MXPA03006070A - Process for depositing a metal coating containing nickel and boron. - Google Patents

Process for depositing a metal coating containing nickel and boron.

Info

Publication number
MXPA03006070A
MXPA03006070A MXPA03006070A MXPA03006070A MXPA03006070A MX PA03006070 A MXPA03006070 A MX PA03006070A MX PA03006070 A MXPA03006070 A MX PA03006070A MX PA03006070 A MXPA03006070 A MX PA03006070A MX PA03006070 A MXPA03006070 A MX PA03006070A
Authority
MX
Mexico
Prior art keywords
plating bath
depositing
bath
substrate
range
Prior art date
Application number
MXPA03006070A
Other languages
Spanish (es)
Inventor
Mccomas Edward
Original Assignee
Mccomas Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mccomas Technologies Ag filed Critical Mccomas Technologies Ag
Publication of MXPA03006070A publication Critical patent/MXPA03006070A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The present invention relates to a process for depositing a metal coating containing nickel and boron on a substrate, said process comprising the steps of: preparing a plating bath having a pH in the range of about 10.5 to 14 and a temperature above ambient temperature, comprising: (a) nickel ions according to a nickel concentration in the range of about 4.76 to about 5 g/l of coating bath; (b) an effective amount of a stabilizer; (c) a metal ion complexing agent in an amount effective to inhibit precipitation of said metal ions from the plating bath; (d) an effective amount of a borohydride reducing agent; and (e) optionally up to 0.25 moles of cobalt per liter of plating bath; immersing said substrate to be coated into said bath, such electrolessly depositing the coating on the substrate and optionally heat treating said metal coating for about one to about 24 hours subsequently. The process according to the present invention is characterized in that the plating bath is prepared on the basis of deionized water having a conductivity in the range of about 0.05 to about 0.1 mgr;S. Furthermore, the present invention relates to a plating bath for use in said process, and to a coated article as manufactured by means of such a process.
MXPA03006070A 2001-01-16 2002-01-16 Process for depositing a metal coating containing nickel and boron. MXPA03006070A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP01100161A EP1223232A1 (en) 2001-01-16 2001-01-16 Process for depositing a metal coating containing nickel and boron
PCT/EP2002/000404 WO2002066701A2 (en) 2001-01-16 2002-01-16 Process for depositing a metal coating containing nickel and boron

Publications (1)

Publication Number Publication Date
MXPA03006070A true MXPA03006070A (en) 2004-05-04

Family

ID=8176133

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA03006070A MXPA03006070A (en) 2001-01-16 2002-01-16 Process for depositing a metal coating containing nickel and boron.

Country Status (9)

Country Link
EP (1) EP1223232A1 (en)
JP (1) JP2004522857A (en)
AU (1) AU2002254885B2 (en)
HU (1) HUP0303994A2 (en)
IL (2) IL156656A0 (en)
MX (1) MXPA03006070A (en)
PL (1) PL362357A1 (en)
TR (1) TR200301112T2 (en)
WO (1) WO2002066701A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7344019B2 (en) 2005-07-08 2008-03-18 Fmc Technologies, Inc. Boron coated stainless steel wire belt assembly
US20230084432A1 (en) 2021-09-15 2023-03-16 Western Digital Technologies, Inc. Nickel-boron coatings for housings and enclosures

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6066406A (en) * 1998-05-08 2000-05-23 Biocontrol Technology, Inc. Coating compositions containing nickel and boron

Also Published As

Publication number Publication date
EP1223232A1 (en) 2002-07-17
TR200301112T2 (en) 2007-01-22
IL156656A (en) 2007-06-17
JP2004522857A (en) 2004-07-29
WO2002066701A2 (en) 2002-08-29
PL362357A1 (en) 2004-10-18
WO2002066701A3 (en) 2003-01-03
IL156656A0 (en) 2004-01-04
AU2002254885B2 (en) 2006-02-16
HUP0303994A2 (en) 2004-03-29

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Legal Events

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