flow vector, and Q is the energy release rate in the reactive multilayer material. 46. The method of claim 27, wherein the parameters include at least one of length, width, thickness, density, thermal capacity, thermal conductivity, melting heating, melting temperature, reaction heating, velocity of propagation, atomic weight. and ignition location. 47. The method of claim 30, wherein determining the performance of the energy distribution includes determining at least one of: a melting amount of at least one of the first component and the second component; a melting duration of at least one of the first component and the second component; if the critical interconnections have become wet; an amount of thermal exposure of at least one of the first component and the second component, and a temperature, a peak temperature, a temperature profile, or temperature distribution of at least one of the first component, the second component and the material multilayer reactive. 48. The method of claim 32, wherein determining the behavior of the energy distribution includes determining at least one of: a melting amount of at least one of the first connection layer and the second connection layer; a fusion duration of at least one of the first connection layer and the second connection layer; if the critical interconnections have become wet; an amount of thermal exposure of at least one of the first component and the second component; and a temperature, a peak temperature, a temperature profile, or temperature distribution of at least one of the first component, the second component, the first connection layer, the second connection layer and the reactive multi-layer material. 49. The method of claim 32, wherein the reactive connection configuration further comprises a third connection layer and a fourth connection layer; wherein each of the third connection layer and the fourth connection layer is pre-deposited on one of the reactive multi-layer material, the first component, and the second component, and at least some of the parameters are associated with the third component. connection layer and the fourth connection layer. 50. The method of claim 49, wherein the third connection layer and the fourth connection layer have substantially the same chemical composition. 51. The method of claim 49, wherein the third connection layer and the fourth connection layer have different chemical compositions. 52. The method of claim 23, wherein the third connection layer is at least one of Incusil and Gapasil, and the fourth connection layer is of at least one of Incusil and Gapasil. 53. A method comprising: selecting a reactive multilayer material; selecting a first component and a second component for connection using the multilayer reactive materials; providing an energy evolution equation, the energy evolution equation includes an energy source term associated with a self-propagating reaction that originates within the reactive multi-layer material, the self-propagating reaction has a known speed and a reaction heating; discretize the energy evolution equation; determining a behavior of an energy distribution in the first component, the second component, and a reactive multi-layer material by integrating the discretized energy evolution equation using parameters associated with at least one of the first component, the second component, and a reactive multilayer material; providing the first component, the second component and the reactive multilayer material having the parameters; place the reactive multilayer material between the first component and the second component; and chemically transforming the reactive multilayer material to connect the first component to the second component. 54. The method of claim 53, further comprising selecting a first connection layer and a second connection layer for connecting the first component to the second component using the multilayer reactive material, wherein the determining step includes determining the performance of the energy distribution in the first connection layer and the second connection layer by integrating the discretized energy evolution equation using parameters associated with at least one of the first connection layer and the second connection layer, providing the first layer connection and the second connection layer that has the parameters; and placing the first connection layer and the second connection layer between the first component and the second component, wherein the step of chemically transforming causes a transformation of the first connection layer and the second connection layer. 55. The method of claim 54, wherein the step of placing the first connection layer and the second connection layer includes depositing one of the connection layers on one of the first component, the second component, and a reactive multi-layer material. 56. The method of claim 54, wherein one of the connecting layers is a placement sheet at any place, where the placement step includes placing the placement sheet at will anywhere between the reactive multilayer material and one of the first component and one of the second component. 57. The method of claim 53, wherein the multilayer reactive material is a multilayer reactive sheet. 58. The method of claim 53, wherein the first component and the second component have substantially the same chemical composition. 59. The method of claim 53, wherein the first component and the second component have different chemical compositions. 60. The method of claim 53, wherein the first component comprises a metal, metal alloy, bulky metallic glass, ceramic, composite, or polymer and the second component comprises a metal, metal alloy, bulky metallic glass, ceramic, composite or polymer. 61. The method of claim 60, wherein the metal or metal alloy includes one or more of aluminum, titanium, copper, iron and nickel. 62. The method of claim 60, wherein the ceramic includes one or more of silicon, carbon, boron, nitride, carbide and alumina. 63. The method of claim 54, wherein the first connection layer and the second connection layer have substantially the same chemical composition. 64. The method of claim 54, wherein the first connection layer and the second connection layer have different chemical compositions. 65. The method of claim 54, wherein the first connection layer is one or more of solder and brazing solder and the second connection layer is one or more of solder and brazing solder. 66. The method of claim 65, wherein the solder is one or more of lead, tin, zinc, gold, indium, silver and antimony. 67. The method of claim 65, wherein the brazing is one or more of silver, titanium, copper, indium, nickel and gold. 68. The method of claim 53, wherein the energy evolution equation is where h is enthalpy, p is density, t is time, q is the thermal flow vector, and C is the rate of energy release in the reactive multilayer material. 69 The method of claim 53, wherein the parameters include at least one of length, width, thickness, density, thermal capacity, thermal conductivity, melting heating, melting temperature, reaction heating, velocity of propagation, atomic weight and location. of ignition. 70. The method of claim 53, wherein determining the behavior of the energy distribution includes determining at least one of: a melting amount of at least one of the first component and the second component; a melting duration of at least one of the first component and the second component; if the critical interconnections have become wet; an amount of thermal exposure of at least one of the first component and the second component; and a temperature, a peak temperature, a temperature profile, or temperature distribution of at least one of the first component, the second component and the reactive multilayer material. 71. The method of claim 54, wherein determining the behavior of the power distribution includes determining at least one of: a melting amount of at least one of the first connecting layer and the second connecting layer; a fusion duration of at least one of the first connection layer and the second connection layer; if the critical interconnections have become wet; an amount of thermal exposure of at least one of the first component and the second component; and a temperature, a peak temperature, a temperature profile, or a temperature distribution of at least one of the first component, the second component, the first connection layer, the second connection layer and the reactive multi-layer material. 72. The method of claim 54, further comprising selecting a third connection layer and a fourth connection layer for connecting the first component to the second component using the reactive multilayer material.; wherein the determining step includes determining its behavior of the energy distribution in the third connection layer and the fourth connection layer by integrating the discretized energy evolution equation using parameters associated with at least one of the third connection layer and the fourth connection layer, providing the third connection layer and the fourth connection layer having two parameters; predepositing each of the third connection layer and the fourth connection layer on at least one of the first component, the second component, and a reactive multi-layer material, wherein the step of chemically transforming causes a transformation of the third connection layer and the fourth connection layer. 73. The method of claim 72, wherein the third connection layer and the fourth connection layer have substantially the same chemical composition. 74. The method of claim 72, wherein the third connection layer and the fourth connection layer have different chemical compositions. 75. The method of claim 72, wherein the third connection layer is at least one of Incusil and Gapasil, and the fourth connection layer is at least one of Incusil and Gapasil. 76. A connection method comprising: providing parameters associated with a first component, a second component, and a reactive multi-layer material, the parameters have been determined by a determination method comprising the steps of: providing an evolution equation of energy, the energy evolution equation includes a power source term associated with a self-propagating reaction that originates within the reactive multi-layer material, the self-propagating reaction has a known speed and a reaction heating; discretize the energy evolution equation; and determining a behavior of an energy distribution in the first component, the second component, and the reactive multi-layer material by integrating the discretized energy evolution equation using parameters associated with at least one of the first component, the second component, and a reactive multi-layer material; providing the first component, the second component and the reactive multilayer material having the parameters; placing the reactive multilayer material between the first component and the second component; and chemically transforming the reactive multilayer material to connect the first component to the second component. 77. The method of claim 76, further comprising providing the parameters associated with a first connection layer and a second connection layer, wherein the determining step includes determining the behavior of the power distribution and the first connection layer. and the second connection layer for integrating the discretized energy evolution equation using the parameters associated with at least one of the first connection layer and the second connection layer, providing the first connection layer and the second connection layer that has the parameters; placing the first connection layer and the second connection layer between the first component and the second component, wherein the step of chemically transforming causes a transformation of the first connection layer and the second connection layer. 78. The method of claim 77, wherein the step of placing the first connection layer and the second connection layer includes depositing one of the connection layers on one of the first component, the second component, and a reactive multi-layer material. 79. The method of claim 77, wherein one of the connection layers is a placement sheet at any location, where the placement step includes placing the placement sheet at will anywhere between the reactive multi-layer material and one of the first component and the second component. 80. The method of claim 76, wherein the multilayer reactive material is a multilayer reactive sheet. 81. The method of claim 76, wherein the first component and the second component have substantially the same chemical composition. 82. The method of claim 76, wherein the first component and the second component have different chemical compositions. 83. The method of claim 76, wherein the first component comprises a metal, metal alloy, bulky metallic glass, ceramic, composite or polymer and the second component comprises a metal, metal alloy, bulky metallic glass, ceramic, composite or polymer. 84. The method of claim 83, wherein the metal or metal alloy includes one or more of aluminum, titanium, copper, iron and nickel. 85. The method of claim 83, wherein the ceramic includes one or more of silicon, carbon, boron, nitride, carbide and alumina. 86. The method of claim 77, wherein the first connection layer and the second connection layer have substantially the same chemical composition. 87. The method of claim 77, wherein the first connection layer and the second connection layer have different chemical compositions. 88. The method of claim 77, wherein the first connection layer is one or more of solder and brazing solder and the second connection layer is one or more of solder and brazing solder. 89. The method of claim 88, wherein the solder is one or more of lead, tin, zinc, gold, indium, silver and antimony. 90. The method of claim 88, wherein the brazing is one or more of silver, titanium, copper, indium, nickel and gold. 91. The method of claim 76, wherein the energy evolution equation that includes the term energy source is where h is enthalpy, p is density, t is time, q is the thermal flow vector, and O is the rate of energy release in the reactive multilayer material. 92. The method of claim 76, wherein the parameters include at least one of length, width, thickness, density, thermal capacity, thermal conductivity, melting heating, melting temperature, reaction heating, propagation velocity, atomic weight and ignition location. 93. The method of claim 76, wherein determining the behavior of the energy distribution includes determining at least one of: a melting amount of at least one of the first component and the second component; a melting duration of at least one of the first component and the second component; if the critical interconnections have become wet; an amount of thermal exposure of at least one of the first component and the second component; and a temperature, a peak temperature, a temperature profile, or temperature distribution of at least one of the first component, the second component and the reactive multilayer material. 94. The method of claim 77, wherein determining the behavior of the energy distribution includes determining at least one of: a melting amount of at least one of the first connection layer and the second connection layer; a fusion duration of at least one of the first connection layer and the second connection layer; if the critical interconnections have become wet; an amount of thermal exposure of at least one of the first component and the second component; and a temperature, a peak temperature, a temperature profile, or temperature distribution of at least one of the first component, the second component, the first connection layer, the second connection layer and the reactive multi-layer material. 95. The method of claim 77, further comprising providing the parameters associated with a third connection layer and a fourth connection layer, wherein the determining step includes determining the behavior of the energy distribution in the third connection layer. and the fourth connection layer for integrating the discretized energy evolution equation using the parameters associated with the third connection layer and the fourth connection layer, providing the third connection layer and the fourth connection layer having the parameters; placing the third connection layer and the fourth connection layer between the first component and the second component, wherein the step of chemically transforming causes a transformation of the third connection layer and the fourth connection layer. 96. The method of claim 95, wherein the third connection layer and the fourth connection layer have substantially the same chemical composition. 97. The method of claim 95, wherein the third connection layer and the fourth connection layer have different chemical compositions. 98. The method of claim 95, wherein the third connection layer is at least one of Incusil and Gapasil, and the fourth connection layer is of at least one of Incusil and Gapasil. 99. A connection, comprising: a first component connected to a second component; and remnants of a chemical transformation of a reactive multilayer material associated with the first component and the second component, wherein parameters of at least one of the first component and the second component and the multilayer reactive material are predetermined based on a simulated behavior of an energy distribution within the first component, the second component and the reactive multilayer material, where the behavior is determined by integrating a discretization of an energy evolution equation using the parameters, where the energy evolution equation includes an energy source term associated with a self-propagating front that originates within the material multilayer reactive, where the self-propagation front has a known speed and reaction heating. 100. The connection of claim 99, further comprising a first connection layer and a second connection layer connecting the first component to the second component, wherein the parameters of at least one of the first component, the second component, the first connection layer, the second connection layer, and the reactive multilayer material are predetermined based on the simulated behavior of the energy distribution within the first component, the second component, the first connection layer, the second connection layer and the reactive multilayer material. 101. The connection of claim 99, where the chemical transformation is an ignition. 102. The connection of claim 99, wherein the reactive multilayer material is a multilayer reactive sheet. 103. The connection of claim 100, wherein the first connection layer and the second connection layer are arranged between the first component and the second component. 104. The connection of claim 99, wherein the first component and the second component have substantially the same chemical composition. 105. The connection of claim 99, wherein the first component and the second component have different chemical compositions. 106. The connection of claim 99, wherein the first component comprises a metal, metal alloy, bulky metallic glass, ceramic, composite, or polymer and the second component comprises a metal, metal alloy, bulky metallic glass, ceramic, composite or polymer. 107. The connection of claim 106, wherein the metal or metal alloy includes one or more of aluminum, titanium, copper, iron and nickel. 108. The connection of claim 106, wherein the ceramic includes one or more of silicon, carbon, boron, nitride, carbide and alumina. 109. The connection of claim 100, wherein the first connection layer and the second connection layer have substantially the same chemical composition. 110. The connection of claim 100, wherein the first connection layer and the second connection layer have different chemical compositions. 111. The connection of claim 100, wherein the first connection layer is one or more of solder and brazing solder and the second connection layer is one or more of solder and brazing solder. 112. The connection of claim 111, wherein the solder is one or more of lead, tin, zinc, gold, indium, silver and antimony. 113. The connection of claim 111, wherein the brazing is one or more of silver, titanium, copper, indium, nickel and gold. 114. The connection of claim 99, where the energy evolution equation that includes the term energy source is where h is enthalpy, p is density, t is time, q is the thermal flow vector, and Q is the energy release rate in the reactive multilayer material. 115. The connection of claim 99, wherein the parameters include at least one of length, width, thickness, density, thermal capacity, thermal conductivity, melting heating, melting temperature, reaction heating, propagation velocity, atomic weight and ignition location. 116. The connection of claim 99, wherein determining the behavior of the power distribution includes determining at least one of -. a melting amount of at least one of the first component and the second component; a melting duration of at least one of the first component and the second component; if the critical interconnections have become wet; an amount of thermal exposure of at least one of the first component and the second component; and a temperature, a peak temperature, a temperature profile, or temperature distribution of at least one of the first component, the second component and the reactive multilayer material. 117. The connection of claim 100, wherein determining the behavior of the power distribution includes determining at least one of: a merging amount of at least one of the first connection layer and the second connection layer; a fusion duration of at least one of the first connection layer and the second connection layer; if the critical interconnections have become wet; an amount of thermal exposure of at least one of the first component and the second component; and a temperature, a peak temperature, a temperature profile, or temperature distribution of at least one of the first component, the second component, the first connection layer, the second connection layer and the reactive multi-layer material. 118. The connection of claim 99, further comprising a third connection layer and a fourth connection layer connecting the first component to the second component, wherein the parameters of at least one of the first component, the second component, the first connection layer, the second connection layer, the third connection layer, the fourth connection layer, and a reactive multi-layer material are predetermined based on the simulated behavior of the energy distribution within the first component, the second component, the first connection layer, second connection layer, third connection layer, fourth connection layer, and a reactive multilayer material. 119. The connection of claim 118, wherein the third connection layer and the fourth connection layer have substantially the same chemical composition. 120. The connection of claim 118, wherein the third connection layer and the fourth connection layer have different chemical compositions. 121. The connection of claim 118, wherein the third connection layer is at least one of Incusil and Gapasil, and the fourth connection layer is of at least one of Incusil and Gapasil. 122. A connection, comprising: a first component connected to a second component; and remnants of a chemical transformation of a reactive multilayer material; where the first component has a chemical composition different from the second component. 123. The connection of claim 122, further comprising a first connection layer and a second connection layer connecting the first component to the second component; wherein the first connection layer has a different chemical composition from the second connection layer. 124. The connection of claim 122, wherein the reactive multilayer material is a multilayer reactive sheet. 125. The connection of claim 123, wherein the first connection layer and the second connection layer are arranged between the first component and the second component. 126. The connection of claim 122, wherein the first component comprises a metal, metal alloy, bulky metallic glass, ceramic, composite, or polymer and the second component comprises a metal, metal alloy, bulky metallic glass, ceramic, composite or polymer. 127. The connection of claim 126, wherein the metal or metal alloy includes one or more of aluminum, titanium, copper, iron and nickel. 128. The connection of claim 126, wherein the ceramic includes one or more of silicon, carbon, boron, nitride, carbide and alumina. 129. The connection of claim 123, wherein the first connection layer is one or more of solder and brazing solder and the second connection layer is one or more of solder and brazing solder. 130. The connection of claim 129, wherein the solder is one or more of lead, tin, zinc, gold, indium, silver and antimony. 131. The connection of claim 129, wherein the brazing is one or more of silver, titanium, copper, indium, nickel and gold. 132. The connection of claim 123, further comprises a third tie layer and a fourth tie layer connecting the first component to the second component. 133. The connection of claim 132, wherein the third connection layer and the fourth connection layer have substantially the same chemical composition. 134. The connection of claim 132, wherein the third connection layer and the fourth connection layer have different chemical compositions. 135. The connection of claim 132, wherein the third connection layer is at least one of Incusil and Gapasil, and the fourth connection layer is at least one of Incusil and Gapasil.